Peng Peng
Affiliations: | Computer Science | University of Waterloo, Waterloo, ON, Canada |
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Collaborators
Sign in to add collaborator| Ivens Portugal | collaborator | 2018-2018 | University of Waterloo |
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Publications
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| Peng P, Portugal I, Alencar P, et al. (2021) A face recognition software framework based on principal component analysis. Plos One. 16: e0254965 |
| Chi J, Cai Z, Wan Z, et al. (2020) Effects of heat treatment combined with laser shock peening on wire and arc additive manufactured Ti17 titanium alloy: Microstructures, residual stress and mechanical properties Surface & Coatings Technology. 396: 125908 |
| Guo W, Wan Z, Jia Q, et al. (2020) Laser weldability of TWIP980 with DP980/B1500HS/QP980 steels: Microstructure and mechanical properties Optics and Laser Technology. 124: 105961 |
| Zhang H, Cai Z, Wan Z, et al. (2020) Microstructure and mechanical properties of laser shock peened 38CrSi steel Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 788: 139486 |
| Peng P, Li L, He P, et al. (2019) One-step selective laser patterning of copper /graphene flexible electrodes. Nanotechnology |
| Sun R, Li L, Zhu Y, et al. (2019) Fatigue of Ti-17 titanium alloy with hole drilled prior and post to laser shock peening Optics and Laser Technology. 115: 166-170 |
| Zhang H, Wang W, Bai H, et al. (2019) Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications Journal of Alloys and Compounds. 774: 487-494 |
| Guo W, Zhang H, Ma K, et al. (2019) Reactive brazing of silicon nitride to Invar alloy using Ni foam and AgCuTi intermediate layers Ceramics International. 45: 13979-13987 |
| Guo W, Zhang H, Yuan W, et al. (2019) The microstructure and mechanical properties of C/C composite/Ti3Al alloy brazed joint with graphene nanoplatelet strengthened Ag-Cu-Ti filler Ceramics International. 45: 8783-8789 |
| Peng P, Sun H, Gerlich AP, et al. (2019) Near-ideal compressive strength of nanoporous silver composed of nanowires Acta Materialia. 173: 163-173 |