John C. Bravman
Affiliations: | 1985-2010 | Material Science & Engineering | Stanford University, Palo Alto, CA |
| 2010- | Bucknell University, Lewisburg, PA, United States | ||
| 2012- | Geisinger Health System |
Area:
Electronics and Electrical Engineering, Optics PhysicsWebsite:
https://www.geisinger.org/about-geisinger/leadership/board-of-directors/john-bravmanGoogle:
"John Cole Bravman" OR "John C Bravman"Bio:
https://mse.stanford.edu/people/john-bravman
https://www.roundtablegroup.com/wp-content/uploads/2017/11/Bravman-John.pdf
DOI: 10.1063/1.335421
Mean distance: (not calculated yet)
Parents
Sign in to add mentor| James D. Plummer | grad student | 1984 | Stanford (E-Tree) | |
| (Morphological Aspects of Silicon - Silicon Dioxide VLSI Interfaces) | ||||
Children
Sign in to add trainee| David C. Paine | grad student | 1988 | Stanford (E-Tree) |
| Seok-Hee Lee | grad student | 2001 | Stanford |
| Nicole M. Chang | grad student | 2002 | Stanford |
| Maura L. Jenkins | grad student | 2003 | Stanford |
| Bryan C. Valek | grad student | 2003 | Stanford |
| Dimitrios Pantelidis | grad student | 2004 | Stanford |
| Gaurav Verma | grad student | 2004 | Stanford |
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Borrego MJ, Dauskardt RH, Bravman JC. (2007) Effect of silane functional group on adhesion of selected epoxies for microelectronic packaging Journal of Microelectronics and Electronic Packaging. 4: 8-16 |
| Lee H, Zhang P, Bravman JC. (2005) Stress relaxation in free-standing aluminum beams Thin Solid Films. 476: 118-124 |
| Jenkins ML, Dauskardt RH, Bravman JC. (2004) Important factors for silane adhesion promoter efficacy: Surface coverage, functionality and chain length Journal of Adhesion Science and Technology. 18: 1497-1516 |
| Lee H, Zhang P, Bravman JC. (2004) Study on the strength and elongation of free-standing Al beams for microelectromechanical systems applications Applied Physics Letters. 84: 915-917 |
| Barabash R, Ice G, Tamura N, et al. (2004) Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect Microelectronic Engineering. 75: 24-30 |
| Spolenak R, Brown WL, Tamura N, et al. (2003) Local plasticity of Al thin films as revealed by x-ray microdiffraction. Physical Review Letters. 90: 096102 |
| Tamura N, MacDowell AA, Spolenak R, et al. (2003) Scanning X-ray microdiffraction with submicrometer white beam for strain/stress and orientation mapping in thin films. Journal of Synchrotron Radiation. 10: 137-43 |
| Barabash R, Tamura N, Valek B, et al. (2003) Quantitative Characterization of Dislocation Structure coupled with Electromigration in a Passivated Al (0.5wt%Cu) Interconnects Mrs Proceedings. 766 |
| Valek BC, Tamura N, Spolenak R, et al. (2003) Early stage of plastic deformation in thin films undergoing electromigration Journal of Applied Physics. 94: 3757-3761 |
| Barabash RI, Ice GE, Tamura N, et al. (2003) Quantitative analysis of dislocation arrangements induced by electromigration in a passivated Al (0.5 wt % Cu) interconnect Journal of Applied Physics. 93: 5701-5706 |