Carmen Lilley
Affiliations: | Electrical and Computer Engineering | University of Illinois at Chicago, Chicago, IL, United States |
Area:
Electronics and Electrical Engineering, Nanoscience, Materials Science EngineeringGoogle:
"Carmen Lilley"Children
Sign in to add traineeQiaojian Huang | grad student | 2008 | University of Illinois, Chicago |
Poh K. Ng | grad student | 2014 | University of Illinois, Chicago |
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Publications
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Ng PK, Fisher B, Lilley CM. (2013) Scanning tunneling microscopy and spectroscopy studies of self assembled sub 10 nm copper-silicide nanostructures on Si(110) Proceedings of the Ieee Conference On Nanotechnology. 105-109 |
Ng PK, Cheng JY, Fisher B, et al. (2012) In situ electrical resistivity measurement of self assembled Cu |
Ng PK, Fisher B, Bode M, et al. (2011) Self assembled Cu nanowires on vicinal Si(001) by the E-beam evaporation method Proceedings of the Ieee Conference On Nanotechnology. 150-154 |
Ng PK, Fisher B, Low KB, et al. (2011) High resolution analysis of self assembled Cu nanowires on vicinal Si(001) Proceedings of the Ieee Conference On Nanotechnology. 1114-1117 |
Huang Q, Lilley CM, Divan R. (2009) An in situ investigation of electromigration in Cu nanowires. Nanotechnology. 20: 075706 |
Huang Q, Lilley CM, Bode M. (2009) Characterization of electron surface scattering in single crystalline metallic nanowires 2009 Ieee Nanotechnology Materials and Devices Conference, Nmdc 2009. 61-63 |
Huang Q, Lilley CM, Bode M. (2009) Surface scattering effect on the electrical resistivity of single crystalline silver nanowires self-assembled on vicinal Si (001) Applied Physics Letters. 95 |
Huang Q, Lilley CM, Divan R, et al. (2008) Electrical failure analysis of Au nanowires Ieee Transactions On Nanotechnology. 7: 688-692 |
Huang Q, Lilley CM, Bode M, et al. (2008) Electrical properties of Cu nanowires 2008 8th Ieee Conference On Nanotechnology, Ieee-Nano. 549-552 |
Huang Q, Lilley CM, Bode M, et al. (2008) Surface and size effects on the electrical properties of Cu nanowires Journal of Applied Physics. 104 |