Parents
Sign in to add mentorRobert W. Dutton | grad student | 2001 | Stanford | |
(Coupled electromagnetic and device level investigations of metal -insulator -semiconductor interconnects.) |
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Publications
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Zhao W, Hu Q, Fu K, et al. (2020) Modeling of Carbon Nanotube-Based Differential Through-Silicon Vias in 3-D ICs Ieee Transactions On Nanotechnology. 19: 492-499 |
Wang W, Chen S, Cai J, et al. (2020) A Dual-Band Outphasing Power Amplifier Based on Noncommensurate Transmission Line Concept Ieee Transactions On Microwave Theory and Techniques. 68: 3079-3089 |
Hu Q, Zhao W, Fu K, et al. (2020) Modeling and Characterization of Differential Multibit Carbon-Nanotube Through-Silicon Vias Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 534-537 |
Fan L, Zhao W, Gan H, et al. (2020) A high-Q active substrate integrated waveguide based sensor for fully characterizing magneto-dielectric (MD) materials Sensors and Actuators a-Physical. 301: 111778 |
Guan Z, Zhao P, Lao Q, et al. (2019) Parameter Extraction for Equivalent Circuit Model of RF Devices Based on a Hybrid Optimization Method Electronics. 8: 1133 |
Chu Y, Xu K, Zhong Y, et al. (2019) Fast Microwave Through Wall Imaging Method With Inhomogeneous Background Based on Levenberg–Marquardt Algorithm Ieee Transactions On Microwave Theory and Techniques. 67: 1138-1147 |
Wu L, Chen X, Wang G, et al. (2019) Dual-frequency piezoelectric micromachined ultrasonic transducers Applied Physics Letters. 115: 23501 |
Cheng Z, Zhao W, Wang D, et al. (2019) Modelling and delay analysis of on-chip differential carbon nanotube interconnects Micro & Nano Letters. 14: 505-510 |
Pan J, Fu K, Liu Q, et al. (2019) Modelling of crosstalk in differential through silicon vias for three-dimensional integrated circuits Iet Microwaves Antennas & Propagation. 13: 1529-1535 |
Zhang Y, Zhao W, Liu Q, et al. (2019) Novel electromagnetic bandgap structure for wideband suppression of simultaneous switching noise Electronics Letters. 55: 1243-1245 |