_Khuri-Yakub.jpg)
Butrus (Pierre) Thomas Khuri-Yakub
Affiliations: | Stanford University, Palo Alto, CA |
Area:
Electrical EngnieeringWebsite:
https://profiles.stanford.edu/butrus-khuri-yakubGoogle:
"Butrus (Pierre) Thomas Khuri-Yakub"Bio:
http://acoustics.stanford.edu/khuriyakub/opencms/en/home/index.html
DOI: 10.1049/el:19760209
Mean distance: 21373.2
Cross-listing: E-Tree
Parents
Sign in to add mentor| Gordon S. Kino | grad student | 1975 | Stanford (Physics Tree) | |
| (The application of zinc oxide on silicon to surface acoustic wave devices.) | ||||
Children
Sign in to add trainee| Jung Woo Choe | grad student | 2008- | Stanford |
| John D. Fox | grad student | 1979-1985 | Stanford (Physics Tree) |
| Mark J. W. Rodwell | grad student | 1988 | Stanford (E-Tree) |
| F Levent Degertekin | grad student | 1997 | Stanford (E-Tree) |
| Hyongsok T. Soh | grad student | 1999 | Stanford (E-Tree) |
| Sean T. Hansen | grad student | 2004 | Stanford |
| Ching-Hsiang Cheng | grad student | 2005 | Stanford |
| Utkan Demirci | grad student | 2005 | Stanford |
| Baris Bayram | grad student | 2006 | Stanford |
| Xuefeng Zhuang | grad student | 2008 | Stanford |
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Chang C, Moini A, Nikoozadeh A, et al. (2014) Singulation for imaging ring arrays of capacitive micromachined ultrasonic transducers. Journal of Micromechanics and Microengineering : Structures, Devices, and Systems. 24 |
| Khuri-Yakub B(T. (2011) Capacitive micromachined ultrasonic transducers: A platform technology The Journal of the Acoustical Society of America. 130: 2425-2425 |
| Ho MC, Kupnik M, Vaithilingam S, et al. (2011) Fabrication and model validation for CMUTs operated in permanent contact mode Ieee International Ultrasonics Symposium, Ius. 1016-1019 |
| Ma TJ, Kothapalli SR, Vaithilingam S, et al. (2010) 3-D Deep Penetration Photoacoustic Imaging with a 2-D CMUT Array. Proceedings / Ieee ... Ultrasonics Symposium. Ieee Ultrasonics Symposium. 2010: 375-377 |
| Lin DS, Zhuang X, Wong SH, et al. (2010) Encapsulation of Capacitive Micromachined Ultrasonic Transducers Using Viscoelastic Polymer. Journal of Microelectromechanical Systems : a Joint Ieee and Asme Publication On Microstructures, Microactuators, Microsensors, and Microsystems. 19: 1341-1351 |
| Lin DS, Zhuang X, Wodnicki R, et al. (2010) Packaging of large and low-pitch size 2D ultrasonic transducer arrays Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 508-511 |
| Vaithilingam S, Ma TJ, Furukawa Y, et al. (2009) Three-dimensional photoacoustic imaging using a two-dimensional CMUT array. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. 56: 2411-9 |
| Wygant IO, Jamal NS, Lee HJ, et al. (2009) An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. 56: 2145-56 |
| Wygant IO, Kupnik M, Windsor JC, et al. (2009) 50 kHz capacitive micromachined ultrasonic transducers for generation of highly directional sound with parametric arrays. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. 56: 193-203 |
| Zhuang X, Wygant IO, Lin DS, et al. (2009) Wafer-bonded 2-D CMUT arrays incorporating through-wafer trench-isolated interconnects with a supporting frame. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. 56: 182-92 |