Yongsug Tak
Affiliations: | 1993 | Chemical Engineering | Iowa State University, Ames, IA, United States |
| 1994- | Chemical Engineering | Inha University, Incheon, South Korea |
Website:
http://mecl.inha.ac.kr/Google:
"Yongsug Tak"Parents
Sign in to add mentor| Kurt R. Hebert | grad student | 1993 | Iowa State | |
| (Electrochemical and surface topographic studies of oxide film passivation of aluminum) | ||||
Children
Sign in to add trainee| Jinsub Choi | grad student | ||
| Kiyoung Lee | grad student | 2007-2009 | Inha University |
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Publications
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| Shim S, Hong SH, Tak Y, et al. (2011) Prevention of Pseudomonas aeruginosa adhesion by electric currents. Biofouling. 27: 217-24 |
| Jung H, Hong C, Kil J, et al. (2008) Pulse electrodeposition of Ni-W alloy for trench filling in microelectromechanical systems. Journal of Nanoscience and Nanotechnology. 8: 5321-5 |
| Ko E, Choi J, Okamoto K, et al. (2007) Cu(2)O nanowires in an alumina template: electrochemical conditions for the synthesis and photoluminescence characteristics. Chemphyschem : a European Journal of Chemical Physics and Physical Chemistry. 7: 1505-9 |
| Tak Y, Sinha N, Hebert KR. (2000) Metal dissolution kinetics in aluminum etch tunnels Journal of the Electrochemical Society. 147: 4103-4110 |
| Hebert KR, Tak Y. (1994) Initial Events During the Passivation of Rapidly Dissolving Aluminum Surfaces Journal of the Electrochemical Society. 141: 1453-1459 |
| Tak Y. (1994) Evolution of Microscopic Surface Topography during Passivation of Aluminum Journal of the Electrochemical Society. 141: 1446 |
| Wiersma BJ, Tak Y, Hebert KR. (1991) Passivation of Surfaces within Aluminum Etch Tunnels Journal of the Electrochemical Society. 138: 371-379 |