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David G. Cahill

Affiliations: 
Physics University of Illinois, Urbana-Champaign, Urbana-Champaign, IL 
Area:
Condensed Matter Physics, High Temperature Physics, Materials Science Engineering
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Parents

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Robert O. Pohl grad student 1989 Cornell

Children

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Jaichan Kim grad student 2001 UIUC
Xiaoyuan Hu grad student 2002 UIUC
Marcel A. Wall grad student 2003 UIUC
Justin R. Serrano grad student 2004 UIUC
Ruxandra M. Costescu grad student 2006 UIUC
Zhenbin Ge grad student 2006 UIUC
Shawn A. Putnam grad student 2007 UIUC
Xijing Zhang grad student 2008 UIUC
Catalin Chiritescu grad student 2010 UIUC
Yee K. Koh grad student 2010 UIUC
Wen-Pin Hsieh grad student 2011 UIUC
Zhun Y. Ong grad student 2011 UIUC
Tamlin Matthews grad student 2014 UIUC
Jingcheng Ma grad student 2017-2022 UIUC (E-Tree)
Xiaoyang Ji grad student 2018-2022 UIUC
Guangxin Lv grad student 2018-2022 UIUC
Xiaojia Wang post-doc 2012-2014
Zhe Cheng post-doc 2020-2022 (E-Tree)

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Publications

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Han HJ, Kumar S, Jin G, et al. (2023) Topological Metal MoP Nanowire for Interconnect. Advanced Materials (Deerfield Beach, Fla.). e2208965
Sun J, Lv G, Cahill DG. (2023) Frequency-domain probe beam deflection method for measurement of thermal conductivity of materials on micron length scale. The Review of Scientific Instruments. 94: 014903
Cheng Z, Liang J, Kawamura K, et al. (2022) High thermal conductivity in wafer-scale cubic silicon carbide crystals. Nature Communications. 13: 7201
Lv G, Shen C, Shan N, et al. (2022) Odd-even effect on the thermal conductivity of liquid crystalline epoxy resins. Proceedings of the National Academy of Sciences of the United States of America. 119: e2211151119
Cheng Z, Mu F, Ji X, et al. (2022) Correction to "Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance". Acs Applied Materials & Interfaces. 14: 22678
Lv G, Soman B, Shan N, et al. (2021) Effect of Linker Length and Temperature on the Thermal Conductivity of Ethylene Dynamic Networks. Acs Macro Letters. 10: 1088-1093
Ma J, Kim JM, Hoque MJ, et al. (2021) Role of Thin Film Adhesion on Capillary Peeling. Nano Letters
Kim SE, Mujid F, Rai A, et al. (2021) Extremely anisotropic van der Waals thermal conductors. Nature. 597: 660-665
Kim SE, Cahill DG. (2021) Pushing low thermal conductivity to the limit. Science (New York, N.Y.). 373: 963-964
Cheng Z, Mu F, Ji X, et al. (2021) Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance. Acs Applied Materials & Interfaces
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