Yoshio Tsukada

Affiliations: 
Pathology New York State University, New York, NY, United States 
Google:
"Yoshio Tsukada"
Mean distance: 19.07 (cluster 24)
 
SNBCP
BETA: Related publications

Publications

You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect.

Hatanaka Y, Inoue K, Oikawa M, et al. (2015) Histone chaperone CAF-1 mediates repressive histone modifications to protect preimplantation mouse embryos from endogenous retrotransposons. Proceedings of the National Academy of Sciences of the United States of America
Tsukada Y, Akiyama T, Nakayama KI. (2015) Maternal TET3 is dispensable for embryonic development but is required for neonatal growth. Scientific Reports. 5: 15876
Miyake T, Ihara S, Miyake T, et al. (2014) Prevention of neointimal formation after angioplasty using nuclear factor-κB decoy oligodeoxynucleotide-coated balloon catheter in rabbit model. Circulation. Cardiovascular Interventions. 7: 787-96
Ono Y, Satou M, Ikegami Y, et al. (2013) Activation intervals for a helicopter emergency medical service in Japan. Air Medical Journal. 32: 346-9
Suzuki T, Ozasa H, Itoh Y, et al. (2013) Identification of the KDM2/7 histone lysine demethylase subfamily inhibitor and its antiproliferative activity. Journal of Medicinal Chemistry. 56: 7222-31
Tsukada Y. (2013) Substrate technology Advanced Flip Chip Packaging. 263-339
Tsukada Y. (2013) Reliability of flip chip package-thermal stress on flip chip joint Journal of Japan Institute of Electronics Packaging. 16: 438-442
Yamamoto T, Itoh T, Sakane M, et al. (2012) Creep-fatigue life of Sn-8Zn-3Bi solder under multiaxial loading International Journal of Fatigue. 43: 235-241
Shimizu H, Saitoh T, Ota F, et al. (2011) Pure red cell aplasia induced only by intravenous administration of recombinant human erythropoietin. Acta Haematologica. 126: 114-8
Lee K, Kim KS, Tsukada Y, et al. (2011) Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/Cu ball joints Journal of Materials Research. 26: 467-474
See more...