Alyssa Toda

Affiliations: 
Johns Hopkins University, Baltimore, MD 
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"Alyssa Toda"
Mean distance: 14.3 (cluster 11)
 
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Publications

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Toda AM, Huganir RL. (2015) Regulation of AMPA receptor phosphorylation by the neuropeptide PACAP38. Proceedings of the National Academy of Sciences of the United States of America. 112: 6712-7
Zhu QS, Toda A, Zhang Y, et al. (2014) Void-free copper filling of through silicon via by periodic pulse reverse electrodeposition Journal of the Electrochemical Society. 161: D263-D268
Toda A, Chivavibul P, Enoki M. (2013) Effects of plating conditions on electroless Ni-Co-P coating prepared from lactate-citrate-ammonia solution Materials Transactions. 54: 337-343
Yang Z, Toda A, Zhang Y, et al. (2013) An interventional flexible microneedle with three-electrode system on the capillary for continuous glucose monitoring and drug delivery 2013 Transducers and Eurosensors Xxvii: the 17th International Conference On Solid-State Sensors, Actuators and Microsystems, Transducers and Eurosensors 2013. 2106-2109
Zhang Y, Zhu QS, Itoh T, et al. (2013) High-resolution wet etching technology of thick electroless nickel alloy film for MEMS devices and packaging Proceedings - 2013 14th International Conference On Electronic Packaging Technology, Icept 2013. 396-399
Zhu QS, Toda A, Zhang Y, et al. (2013) Periodic pulse reverse copper filling for void-free through-via filling Proceedings - 2013 14th International Conference On Electronic Packaging Technology, Icept 2013. 284-287
Zhu QS, Toda A, Zhang Y, et al. (2013) Micro-fabrication of flexible coils with copper filled through polymer via structures Journal of Physics: Conference Series. 476
Uchiyama S, Yang ZQ, Toda A, et al. (2013) Novel MEMS-based fabrication technology of micro solenoid-type inductor Journal of Micromechanics and Microengineering. 23
Zhu QS, Toda A, Zhang Y, et al. (2013) High-speed copper filling within high aspect ratio through holes in polymer substrates International Journal of Electrochemical Science. 8: 10568-10577
Zhang Y, Toda A, Okada H, et al. (2012) New wafer-scale MEMS fabrication of 3D silicon/metal cantilever array sensor Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 297-300
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