Val Marinov
Affiliations: | Industrial and Manufacturing Engineering | North Dakota State University, Fargo, ND, United States |
Area:
Packaging Engineering, Mechanical Engineering, Electronics and Electrical EngineeringGoogle:
"Val Marinov"Children
Sign in to add traineeFerdous Sarwar | grad student | 2012 | North Dakota State University |
Yuriy A. Atanasov | grad student | 2014 | North Dakota State University |
BETA: Related publications
See more...
Publications
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
Sajal S, Braaten BD, Marinov V, et al. (2017) A low-cost compact antenna design on a paper substrate for near-field passive UHFRFID tags Microwave and Optical Technology Letters. 59: 1052-1056 |
Marinov VR, Swenson O, Atanasov Y, et al. (2013) Laser-assisted ultrathin bare die packaging: A route to a new class of microelectronic devices Proceedings of Spie - the International Society For Optical Engineering. 8608 |
Marinov VR, Swenson O, Atanasov Y, et al. (2013) Laser-assisted ultrathin die packaging: Insights from a process study Microelectronic Engineering. 101: 23-30 |
Sarwar F, Marinov VR. (2012) Reliability of embedded ultrathin chips subjected to cyclic stresses Journal of Microelectronics and Electronic Packaging. 9: 104-111 |
Miller R, Marinov V, Swenson O, et al. (2012) Noncontact selective laser-assisted placement of thinned semiconductor dice Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 971-978 |
Marinov V, Swenson O, Miller R, et al. (2012) Laser-enabled advanced packaging of ultrathin bare dice in flexible substrates Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 569-577 |
Sarwar F, Chen Z, Wu J, et al. (2011) Excimer laser ablation of high aspect ratio microvias using a novel sensitizer-enhanced photopolymer Journal of Microelectronics and Electronic Packaging. 8: 66-71 |
Bhattacharya S, Marinov V. (2009) Simple, inexpensive, and reliable, high density interconnect technology for flexible electronics applications 2009 Flexible Electronics and Displays Conference and Exhibition, Flex 2009 |
Khan A, Rasmussen N, Marinov V, et al. (2008) Laser sintering of direct write silver nano-ink conductors for microelectronic applications Proceedings of Spie - the International Society For Optical Engineering. 6879 |
Marinov VR, Atanasov YA, Khan A, et al. (2007) Direct-write vapor sensors on FR4 plastic substrates Ieee Sensors Journal. 7: 937-944 |