Ming-Tsang Lee, Ph.D.
Affiliations: | 2008 | University of California, Berkeley, Berkeley, CA, United States |
Area:
Mechanical EngineeringGoogle:
"Ming-Tsang Lee"Parents
Sign in to add mentorRalph Greif | grad student | 2008 | UC Berkeley | |
(Transport phenomena in a reformer with micro-power applications.) |
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Publications
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Siddharth S, Tsai S, Chen Y, et al. (2020) Opto-thermo-fluidic transport phenomena involving thermocapillary flow during laser microfabrication International Journal of Heat and Mass Transfer. 162: 120303 |
Lan C, Tsai S, Lee M. (2017) Direct Silver Micro Circuit Patterning on Transparent Polyethylene Terephthalate Film Using Laser-Induced Photothermochemical Synthesis Micromachines. 8: 52 |
Tsai SL, Liu YK, Pan H, et al. (2016) The Coupled Photothermal Reaction and Transport in a Laser Additive Metal Nanolayer Simultaneous Synthesis and Pattering for Flexible Electronics. Nanomaterials (Basel, Switzerland). 6 |
Yang KS, Ding WT, Yeh CT, et al. (2016) An experimental and analytical investigation of the photo-thermal-electro characteristics of a high power InGaN LED module Applied Thermal Engineering. 98: 756-765 |
Liu Y, Sie Y, Liu C, et al. (2015) A Novel Laser Direct Writing System Integrated with A&F XXY Alignment Platform for Rapid Fabrication of Flexible Electronics Smart Science. 3: 87-91 |
Sekone AK, Hung YY, Yeh CT, et al. (2015) Experimental study and analysis of porous thin plate drying in a convection dryer International Communications in Heat and Mass Transfer. 68: 200-207 |
Yang KS, Yang TY, Tu CW, et al. (2015) A novel flat polymer heat pipe with thermal via for cooling electronic devices Energy Conversion and Management. 100: 37-44 |
Liu YK, Lee MT. (2014) Laser direct synthesis and patterning of silver nano/microstructures on a polymer substrate. Acs Applied Materials & Interfaces. 6: 14576-82 |
Chung C, Yang K, Chien K, et al. (2014) Heat Transfer Characteristics in High Power LED Packaging Smart Science. 2: 1-6 |
Lee MT, Yang KS. (2014) Thermal spreading resistance characteristics of a high power light emitting diode module Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 8 |