Hei Kam, Ph.D.
Affiliations: | 2009 | University of California, Berkeley, Berkeley, CA, United States |
Area:
NanofabricationGoogle:
"Hei Kam"Mean distance: 17.34
Parents
Sign in to add mentor| Tsu-Jae King Liu | grad student | 2009 | UC Berkeley | |
| (MOSFET replacement devices for energy-efficient digital integrated circuits.) | ||||
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Publications
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| Kam H, Chen Y, Liu TJK. (2013) Reliable micro-electro-mechanical (MEM) switch design for ultra-low-power logic Ieee International Reliability Physics Symposium Proceedings. 6A.1.1-6A.1.5 |
| Nathanael R, Jeon J, Chen IR, et al. (2012) Multi-input/multi-output relay design for more compact and versatile implementation of digital logic with zero leakage International Symposium On Vlsi Technology, Systems, and Applications, Proceedings |
| Kam H, Liu TJK, Alon E. (2012) Design requirements for steeply switching logic devices Ieee Transactions On Electron Devices. 59: 326-334 |
| Kam H, Liu TJK, Stojanović V, et al. (2011) Design, optimization, and scaling of MEM relays for ultra-low-power digital logic Ieee Transactions On Electron Devices. 58: 236-250 |
| Spencer M, Chen F, Wang CC, et al. (2011) Demonstration of integrated micro-electro-mechanical relay circuits for VLSI applications Ieee Journal of Solid-State Circuits. 46: 308-320 |
| Lee D, Pott V, Kam H, et al. (2010) AFM characterization of adhesion force in micro-relays Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 232-235 |
| Nathanael R, Pott V, Kam H, et al. (2010) Four-terminal-relay body-biasing schemes for complementary logic circuits Ieee Electron Device Letters. 31: 890-892 |
| Jeon J, Pott V, Kam H, et al. (2010) Perfectly complementary relay design for digital logic applications Ieee Electron Device Letters. 31: 371-373 |
| Pott V, Kam H, Nathanael R, et al. (2010) Mechanical computing redux: Relays for integrated circuit applications Proceedings of the Ieee. 98: 2076-2094 |
| Jeon J, Pott V, Kam H, et al. (2010) Seesaw relay logic and memory circuits Journal of Microelectromechanical Systems. 19: 1012-1014 |