Bahgat Sammakia

Affiliations: 
Mechanical Engineering State University of New York at Binghamton, Vestal, NY, United States 
Area:
Mechanical Engineering
Website:
https://www.binghamton.edu/mechanical-engineering/people/profile.html?id=bahgat
Google:
"Bahgat Sammakia"
Bio:

DOI: 10.1016/S0017-9310(83)80045-3
DOI: 10.1029/JC088iC05p02935

Parents

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Benjamin Isaac Gebhart grad student 1982 SUNY Buffalo
 (Transient Natural and Mixed Convection Flows and Transport Adjacent to an Ice Surface Melting in Saline Water)
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Publications

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Khalili S, Rangarajan S, Gektin V, et al. (2020) An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads Journal of Electronic Packaging. 142
Hadad Y, Fallahtafti N, Choobineh L, et al. (2020) Performance Analysis and Shape Optimization of an Impingement Microchannel Cold Plate Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 1304-1319
Hadad Y, Rangararajan S, Nemati K, et al. (2020) Performance analysis and shape optimization of a water-cooled impingement micro-channel heat sink including manifolds International Journal of Thermal Sciences. 148: 106145
Ramakrishnan B, Hadad Y, Alkharabsheh S, et al. (2019) Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers Journal of Electronic Packaging. 141: 41005
Khalili S, Alissa H, Nemati K, et al. (2019) Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design Journal of Electronic Packaging. 141: 31004
Hadad Y, Ramakrishnan B, Pejman R, et al. (2019) Three-objective shape optimization and parametric study of a micro-channel heat sink with discrete non-uniform heat flux boundary conditions Applied Thermal Engineering. 150: 720-737
Khalili S, Tradat MI, Nemati K, et al. (2018) Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles Journal of Electronic Packaging. 140: 10907
Nemati K, Alissa HA, Murray BT, et al. (2017) Experimental Failure Analysis of a Rear Door Heat Exchanger With Localized Containment Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 882-892
Chen C, Geer J, Sammakia B. (2016) A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction Journal of Electronic Packaging. 138: 41008
Al-Momani ES, Khasawneh MT, Sammakia B. (2016) An Approach for Assessing the Long-Term Reliability of Lead-Free Electronics Under In-Field Conditions Ieee Transactions On Device and Materials Reliability. 16: 532-540
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