Alan Lee, Ph.D.
Affiliations: | 2005 | Stanford University, Palo Alto, CA |
Area:
materials scienceGoogle:
"Alan Lee"Mean distance: 14.28 | S | N | B | C | P |
Cross-listing: Materials Tree
Parents
Sign in to add mentorWilliam D. Nix | grad student | 2005 | Stanford | |
(Stress induced delamination methods for the study of platinum adhesion.) |
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Publications
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Lee A, Litteken CS, Dauskardt RH, et al. (2005) Comparison of the telephone cord delamination method for measuring interfacial adhesion with the four-point bending method Acta Materialia. 53: 609-616 |
Lee A, Clemens BM, Nix WD. (2004) Stress induced delamination methods for the study of adhesion of Pt thin films to Si Acta Materialia. 52: 2081-2093 |