Fen-Fen Wu, Ph.D. - Publications

Affiliations: 
University of Pittsburgh, Pittsburgh, PA, United States 
Area:
biochemistry, genetics

146 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Chen H, Wu F, Li J, Jiang X, Cai L, Li X. DUP1 peptide modified micelle efficiently targeted delivery paclitaxel and enhance mitochondrial apoptosis on PSMA-negative prostate cancer cells. Springerplus. 5: 362. PMID 27066372 DOI: 10.1186/s40064-016-1992-0  0.32
2016 Feng Z, Yao Y, Zhou C, Chen F, Wu F, Wei L, Liu W, Dong S, Redell M, Mo Q, Song Y. Pharmacological inhibition of LSD1 for the treatment of MLL-rearranged leukemia. Journal of Hematology & Oncology. 9: 24. PMID 26970896 DOI: 10.1186/s13045-016-0252-7  0.32
2016 Hardy K, Wu F, Tu W, Zafar A, Boulding T, McCuaig R, Sutton CR, Theodoratos A, Rao S. Identification of chromatin accessibility domains in human breast cancer stem cells. Nucleus (Austin, Tex.). 1-18. PMID 26962893 DOI: 10.1080/19491034.2016.1150392  0.32
2016 Wang Y, Wu F, Mu Y, Zeng EY, Meng W, Zhao X, Giesy JP, Feng C, Wang P, Liao H, Chen C. Directly Predicting Water Quality Criteria from Physicochemical Properties of Transition Metals. Scientific Reports. 6: 22515. PMID 26936420 DOI: 10.1038/srep22515  0.32
2016 Zhou P, Wu F, Zhou T, Cai X, Zhang S, Zhang X, Li Q, Li Y, Zheng Y, Wang M, Lan F, Pan G, Pei D, Wei S. Simple and versatile synthetic polydopamine-based surface supports reprogramming of human somatic cells and long-term self-renewal of human pluripotent stem cells under defined conditions. Biomaterials. 87: 1-17. PMID 26897536 DOI: 10.1016/j.biomaterials.2016.02.012  0.6
2016 Wang B, Gao W, Lv J, Yu C, Wang S, Pang Z, Cong L, Dong Z, Wu F, Wang H, Wu X, Jiang G, Wang X, Wang B, Cao W, et al. Physical activity attenuates genetic effects on BMI: Results from a study of Chinese adult twins. Obesity (Silver Spring, Md.). PMID 26833823 DOI: 10.1002/oby.21402  0.32
2016 Tsang DP, Wu WK, Kang W, Lee YY, Wu F, Yu Z, Xiong L, Chan AW, Tong JH, Yang W, Li MS, Lau SS, Li X, Lee SD, Yang Y, et al. Yin Yang 1-mediated epigenetic silencing of tumour-suppressive microRNAs activates Nuclear Factor-κB in hepatocellular carcinoma. The Journal of Pathology. PMID 26800240 DOI: 10.1002/path.4688  0.32
2016 Zhang H, Zheng H, Zhao G, Tang C, Lu S, Cheng B, Wu F, Wei J, Liang Y, Ruan J, Song H, Su Z. Metabolomic study of corticosterone-induced cytotoxicity in PC12 cells by ultra performance liquid chromatography-quadrupole/time-of-flight mass spectrometry. Molecular Biosystems. PMID 26775910 DOI: 10.1039/c5mb00642b  0.32
2016 Chang R, Zhou R, Qi X, Wang J, Wu F, Yang W, Zhang W, Sun T, Li Y, Yu J. Protective effects of aloin on oxygen and glucose deprivation-induced injury in PC12 cells. Brain Research Bulletin. PMID 26772628 DOI: 10.1016/j.brainresbull.2016.01.001  0.6
2016 Tao H, Wang P, Ali B, Wu F, Jin Z, Xu X. Fractionation and reconstitution experiments provide insight into the role of wheat starch in frozen dough. Food Chemistry. 190: 588-93. PMID 26213014 DOI: 10.1016/j.foodchem.2015.05.123  0.32
2016 Zhao Y, Wei X, Zhang Y, Wu F, Huo D. Investigation on cutting force and temperature of cutting Cu50Zr50 metallic glass by molecular dynamics simulation Key Engineering Materials. 667: 88-94. DOI: 10.4028/www.scientific.net/KEM.667.88  0.32
2016 Wu F, Li Y, Zhang N, Zhang W, Hu G. Decalcification dentinal matrix grafting combined with plate in treatment of upper extremity nonunions Medical Journal of Wuhan University. 37: 305-308. DOI: 10.14188/j.1671-8852.2016.02.031  0.6
2016 Huang F, Jiang M, Wen H, Wu F, Liu W, Tian J, Shao H. Dietary vitamin C requirement of genetically improved farmed Tilapia, Oreochromis Niloticus Aquaculture Research. 47: 689-697. DOI: 10.1111/are.12527  0.36
2016 Wang G, Fang Z, Wu F. Control of two-dimensional electron population in a semiconductor quantum well Physica E: Low-Dimensional Systems and Nanostructures. 75: 241-245. DOI: 10.1016/j.physe.2015.09.037  0.32
2016 Zhang T, Chen Z, Yang D, Wu F, Zhao X, Yang X. Fabricating high performance polymer photovoltaic modules by creating large-scale uniform films Organic Electronics: Physics, Materials, Applications. 32: 126-133. DOI: 10.1016/j.orgel.2016.02.007  0.52
2016 Wu F, Shan Y, Wang R, Zhu L. Incorporation of diketopyrrolopyrrole dye to improve photovoltaic performance of P3HT:PC71BM based bulk heterojunction polymer solar cells Organic Electronics: Physics, Materials, Applications. 31: 171-176. DOI: 10.1016/j.orgel.2016.01.028  0.32
2016 Sun H, Chan YC, Wu F. Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints Materials Science and Engineering A. 656: 249-255. DOI: 10.1016/j.msea.2016.01.045  0.6
2016 Wang J, Lin W, Yan X, Wu X, Wu F, Yang Y. Preparation and microstructure of Al2O3-SiO2-TiO2 coating on three-dimensional braided carbon fiber by sol-gel technology Materials and Design. 89: 928-932. DOI: 10.1016/j.matdes.2015.10.079  0.32
2016 Zhao Y, Wu C, Peng G, Chen X, Yao X, Bai Y, Wu F, Chen S, Xu X. A new solid polymer electrolyte incorporating Li10GeP2S12 into a polyethylene oxide matrix for all-solid-state lithium batteries Journal of Power Sources. 301: 47-53. DOI: 10.1016/j.jpowsour.2015.09.111  0.32
2016 Zhang J, Dai G, Wu F, Li D, Gao D, Jin H, Chen S, Zhu X, Huang C, Han D. Efficient and tunable phosphorescence of new platinum(II) complexes based on the donor-π-acceptor Schiff bases Journal of Photochemistry and Photobiology a: Chemistry. 316: 12-18. DOI: 10.1016/j.jphotochem.2015.09.018  0.32
2016 Li Y, Lim ABY, Luo K, Chen Z, Wu F, Chan YC. Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In-48Sn/Cu solder interconnects under current stressing Journal of Alloys and Compounds. 673: 372-382. DOI: 10.1016/j.jallcom.2016.02.244  0.6
2016 Chen G, Wu F, Liu C, Silberschmidt VV, Chan YC. Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets Journal of Alloys and Compounds. 656: 500-509. DOI: 10.1016/j.jallcom.2015.09.178  0.6
2016 Wang B, Hao J, Yi X, Wu F, Li M, Qin H, Huang H. Infrared/laser multi-sensor fusion and tracking based on the multi-scale model Infrared Physics and Technology. 75: 12-17. DOI: 10.1016/j.infrared.2016.01.001  0.36
2016 Wu F, Zhang D, Ma J, Luo K, Di H, Liu Z, Zhang J, Wang Y. Analysis of genetic diversity and population structure in accessions of the genus Melilotus Industrial Crops and Products. 85: 84-92. DOI: 10.1016/j.indcrop.2016.02.055  0.52
2016 Qiu K, Wu F, Yang S, Luo K, Luo KK, Fan J. Heat transfer and erosion mechanisms of an immersed tube in a bubbling fluidized bed: A LES-DEM approach International Journal of Thermal Sciences. 100: 357-371. DOI: 10.1016/j.ijthermalsci.2015.10.001  0.52
2016 Wu F, Li X, Feng F, Gooi HB. Efficiency enhancement scheme of cascaded multilevel grid-connected inverter and its improvement to eliminate effect of non-ideal grid conditions International Journal of Electrical Power and Energy Systems. 76: 120-128. DOI: 10.1016/j.ijepes.2015.10.001  0.32
2016 Wu F, Zhang M, Wang G, Hu Z. Triangulation and metric of lines based on geometric error Computer Vision and Image Understanding. 145: 111-127. DOI: 10.1016/j.cviu.2016.01.013  0.32
2016 Luo S, Zhou W, Xie A, Wu F, Yao C, Li X, Zuo S, Liu T. Effect of MnO2 polymorphs structure on the selective catalytic reduction of NOx with NH3 over TiO2-Palygorskite Chemical Engineering Journal. 286: 291-299. DOI: 10.1016/j.cej.2015.10.079  0.32
2016 Tao H, Wang P, Zhang B, Wu F, Jin Z, Xu X. A comparative study of sodium dodecyl sulfate and freezing/thawing treatment on wheat starch: The role of water absorption Carbohydrate Polymers. 143: 149-154. DOI: 10.1016/j.carbpol.2016.02.014  0.32
2016 Tao H, Wang P, Wu F, Jin Z, Xu X. Particle size distribution of wheat starch granules in relation to baking properties of frozen dough Carbohydrate Polymers. 137: 147-153. DOI: 10.1016/j.carbpol.2015.10.063  0.32
2016 Zhu Z, Sun H, Wu F, Chan Yc. Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods Journal of Materials Science: Materials in Electronics. 1-10. DOI: 10.1007/s10854-016-4635-x  0.6
2016 Wu F, Wang G, Zhou W. Numerical Study of Natural Convection in a Porous Cavity with Sinusoidal Thermal Boundary Condition Chemical Engineering and Technology. 39: 767-774. DOI: 10.1002/ceat.201400143  0.32
2016 Wu F, Wang D, Shi B, Gong J. Research on durability and life prediction for raymond cylinder pile Tumu Gongcheng Xuebao/China Civil Engineering Journal. 49: 122-128.  0.32
2015 Ding R, Gao W, He Z, Wang H, Conrad CD, Dinney CM, Yuan X, Wu F, Ma L, Wu Z, Liang C. Overrepresentation of Th1- and Th17-like Follicular Helper T Cells in Coronary Artery Disease. Journal of Cardiovascular Translational Research. PMID 26597829 DOI: 10.1007/s12265-015-9662-0  0.32
2015 Chen W, Qian L, Wu F, Li M, Wang H. Significance of Toll-like Receptor 4 Signaling in Peripheral Blood Monocytes of Pre-eclamptic Patients. Hypertension in Pregnancy. 1-9. PMID 26587644 DOI: 10.3109/10641955.2015.1077860  0.36
2015 Sun H, Chen ZH, Chen F, Xie L, Zhang G, Vincze E, Wu F. DNA microarray revealed and RNAi plants confirmed key genes conferring low Cd accumulation in barley grains. Bmc Plant Biology. 15: 259. PMID 26503017 DOI: 10.1186/s12870-015-0648-5  0.32
2015 Li L, Ye C, Zhao R, Li X, Liu WZ, Wu F, Yan J, Jiang YQ, Yang B. Mitogen-activated protein kinase kinase kinase (MAPKKK) 4 from rapeseed (Brassica napus L.) is a novel member inducing ROS accumulation and cell death. Biochemical and Biophysical Research Communications. PMID 26498521 DOI: 10.1016/j.bbrc.2015.10.063  0.32
2015 Wu F, Yuan H, Zhou C, Mao M, Liu Q, Shen H, Cen Y, Qin Z, Ma L, Song Li L. Multiplexed detection of influenza A virus subtype H5 and H9 via quantum dot-based immunoassay. Biosensors & Bioelectronics. 77: 464-470. PMID 26454828 DOI: 10.1016/j.bios.2015.10.002  0.32
2015 Teng X, Zhan C, Bai Y, Ma L, Liu Q, Wu C, Wu F, Yang Y, Lu J, Amine K. In-situ analysis of gas generation in lithium ion batteries with different carbonate-based electrolytes. Acs Applied Materials & Interfaces. PMID 26417916 DOI: 10.1021/acsami.5b08399  0.32
2015 Zhang J, Wu DZ, Cai SX, Chen M, Xia YK, Wu F, Chen JH. An immobilization-free electrochemical impedance biosensor based on duplex-specific nuclease assisted target recycling for amplified detection of microRNA. Biosensors & Bioelectronics. 75: 452-457. PMID 26363493 DOI: 10.1016/j.bios.2015.09.006  0.32
2015 Sun H, Zang X, Liu Y, Cao X, Wu F, Huang X, Jiang M, Zhang X. Expression of a chimeric human/salmon calcitonin gene integrated into the Saccharomyces cerevisiae genome using rDNA sequences as recombination sites. Applied Microbiology and Biotechnology. PMID 26254786 DOI: 10.1007/s00253-015-6834-4  0.32
2015 Wei C, Zhang J, Yang S, Sun L, Tao W, Wu F, Xia W. Improving formability of laser welded automotive dual phase steels with local cooling Science and Technology of Welding and Joining. 20: 145-154. DOI: 10.1179/1362171814Y.0000000263  0.6
2015 Peng H, Huang B, Chen G, Wu F, Liu H, Chan YC. Effect of 0.8 wt% Al2O3 nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint 16th International Conference On Electronic Packaging Technology, Icept 2015. 1014-1017. DOI: 10.1109/ICEPT.2015.7236751  0.6
2015 Zhu Z, Chan YC, Wu F. Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint 16th International Conference On Electronic Packaging Technology, Icept 2015. 140-143. DOI: 10.1109/ICEPT.2015.7236561  0.6
2015 Mo L, Wu F, Liu C. Growth kinetics of IMCs in Cu-Sn intermetallic joints during isothermal soldering process Proceedings - Electronic Components and Technology Conference. 2015: 1854-1858. DOI: 10.1109/ECTC.2015.7159852  0.6
2015 Chen G, Wu F, Liu C, Chan YC. Effect of fullerene-C60&C70 on the microstructure and properties of 96.5Sn-3Ag-0.5Cu solder Proceedings - Electronic Components and Technology Conference. 2015: 1262-1267. DOI: 10.1109/ECTC.2015.7159759  0.6
2015 Tao J, Whalley DC, Liu C, Wu F, Kristiansen H. Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections Proceedings - Electronic Components and Technology Conference. 2015: 1154-1159. DOI: 10.1109/ECTC.2015.7159740  0.6
2015 Wu F, Song Y, Zhao Z, Zhang S, Yang Z, Li Z, Li M, Fan QH, Liu D. Preparation and Self-Assembly of Supramolecular Coil-Rod-Coil Triblock Copolymer PPO-dsDNA-PPO Macromolecules. 48: 7550-7556. DOI: 10.1021/acs.macromol.5b01786  0.36
2015 Wu F, Luo K, Huang C, Wu W, Meng P, Liu Y, Kan E. Theoretical understanding of magnetic and electronic structures of Ti3C2 monolayer and its derivatives Solid State Communications. 222: 9-13. DOI: 10.1016/j.ssc.2015.08.023  0.52
2015 Chen G, Wu F, Liu C, Xia W, Liu H. Effects of fullerenes reinforcement on the performance of 96.5Sn-3Ag-0.5Cu lead-free solder Materials Science and Engineering A. 636: 484-492. DOI: 10.1016/j.msea.2015.03.106  0.6
2015 Hu T, Li Y, Chan YC, Wu F. Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn-58Bi solder joints Microelectronics Reliability. 55: 1226-1233. DOI: 10.1016/j.microrel.2015.05.008  0.6
2015 Tao S, Wu F, Guo Q, Wang Y, Li W, Xue B, Hu X, Li P, Tian D, Li C, Yao H, Li Y, Xu G, Fang J. Segmenting tree crowns from terrestrial and mobile LiDAR data by exploring ecological theories Isprs Journal of Photogrammetry and Remote Sensing. 110: 66-76. DOI: 10.1016/j.isprsjprs.2015.10.007  0.6
2015 Mo L, Chen Z, Wu F, Liu C. Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition Intermetallics. 66: 13-21. DOI: 10.1016/j.intermet.2015.06.019  0.6
2015 Long L, Yang J, Li Y, Guan C, Wu F. Effect of biofloc technology on growth, digestive enzyme activity, hematology, and immune response of genetically improved farmed tilapia (Oreochromis niloticus) Aquaculture. 448: 135-141. DOI: 10.1016/j.aquaculture.2015.05.017  0.36
2015 Xu Z, Tang S, Xiong L, Yang W, Yin H, Tu L, Wu F, Chen L, Tan B. Temperature sensitivity of soil respiration in China's forest ecosystems: Patterns and controls Applied Soil Ecology. 93: 105-110. DOI: 10.1016/j.apsoil.2015.04.008  0.32
2015 Zhang P, Wu F, Kang X, Zhao C, Li Y. Genotypic Variations of Biomass Feedstock Properties for Energy in Triploid Hybrid Clones of Populus tomentosa Bioenergy Research. DOI: 10.1007/s12155-015-9622-1  0.32
2015 Li Y, Yang Y, Jiao S, Wu F, Yang J, Xie L, Huang C. In situ determination of hafnium isotopes from rutile using LA-MC-ICP-MS Science China Earth Sciences. DOI: 10.1007/s11430-015-5215-2  0.6
2015 Li Y, Wu F, Chan YC. Electromigration in eutectic In-48Sn ball grid array (BGA) solder interconnections with Au/Ni/Cu pads Journal of Materials Science: Materials in Electronics. 26: 8522-8533. DOI: 10.1007/s10854-015-3524-z  0.6
2015 Sun H, Chan YC, Wu F. The impact of reflow soldering induced dopant redistribution on the mechanical properties of CNTs doped Sn58Bi solder joints Journal of Materials Science: Materials in Electronics. 26: 5318-5325. DOI: 10.1007/s10854-015-3071-7  0.6
2015 Sun H, Chan YC, Wu F. Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints Journal of Materials Science: Materials in Electronics. 26: 5129-5134. DOI: 10.1007/s10854-015-3040-1  0.6
2015 Wei C, Zhang J, Yang S, Tao W, Wu F, Xia W. Experiment-based regional characterization of HAZ mechanical properties for laser welding International Journal of Advanced Manufacturing Technology. DOI: 10.1007/s00170-014-6762-y  0.6
2014 Long H, Shi T, Xi S, Wu F, Xia Q, Li X, Tang Z. Growth of nano-wrinkles on photoresist-derived carbon microelectrode array International Journal of Nanotechnology. 11: 616-625. DOI: 10.1504/IJNT.2014.060584  0.6
2014 Wei C, Wu F, Tao W, Xia W. Joint microstructure performance and laser tailor welded blanks of DP600 and IF steels with dissimilar thickness Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition). 42: 128-132. DOI: 10.13245/j.hust.140725  0.6
2014 Xu Y, Huang L, Chen G, Wu F, Xia W, Liu H. Electromigration - Induced failure mechanism and lifetime prediction in NiCu thin film Proceedings of the Electronic Packaging Technology Conference, Eptc. 1071-1074. DOI: 10.1109/ICEPT.2014.6922831  0.6
2014 Huang L, Chen S, Wu F, Xia W, Liu H, Xu Y. Effect of heat sink on electromigration lifetime of Ni thin film Proceedings of the Electronic Packaging Technology Conference, Eptc. 1063-1067. DOI: 10.1109/ICEPT.2014.6922829  0.6
2014 Chen S, Wu F, Xia W, Liu H, Xiao M, Huang L. Effect of Cu/Al substrate thickness on the deformation and fatigue Life of Bumps Array Proceedings of the Electronic Packaging Technology Conference, Eptc. 1035-1039. DOI: 10.1109/ICEPT.2014.6922823  0.6
2014 Wang S, Cai X, Chen G, Wu F, Xia W, Zhu W, Liu R, Zhang Y. The study of novel metal/composite thermal interface materials for chip testing Proceedings of the Electronic Packaging Technology Conference, Eptc. 352-355. DOI: 10.1109/ICEPT.2014.6922671  0.6
2014 Xu K, Chen G, Wu F, Xia W, Liu H. Effect of SiC whiskers addition on microstructure, microhardness and wettablility of Sn-Ag-Cu solder Proceedings of the Electronic Packaging Technology Conference, Eptc. 310-312. DOI: 10.1109/ICEPT.2014.6922661  0.6
2014 Huang B, Chen G, Wu F, Xia W, Mo L, Liu H. Preparation, microstructure and properties of Sn-Ag-Cu solder reinforced with Al2O3 nanoparticles Proceedings of the Electronic Packaging Technology Conference, Eptc. 243-246. DOI: 10.1109/ICEPT.2014.6922646  0.6
2014 Chen G, Wu F, Xia W, Liu H, Liu C. Effect of Ni-coated graphene on the performance of SAC305 solder Proceedings of the Electronic Packaging Technology Conference, Eptc. 209-213. DOI: 10.1109/ICEPT.2014.6922638  0.6
2014 Zhu W, Wu F, Xu Y, Liu C. Hermetical package of infrared sensors by Al/Ni self-propagating joining process Proceedings of the 5th Electronics System-Integration Technology Conference, Estc 2014. DOI: 10.1109/ESTC.2014.6962721  0.6
2014 Xia W, Xiao M, Chen Y, Wu F, Liu Z, Fu H. Thermal warpage analysis of PBGA mounted on PCB during reflow process by FEM and experimental measurement Soldering and Surface Mount Technology. 26: 162-171. DOI: 10.1108/SSMT-11-2013-0034  0.6
2014 Zhu W, Wu F, Wang B, Hou E, Wang P, Liu C, Xia W. Microstructural and mechanical integrity of Cu/Cu interconnects formed by self-propagating exothermic reaction methods Microelectronic Engineering. 128: 24-30. DOI: 10.1016/j.mee.2014.05.035  0.6
2014 Jiang S, Shi T, Liu D, Long H, Xi S, Wu F, Li X, Xia Q, Tang Z. Integration of MnO2 thin film and carbon nanotubes to three-dimensional carbon microelectrodes for electrochemical microcapacitors Journal of Power Sources. 262: 494-500. DOI: 10.1016/j.jpowsour.2013.12.009  0.6
2014 Zhao W, Liu C, Wu F, Lenardi C. Investigation on the mechanical behavior of poly(2-hydroxyethyl methacrylate) hydrogel membrane under compression in the assembly process of microfluidic system Journal of Polymer Science, Part B: Polymer Physics. 52: 485-495. DOI: 10.1002/polb.23449  0.6
2013 Xiao M, Wu F, Liu H, Xia W. Electric-thermo-mechanical analysis of TSV under high current stressing Proceedings - 2013 14th International Conference On Electronic Packaging Technology, Icept 2013. 1235-1239. DOI: 10.1109/ICEPT.2013.6756681  0.6
2013 Xu Y, Wang L, Wu F, Xia W, Liu H. Effect of interface structure on fatigue life under thermal cycle with SAC305 solder joints Proceedings - 2013 14th International Conference On Electronic Packaging Technology, Icept 2013. 959-964. DOI: 10.1109/ICEPT.2013.6756619  0.6
2013 Lin H, Zhou L, Liu H, Wu F, Xia W, Fu H, Wang S, Liu Z. Mechanical property and reliability of anisotropic conductive adhesive in surface mount applications Proceedings - 2013 14th International Conference On Electronic Packaging Technology, Icept 2013. 839-842. DOI: 10.1109/ICEPT.2013.6756594  0.6
2013 Wang B, Zhu W, Xia W, Liu H, Wu F. Simulation of temperature fields for Cu/Cu joining process by self-propagating reaction Proceedings - 2013 14th International Conference On Electronic Packaging Technology, Icept 2013. 443-447. DOI: 10.1109/ICEPT.2013.6756509  0.6
2013 Zhou L, Lin H, Wu F, Liu H, Xia W, Fu H, Wang S, Liu Z. Effect of reflow conditions on the die shear strength in flip chip on board with SAC305 solder joints Proceedings - 2013 14th International Conference On Electronic Packaging Technology, Icept 2013. 109-113. DOI: 10.1109/ICEPT.2013.6756434  0.6
2013 Zhu W, Wu F, Xia W, Wang B, Wang P, Hou E. Solder behavior and defect formation in joining process by Al/Ni self-propagating reaction Proceedings - 2013 14th International Conference On Electronic Packaging Technology, Icept 2013. 1-5. DOI: 10.1109/ICEPT.2013.6756408  0.6
2012 An FP, Bai JZ, Balantekin AB, Band HR, Beavis D, Beriguete W, Bishai M, Blyth S, Boddy K, Brown RL, Cai B, Cao GF, Cao J, Carr R, Chan WT, ... ... Wu FF, et al. Observation of electron-antineutrino disappearance at Daya Bay. Physical Review Letters. 108: 171803. PMID 22680853  0.6
2012 Zhao W, Liu C, Lenardi C, Santaniello T, Wu F. Mechanical fastening to enable room temperature packaging for LOCs based on biocompatible hydrogel thin film 14th International Conference On Electronic Materials and Packaging, Emap 2012. DOI: 10.1109/EMAP.2012.6507899  0.6
2012 Mo L, Wu F, Liu C, Xia W. The size dependency of full IMC solder joint for 3D interconnection Proceedings - Electronic Components and Technology Conference. 839-843. DOI: 10.1109/ECTC.2012.6248931  0.6
2012 Xia W, Wang K, Zeng Z, Xie L, Wu F. Three-points welding analysis for compressor upper flange with different structures Hanjie Xuebao/Transactions of the China Welding Institution. 33: 97-100.  0.6
2011 Wu Y, Qi SB, Wu FF, Zhang XC, Li M, Wu J, Chan AS. Synthesis of β-amino acid derivatives via copper-catalyzed asymmetric 1,4-reduction of β-(acylamino)acrylates. Organic Letters. 13: 1754-7. PMID 21366341 DOI: 10.1021/ol200287z  0.36
2011 Zhou L, Peng W, Liu D, Zou R, Jiang X, Xia W, Wu F. Research on dimensional change characteristics of silver halide films for multi-layer PCBs Icept-Hdp 2011 Proceedings - 2011 International Conference On Electronic Packaging Technology and High Density Packaging. 708-711. DOI: 10.1109/ICEPT.2011.6066931  0.6
2011 Wang B, Wu F, Wu Y, Mo L, Xia W. Microstructural evolution of the intermetallic compounds in the high density solder interconnects with reduced stand-off heights Soldering and Surface Mount Technology. 23: 229-234. DOI: 10.1108/09540911111169075  0.6
2011 Wang B, Wu F, Wu Y, An B, Liu H, Zou J. A comparative study of microstructure and mechanical properties among Cu/Sn/Cu, Ni/Sn/Ni and Cu/Sn/Ni solder joints Soldering and Surface Mount Technology. 23: 40-46. DOI: 10.1108/09540911111099695  0.6
2011 Wang B, Mo L, Wu F, Xia W, Wu Y. Microstructure of solder joints with micron stand-off height in electronic packaging Hanjie Xuebao/Transactions of the China Welding Institution. 32: 25-28.  0.6
2010 Xu P, Deng D, Liu D, Gao T, Wu F, Zhou L, Peng W. Deformation analysis of Multilayer Board in the lamination process Proceedings - 2010 11th International Conference On Electronic Packaging Technology and High Density Packaging, Icept-Hdp 2010. 612-615. DOI: 10.1109/ICEPT.2010.5583808  0.6
2010 Zoua J, Moa L, Wu F, Wanga B, Liua H, Zhanga J, Wua Y. Effect of Cu substrate and solder alloy on the formation of kirkendall voids in the solder joints during thermal aging Proceedings - 2010 11th International Conference On Electronic Packaging Technology and High Density Packaging, Icept-Hdp 2010. 944-948. DOI: 10.1109/ICEPT.2010.5582647  0.6
2010 Wang B, Wu F, Wu Y, Liu H, Zhou L, Fang Y. Effect of stand-off height on the microstructure and mechanical behaviour of solder joints Soldering and Surface Mount Technology. 22: 11-18. DOI: 10.1108/09540911011015102  0.6
2010 An B, Cai XH, Wu FS, Wu YP. Preparation of micro-sized and uniform spherical Ag powders by novel wet-chemical method Transactions of Nonferrous Metals Society of China (English Edition). 20: 1550-1554. DOI: 10.1016/S1003-6326(09)60337-X  0.6
2010 Zhou LZ, Liu H, An B, Wu FS, Wu YP. Impact of phosphor layer's geometry on optical properties of high power white LED Guangdianzi Jiguang/Journal of Optoelectronics Laser. 21: 175-177.  0.6
2009 Lv M, Du B, Wu FS, Wang B, Wu YP, Fang YB. Effect of stand-off height on microstructure and tensile strength of solder joints Wuhan Ligong Daxue Xuebao/Journal of Wuhan University of Technology. 31: 33-36. DOI: 10.3963/j.issn.1671-4431.2009.15.010  0.6
2009 Zhang J, Wu FS, Zou J, An B, Liu H. Al/Ni multilayer used as a local heat source for mounting microelectronic components 2009 International Conference On Electronic Packaging Technology and High Density Packaging, Icept-Hdp 2009. 838-842. DOI: 10.1109/ICEPT.2009.5270630  0.6
2009 Cai XH, Chen XC, An B, Wu FS, Wu YP. The effects of bonding parameters on the reliability performance of flexible RFID tag inlays packaged by anisotropic conductive adhesive 2009 International Conference On Electronic Packaging Technology and High Density Packaging, Icept-Hdp 2009. 1054-1058. DOI: 10.1109/ICEPT.2009.5270585  0.6
2009 Du B, Wu F, Wang B, Liu H, An B, Wu Y. Effect of stand-off height on microstructure and tensile strength of cu/sn-8zn-3bi/cu and cu/sn-9zn/cu solder joints Proceedings - Electronic Components and Technology Conference. 1044-1048. DOI: 10.1109/ECTC.2009.5074140  0.6
2009 Cai XH, An B, Wu FS, Wu YP. Assembly of flexible RFID tag inlays with anisotropic conductive paste (ACP) Circuit World. 35: 40-45. DOI: 10.1108/03056120911002406  0.6
2009 Wu F, Wang B, Du B, An B, Wu Y. Effect of stand-off height on microstructure and tensile strength of the Cu/Sn9Zn/Cu solder joint Journal of Electronic Materials. 38: 860-865. DOI: 10.1007/s11664-009-0723-5  0.6
2009 Zhang JS, Xi HJ, Wu YP, Wu FS. Thermomechanical stress and strain in solder joints during electromigration Journal of Electronic Materials. 38: 678-684. DOI: 10.1007/s11664-009-0685-7  0.6
2009 Cai X, Wu Y, An B, Wu F. Preparation of uniform and ball shape Ag powders using sulfuric acid as the stabilizer Fenmo Yejin Jishu/Powder Metallurgy Technology. 27: 361-364.  0.6
2009 Cai X, An B, Wu F, Wu Y. Preparation of an ACA used in RFID tag inlays packaging and its performance Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition). 37: 14-17.  0.6
2008 Wang B, Wu F, Du B, An B, Wu Y. Effect of stand-off height on the microstructure and fracture mode of Cu/Sn-9Zn/Cu solder joint under tensile test Proceedings, 2008 International Conference On Electronic Packaging Technology and High Density Packaging, Icept-Hdp 2008. DOI: 10.1109/ICEPT.2008.4607135  0.6
2008 Xi H, Lou M, An B, Wu F, Wu Y. Evaluate anti-shock property of solder bumps by impact test Proceedings, 2008 International Conference On Electronic Packaging Technology and High Density Packaging, Icept-Hdp 2008. DOI: 10.1109/ICEPT.2008.4607126  0.6
2008 Cai XH, An B, Wu YP, Wu FS, Lai XW. Research on the contact resistance and reliability of flexible RFID tag inlays packaged by anisotropic conductive paste Proceedings, 2008 International Conference On Electronic Packaging Technology and High Density Packaging, Icept-Hdp 2008. DOI: 10.1109/ICEPT.2008.4606959  0.6
2008 Chen Q, Wu YP, Wu FS, Zhu ZJ, Tao Y. Thermo and mechanical study on integrated high-density packaging Proceedings, 2008 International Conference On Electronic Packaging Technology and High Density Packaging, Icept-Hdp 2008. DOI: 10.1109/ICEPT.2008.4606958  0.6
2008 An B, Wu Y, Cai X, Wu F. Reliability of RFID tag inlay assembled by anisotropic conductive adhesive Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, Estc. 1203-1207. DOI: 10.1109/ESTC.2008.4684524  0.6
2008 Wu F, Wang B, Du B, An B, Wu Y. Effect of stand-off height on microstructure and tensile strength of Cu/Sn9Zn/Cu Solder Joint 10th Electronics Packaging Technology Conference, Eptc 2008. 494-498. DOI: 10.1109/EPTC.2008.4763482  0.6
2008 Zhang JS, Chan YC, Wu YP, Xi HJ, Wu FS. Electromigration of Pb-free solder under a low level of current density Journal of Alloys and Compounds. 458: 492-499. DOI: 10.1016/j.jallcom.2007.04.040  0.6
2008 Hua L, An B, Wu FS, Wu YP. Determination and factor analysis of trace hexavalent chromium in plastics for RoHS directive Acta Chimica Sinica. 66: 662-668.  0.6
2008 Zhang J, Xi H, Wu Y, Wu F. Electromigration of Cu-Ni/Solder/Ni-Cu structures Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors. 29: 174-178.  0.6
2007 Cai XH, An B, Lai XW, Wu YP, Wu FS. Reliability evaluation on flexible RFID tag inlay packaged by anisotropic conductive adhesive Proceedings of the Electronic Packaging Technology Conference, Eptc. DOI: 10.1109/ICEPT.2007.4441524  0.6
2007 Liu H, Wu F, He M, Zhang J, Yu Y, Wu Y, An B. The study on the interaction of interfacial reactions between UBM/solder and solder/pad in miniature joints Proceedings of the Electronic Packaging Technology Conference, Eptc. DOI: 10.1109/ICEPT.2007.4441505  0.6
2007 Hua L, Wu YP, An B, Chan YC, Wu BY, Wu FS. The determinations of Pb, Cd, Hg, Cr6+, PBBs/PBDEs to comply with RoHS directive Proceedings of the Electronic Packaging Technology Conference, Eptc. DOI: 10.1109/ICEPT.2007.4441478  0.6
2007 Wu F, He M, Wu Y, An B, Zhang W. Effect of interfacial IMCs proportion on the reliability of miniature lead-free solder joint 2006 7th International Conference On Electronics Packaging Technology, Icept '06. DOI: 10.1109/ICEPT.2006.359754  0.6
2007 Chu H, An B, Wu F, Wu Y. RFID tag packaging with anisotropically conductive adhesive 2006 7th International Conference On Electronics Packaging Technology, Icept '06. DOI: 10.1109/ICEPT.2006.359752  0.6
2007 An B, Xu Z, Chen H, Wu F, Wu Y, Osawa Y, Wang J. Solder paste printability tester and method 2006 7th International Conference On Electronics Packaging Technology, Icept '06. DOI: 10.1109/ICEPT.2006.359750  0.6
2007 Zhao B, An B, Wu FS, Wu YP. Effects of heating factors on brittle fractures of solder joints by high speed shear test 2006 7th International Conference On Electronics Packaging Technology, Icept '06. DOI: 10.1109/ICEPT.2006.359661  0.6
2007 Hua L, Wu YP, An B, Wu FS. Lead determination by microwave-assisted inductively coupled plasma optical emission spectrometry for RoHS compliance Proceedings of International Symposium On High Density Packaging and Microsystem Integration 2007, Hdp'07. DOI: 10.1109/HDP.2007.4283604  0.6
2007 An B, Cai XH, Chu HB, Lai XW, Wu FS, Wu YP. Flex reliability of RFID inlays assembled by anisotropic conductive adhesive Proceedings of International Symposium On High Density Packaging and Microsystem Integration 2007, Hdp'07. DOI: 10.1109/HDP.2007.4283562  0.6
2007 Zhang JS, Li JJ, Wu FS, Zhu YC, An B, Wu YP. Behavior of whisker growth from the pure Sn coating under the temperature cycling condition Gongneng Cailiao/Journal of Functional Materials. 38: 1837-1840.  0.6
2007 Wu F, Zhang W, Zhang J, Wu Y. Four-point probe measurement of electromigration failure Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition). 35: 85-88.  0.6
2007 Hua L, An B, Wu YP, Wu FS, Wang J, He JQ. Preparation of electrically conductive filler for anisotropic conductive adhesive Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University. 41: 127-130+138.  0.6
2007 Zhang JS, Wu YP, Zhu YC, Li JJ, Wu FS, An B. Whisker formation on pure Sn coating of leadframe under temperature cycling condition Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University. 41: 62-65.  0.6
2006 An B, Chu HB, He JQ, Wang J, Hua L, Wu FS, Wu YP. Low cost smart labels assembled by anisotropically conductive adhesive 2006 Conference On High Density Microsystem Design and Packaging and Component Failure Analysis, Hdp'06. 228-231.  0.6
2006 Wu FS, He JQ, Wu YP, An B, Wang J, Zhang JS. Preparation of monodisperse polystyrene microspheres for anisotropic conductive film Gongneng Cailiao/Journal of Functional Materials. 37: 1848-1850+1858.  0.6
2006 Wu F, Zhang W, Wu Y, An B. Effects of reflow's cycles on the properties of solder joints with Sn3.5Ag0.5Cu Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition). 34: 97-99.  0.6
2006 Wu Y, Zhang J, Wu F, An B. Electromigration of SnAgCu solder interconnects Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors. 27: 1136-1140.  0.6
2005 Wu FS, Chen L, Wu YP. [Superfine comminution of Glycyrrhiza uralensis roots by vibration mill]. Zhongguo Zhong Yao Za Zhi = Zhongguo Zhongyao Zazhi = China Journal of Chinese Materia Medica. 30: 185-7. PMID 15719634  0.6
2005 Peng DD, Ning YS, Li Y, Hong YH, Wang YD, Wu FF, Li M. [Preparation of monoclonal antibodies against multiple antigens]. Di 1 Jun Yi Da Xue Xue Bao = Academic Journal of the First Medical College of Pla. 25: 40-3. PMID 15683995  0.6
2005 Wu F, Hu Y, Wu Y, An B, Zhang J. The growth behavior of intermetallic compound layer at solder/Cu joint interface during soldering 2005 6th International Conference On Electronics Packaging Technology. 2005. DOI: 10.1109/ICEPT.2005.1564659  0.6
2005 Wu F, Hu Y, Wu Y, An B, Zhang J. A study of thermosonic gold wire bonding onto silver plated copper pad 2005 6th International Conference On Electronics Packaging Technology. 2005. DOI: 10.1109/ICEPT.2005.1564658  0.6
2005 Zhang J, Wu Y, Wu F, An B. Electromigration in Pb-free bumps with different UBM thickness Proceeding of 2005 International Conference On Asian Green Electronics- Design For Manufacturability and Reliability, 2005agec. 2005: 91-95. DOI: 10.1109/AGEC.2005.1452323  0.6
2005 Wu YP, Liu YB, Wu FS, An B, Zhang JS, Chen MH. Sn whisker issues on lead-free finish of electronic devices Gongneng Cailiao/Journal of Functional Materials. 36: 971-974.  0.6
2005 Wu FS, Lu ZL, Wang L, Hu YX, Xie ML. Application of statistical process control in submerged arc welding Hanjie Xuebao/Transactions of the China Welding Institution. 26: 69-72+76.  0.6
2004 Wang L, Wu F, Wu Y, Zhang J. The effect of current crowding on electromigration in lead-free flip chip bump interconnect Proceedings of the Sixth Ieee Cpmt Conference On High Density Microsystem Design and Packaging and Component Failure Analysis, Hdp'04. 224-226.  0.6
2004 Wang L, Wu F, Zhang J, An B, Wu Y. Effects of electromigration on IMC evolution in Pb-free solder joints Proceedings of 2004 International Conference On the Business of Electronic Product Reliability and Liability. 47-49.  0.6
2004 An B, Zheng Z, Wu F, Lu J, Zhang X, Wu Y. Analysis of dynamic behavior of solder reflow by solder ball test Proceedings of 2004 International Conference On the Business of Electronic Product Reliability and Liability. 92-95.  0.6
2004 Zheng Z, Wu Y, Wu F, Zhang J. Preparation of SnPb solder bump by electroplating process Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition). 32: 59-62.  0.6
2004 Wu F, Wang L, Wu Y, Shi Y, Wang S. Study on temperature distribution in the direction of the plate width in DC upset butt welding Zhongguo Jixie Gongcheng/China Mechanical Engineering. 15: 1291.  0.6
2004 Wu F, Chen L, Wu B, Wu Y. Effects of heating factors on the geometry size of unrestricted lead-free joints Proceedings of 2004 International Ieee Conference On the Asian Green Electronics (Agec). 81-85.  0.6
2004 Zhang J, Wu F, Wang L, Wu Y. Effect of current density and geometry structure on Pb-free solder joints electromigration Proceedings of 2004 International Ieee Conference On the Asian Green Electronics (Agec). 77-80.  0.6
2004 Wu F, Wu Y, Wu B, Chen L. Shear strength of flip chip packaging bonded with anisotropic conductive film Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors. 25: 340-345.  0.6
2001 Wu F, Zhang Y, Liu Z, Xie M. The mechanism of the interface split in the flash and the longitudinal crack on the joint surface in DC upset butt welding Huazhong Ligong Daxue Xuebao/Journal Huazhong (Central China) University of Science and Technology. 29: 48-50.  0.6
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