Fei Ren, Ph.D.
Affiliations: | 2006 | University of California, Los Angeles, Los Angeles, CA |
Area:
3D IC packaging and joule heating, metal-silicon interfaces, electromigration, pb-free solder jointsGoogle:
"Fei Ren"Parents
Sign in to add mentor| King-ning Tu | grad student | 2006 | UCLA | |
| (Polarity effect of electromigration on mechanical properties of lead -free solder joints.) | ||||
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Publications
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| Nah JW, Ren F, PaiK KW, et al. (2006) Effect of electromigration on mechanical shear behavior of flip chip solder joints Journal of Materials Research. 21: 698-702 |
| Ren F, Nah J, Tu KN, et al. (2006) Electromigration induced ductile-to-brittle transition in lead-free solder joints Applied Physics Letters. 89: 141914 |
| Nah JW, Ren F, Tu K, et al. (2006) Electromigration in Pb-free flip chip solder joints on flexible substrates Journal of Applied Physics. 99: 23520 |
| Zhang X, Ren F, Goorsky MS, et al. (2006) Study of the initial stage of electroless Ni deposition on Si (100) substrates in aqueous alkaline solution Surface and Coatings Technology. 201: 2724-2732 |
| Xu L, Pang JHL, Ren F, et al. (2006) Electromigration Effect on Intermetallic Growth and Young's Modulus in SAC Solder Joint Journal of Electronic Materials. 35: 2116-2125 |
| Yan MY, Suh JO, Ren F, et al. (2005) Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects Applied Physics Letters. 87: 211103 |