Yuk C. Chan, Ph.D. - Publications

Affiliations: 
2008 The Chinese University of Hong Kong, Hong Kong, Hong Kong 
Area:
1. Drug resistant of pathogenic bacteria. 2. Molecular virology of HIV and HBV.

106 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Leung WP, Chan YC, So CW, Mak TC. Reactivity Study of a Pyridyl-1-azaallylgermanium(I) Dimer: Synthesis of Heavier Ether and Ester Analogues of Germanium. Inorganic Chemistry. PMID 26991426 DOI: 10.1021/acs.inorgchem.6b00026  0.32
2016 Chen G, Huang B, Liu H, Chan YC, Tang Z, Wu F. An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder Soldering and Surface Mount Technology. 28: 84-92. DOI: 10.1108/SSMT-08-2015-0027  0.6
2016 Li Y, Lim ABY, Luo K, Chen Z, Wu F, Chan YC. Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In-48Sn/Cu solder interconnects under current stressing Journal of Alloys and Compounds. 673: 372-382. DOI: 10.1016/j.jallcom.2016.02.244  0.32
2016 Chen G, Wu F, Liu C, Silberschmidt VV, Chan YC. Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets Journal of Alloys and Compounds. 656: 500-509. DOI: 10.1016/j.jallcom.2015.09.178  0.6
2015 Fu YY, Chan YL, Yang MH, Chan YC, Virkki J, Björninen T, Sydänheimo L, Ukkonen L. Experimental study on the washing durability of electro-textile UHF RFID tags Ieee Antennas and Wireless Propagation Letters. 14: 466-469. DOI: 10.1109/LAWP.2014.2368212  0.6
2015 Chan YC, Guo J, Wong EWM, Zukerman M. Performance analysis for overflow loss systems of processor-sharing queues Proceedings - Ieee Infocom. 26: 1409-1417. DOI: 10.1109/INFOCOM.2015.7218518  0.48
2015 Zhang XD, Yang MH, Virkki J, Björninen T, Merilampi S, Sydänheimo L, Chan YC, Ukkonen L. Impact of antenna-fiber alignment and recurrent stretching on the performance of passive UHF RFID tags based on textile antennas Conference Proceedings - 2014 Ieee Mtt-S International Microwave Workshop Series On: Rf and Wireless Technologies For Biomedical and Healthcare Applications, Imws-Bio 2014. DOI: 10.1109/IMWS-BIO.2014.7032384  0.6
2015 Peng H, Huang B, Chen G, Wu F, Liu H, Chan YC. Effect of 0.8 wt% Al2O3 nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint 16th International Conference On Electronic Packaging Technology, Icept 2015. 1014-1017. DOI: 10.1109/ICEPT.2015.7236751  0.6
2015 Hu X, Chan YC. Novel WO3 nanoparticles modified electroless metallization to retard interfacial reaction and reinforce the reliability of solder interconnection Proceedings - Electronic Components and Technology Conference. 2015: 1464-1469. DOI: 10.1109/ECTC.2015.7159790  0.6
2015 Chen G, Wu F, Liu C, Chan YC. Effect of fullerene-C60&C70 on the microstructure and properties of 96.5Sn-3Ag-0.5Cu solder Proceedings - Electronic Components and Technology Conference. 2015: 1262-1267. DOI: 10.1109/ECTC.2015.7159759  0.6
2015 Guo JY, Chan YC, Li Y, Ganguly R, So CW. Oxo-Bridged Bis(group 4 metal unsymmetric phosphonium-stabilized carbene) Complexes Organometallics. 34: 1238-1244. DOI: 10.1021/om5012962  0.32
2015 Leung WP, Chan YC, So CW. Chemistry of Heavier Group 14 Base-Stabilized Heterovinylidenes Organometallics. 34: 2067-2085. DOI: 10.1021/om5011403  0.32
2015 Hu T, Li Y, Chan YC, Wu F. Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn-58Bi solder joints Microelectronics Reliability. 55: 1226-1233. DOI: 10.1016/j.microrel.2015.05.008  0.6
2015 Li Y, Chan YC. Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi-Ag composite solders Journal of Alloys and Compounds. 645: 566-576. DOI: 10.1016/j.jallcom.2015.05.023  0.6
2015 Li Y, Wu F, Chan YC. Electromigration in eutectic In-48Sn ball grid array (BGA) solder interconnections with Au/Ni/Cu pads Journal of Materials Science: Materials in Electronics. 26: 8522-8533. DOI: 10.1007/s10854-015-3524-z  0.6
2015 Gain AK, Zhang L, Chan YC. Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates Journal of Materials Science: Materials in Electronics. DOI: 10.1007/s10854-015-3325-4  0.6
2015 Sun H, Chan YC, Wu F. The impact of reflow soldering induced dopant redistribution on the mechanical properties of CNTs doped Sn58Bi solder joints Journal of Materials Science: Materials in Electronics. 26: 5318-5325. DOI: 10.1007/s10854-015-3071-7  0.6
2015 Sun H, Chan YC, Wu F. Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints Journal of Materials Science: Materials in Electronics. 26: 5129-5134. DOI: 10.1007/s10854-015-3040-1  0.6
2015 Chan YC, Li Y, Ganguly R, So CW. Acyclic Amido-Containing Silanechalcogenones European Journal of Inorganic Chemistry. 2015: 3821-3824. DOI: 10.1002/ejic.201500108  0.32
2015 Leung WP, Kan KW, Chan YC, Mak TCW. Reactivity study of a chlorostannylene derived from bis(iminophosphoranyl)methane European Journal of Inorganic Chemistry. 2014: 3191-3199. DOI: 10.1002/ejic.201402074  0.32
2015 Long F, Zhang XD, Bjorninen T, Virkki J, Sydanheimo L, Chan YC, Ukkonen L. Implementation and wireless readout of passive UHF RFID strain sensor tags based on electro-textile antennas 2015 9th European Conference On Antennas and Propagation, Eucap 2015 0.6
2014 Hu X, Chan YC. Reinforced solder joint performance by incorporation of ZrO2 nanoparticles in electroless Ni-P composite layer Journal of Materials Research. 29: 2657-2666. DOI: 10.1557/jmr.2014.310  0.6
2014 Hu X, Chan YC. Electroless Ni-P-ZrO2 metallization for lead-free solder interconnection Proceedings of the Electronic Packaging Technology Conference, Eptc. 820-824. DOI: 10.1109/ICEPT.2014.6922774  0.6
2014 Tangf QY, Sun HY, Pan YM, Chan YC, Leung KW. Fabrication and characterizations of frequency-tunable soft composite antennas for wireless sensing 8th European Conference On Antennas and Propagation, Eucap 2014. 2978-2980. DOI: 10.1109/EuCAP.2014.6902453  0.6
2014 Li Y, Chan YC, Zhao X. Effect of pad shape on electromigration in solder bump joints Proceedings of the 5th Electronics System-Integration Technology Conference, Estc 2014. DOI: 10.1109/ESTC.2014.6962849  0.6
2014 Sun H, Chan YC. Drawbacks of the nanoparticle reinforced lead-free BGA solder joints Proceedings of the 5th Electronics System-Integration Technology Conference, Estc 2014. DOI: 10.1109/ESTC.2014.6962816  0.6
2014 Fouzder T, Chan YC, Chan DK. Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates Proceedings of the 16th Electronics Packaging Technology Conference, Eptc 2014. 69-74. DOI: 10.1109/EPTC.2014.7028281  0.6
2014 Xu S, Chan YC, Zhu X, Lu H, Bailey C. Effective method to disperse and incorporate Carbon nanotubes in electroless Ni-P deposits Proceedings - Electronic Components and Technology Conference. 1342-1347. DOI: 10.1109/ECTC.2014.6897466  0.6
2014 Zhu X, Kotadia H, Xu S, Lu H, Mannan SH, Bailey C, Chan YC. Electromigration in Sn-Ag solder thin films under high current density Thin Solid Films. 565: 193-201. DOI: 10.1016/j.tsf.2014.06.030  0.6
2014 Hu X, Xu S, Yang Y, Chen Z, Chan YC. Effect of TiO2 nanoparticle addition on electroless Ni-P under bump metallization for lead-free solder interconnection Materials Science and Engineering A. 600: 67-75. DOI: 10.1016/j.msea.2014.02.011  0.6
2014 Gain AK, Chan YC. Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solders Microelectronics Reliability. 54: 945-955. DOI: 10.1016/j.microrel.2014.01.026  0.6
2014 Virkki J, Björninen T, Kellomäki T, Merilampi S, Shafiq I, Ukkonen L, Sydänheimo L, Chan YC. Reliability of washable wearable screen printed UHF RFID tags Microelectronics Reliability. 54: 840-846. DOI: 10.1016/j.microrel.2013.12.011  0.6
2014 Li Q, Chan YC, Zhang K, Yung KC. Study of microstructure evolution in novel Sn-Zn/Cu bi-layer and Cu/Sn-Zn/Cu sandwich structures with nanoscale thickness for 3D packaging interconnection Microelectronic Engineering. 122: 52-58. DOI: 10.1016/j.mee.2014.03.002  0.6
2014 Xu S, Chan YC, Zhang K, Yung KC. Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing Journal of Alloys and Compounds. 595: 92-102. DOI: 10.1016/j.jallcom.2014.01.083  0.6
2014 Fouzder T, Chan YC, Chan DK. Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates Journal of Materials Science: Materials in Electronics. 25: 5375-5387. DOI: 10.1007/s10854-014-2316-1  0.6
2014 Sun H, Li Q, Chan YC. A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints Journal of Materials Science: Materials in Electronics. 25: 4380-4390. DOI: 10.1007/s10854-014-2177-7  0.6
2014 Fouzder T, Li Q, Chan YC, Chan DK. Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin-silver-copper (Sn-Ag-Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates Journal of Materials Science: Materials in Electronics. 25: 4012-4023. DOI: 10.1007/s10854-014-2123-8  0.6
2014 Xu S, Hu X, Yang Y, Chen Z, Chan YC. Effect of carbon nanotubes and their dispersion on electroless Ni-P under bump metallization for lead-free solder interconnection Journal of Materials Science: Materials in Electronics. 25: 2686-2691. DOI: 10.1007/s10854-014-1929-8  0.6
2014 Fouzder T, Li Q, Chan YC, Chan DK. Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates Journal of Materials Science: Materials in Electronics. 25: 2529-2539. DOI: 10.1007/s10854-014-1906-2  0.6
2014 Wu N, Ismathullakhan S, Chan YC. Effect of 1 wt% ZnO nanoparticles addition on the microstructure, IMC development, and mechanical properties of high Bi content Sn-57.6Bi-0.4Ag solder on Ni metalized Cu pads Journal of Materials Science: Materials in Electronics. 25: 2169-2176. DOI: 10.1007/s10854-014-1855-9  0.6
2014 Li Q, Chan YC, Chen Z. Tin whiskers growth of SnAgIn solder on Kovar substrate with Au/Ni plating Journal of Materials Science: Materials in Electronics. 25: 1222-1227. DOI: 10.1007/s10854-014-1713-9  0.6
2013 Zhu X, Kotadia H, Xu S, Lu H, Mannan SH, Bailey C, Chan YC. Electromigration aware design for nano-packaging Proceedings of the Ieee Conference On Nanotechnology. 24-29. DOI: 10.1109/NANO.2013.6720970  0.6
2013 Zhu X, Kotadia H, Xu S, Lu H, Mannan SH, Bailey C, Chan YC. Comments on electromigration analysis methods Proceedings - 2013 14th International Conference On Electronic Packaging Technology, Icept 2013. 529-534. DOI: 10.1109/ICEPT.2013.6756527  0.6
2013 Yin CY, Lu H, Bailey C, Chan YC. Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications Microelectronic Engineering. 107: 17-22. DOI: 10.1016/j.mee.2013.02.070  0.6
2013 Leung WS, Chan YC, Lui SM. A study of degradation of indium tin oxide thin films on glass for display applications Microelectronic Engineering. 101: 1-7. DOI: 10.1016/j.mee.2012.08.002  0.6
2013 Hua X, Chan YC, Zhang K, Yung KC. Effect of graphene doping on microstructural and mechanical properties of Sn-8Zn-3Bi solder joints together with electromigration analysis Journal of Alloys and Compounds. 580: 162-171. DOI: 10.1016/j.jallcom.2013.05.124  0.6
2013 Li Q, Chan YC. Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn-Cu binary and Cu-Sn-Cu sandwich structures Journal of Alloys and Compounds. 567: 47-53. DOI: 10.1016/j.jallcom.2013.03.093  0.6
2013 Shafiq I, Lau HY, Chan YC. Effect of trace diamond nanoparticle addition on the interfacial, mechanical, and damping properties of Sn-3.0Ag-0.5Cu solder alloy Journal of Electronic Materials. 42: 2835-2847. DOI: 10.1007/s11664-013-2638-4  0.6
2013 Ismathullakhan S, Lau H, Chan YC. Enhanced electromigration reliability via Ag nanoparticles modified eutectic Sn-58Bi solder joint Microsystem Technologies. 19: 1069-1080. DOI: 10.1007/s00542-012-1701-z  0.6
2012 Ullah Z, Jaiswal MK, Chan YC, Cheung RCC. FPGA implementation of SRAM-based ternary content addressable memory Proceedings of the 2012 Ieee 26th International Parallel and Distributed Processing Symposium Workshops, Ipdpsw 2012. 383-389. DOI: 10.1109/IPDPSW.2012.47  0.6
2012 Qin P, Hu X, Chan YC. Influence of diamond additions on lead-free Sn-Zn-Bi Solder-alloys 2012 4th Electronic System-Integration Technology Conference, Estc 2012. DOI: 10.1109/ESTC.2012.6542091  0.6
2012 Hu X, Qin P, Chan YC. Reinforced performance of lead-free Sn-8Zn-3Bi Solder With Doping of 0.03 wt.% C60 on Cu Pads 2012 4th Electronic System-Integration Technology Conference, Estc 2012. DOI: 10.1109/ESTC.2012.6542075  0.6
2012 Fouzder T, Chan YC, Chan DK. Microstructure and plating thickness analysis of different surface finished plated printed circuit boards Proceedings of the 2012 Ieee 14th Electronics Packaging Technology Conference, Eptc 2012. 1-3. DOI: 10.1109/EPTC.2012.6507039  0.6
2012 Xu S, Zhu X, Kotadia H, Lu H, Mannan SH, Bailey C, Chan YC. Remedies to control electromigration: Effects of CNT doped Sn-Ag-Cu interconnects Proceedings - Electronic Components and Technology Conference. 1899-1904. DOI: 10.1109/ECTC.2012.6249097  0.6
2012 Zhang HZ, Tang QY, Chan YC. Development of a versatile capacitive tactile sensor based on transparent flexible materials integrating an excellent sensitivity and a high resolution Aip Advances. 2. DOI: 10.1063/1.4706011  0.6
2012 Tang QY, Pan YM, Chan YC, Leung KW. Frequency-tunable soft composite antennas for wireless sensing Sensors and Actuators, a: Physical. 179: 137-145. DOI: 10.1016/j.sna.2012.03.024  0.6
2012 Gain AK, Chan YC. The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn-Ag-Cu solder on OSP-Cu pads Intermetallics. 29: 48-55. DOI: 10.1016/j.intermet.2012.04.019  0.6
2012 Shafiq I, Chan YC, Wong NB, Yung WKC. Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy Journal of Materials Science: Materials in Electronics. 23: 1427-1434. DOI: 10.1007/s10854-011-0608-2  0.6
2011 Yang D, Chan YC, Pecht M. Electromigration in flip-chip solder joints Electromigration in Thin Films and Electronic Devices: Materials and Reliability. 285-329. DOI: 10.1533/9780857093752.3.285  0.6
2011 Shafiq I, Chan YC. Improved electro-migration resistance in nano Ag modified Sn-58Bi solder joints under current stressing Icqr2mse 2011 - Proceedings of 2011 International Conference On Quality, Reliability, Risk, Maintenance, and Safety Engineering. 374-379. DOI: 10.1109/ICQR2MSE.2011.5976634  0.6
2011 Zhu X, Kotadia H, Xu S, Lu H, Mannan SH, Chan YC, Bailey C. Multi-physics computer simulation of the electromigration phenomenon Icept-Hdp 2011 Proceedings - 2011 International Conference On Electronic Packaging Technology and High Density Packaging. 448-452. DOI: 10.1109/ICEPT.2011.6066874  0.6
2011 Qin P, Li Q, Chan YC. Thermal analysis of high brightness flip-chip LED packages 2011 Ieee 13th Electronics Packaging Technology Conference, Eptc 2011. 722-725. DOI: 10.1109/EPTC.2011.6184513  0.6
2011 Li Q, Chan YC, Ismathullakhan S. Growth characteristic study of intermetallic compounds growth in nanoscale-thickness Cu/Sn/Cu sandwich structure 2011 Ieee 13th Electronics Packaging Technology Conference, Eptc 2011. 289-293. DOI: 10.1109/EPTC.2011.6184433  0.6
2011 Shafiq I, Chan YC. Efficient field emission and optical properties of In-doped cadmium sulphide nanopens and nanopencils Micro and Nano Letters. 6: 732-736. DOI: 10.1049/mnl.2011.0321  0.6
2011 Tang QY, Chan YC, Zhang K. Fast response resistive humidity sensitivity of polyimide/multiwall carbon nanotube composite films Sensors and Actuators, B: Chemical. 152: 99-106. DOI: 10.1016/j.snb.2010.09.016  0.6
2011 Gain AK, Chan YC, Yung WKC. Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads Microelectronics Reliability. 51: 2306-2313. DOI: 10.1016/j.microrel.2011.03.042  0.6
2011 Gain AK, Chan YC, Yung WKC. Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates Microelectronics Reliability. 51: 975-984. DOI: 10.1016/j.microrel.2011.01.006  0.6
2011 Gain AK, Fouzder T, Chan YC, Yung WKC. Microstructure, kinetic analysis and hardness of Sn-Ag-Cu-1 wt% nano-ZrO2 composite solder on OSP-Cu pads Journal of Alloys and Compounds. 509: 3319-3325. DOI: 10.1016/j.jallcom.2010.12.048  0.6
2011 Fouzder T, Shafiq I, Chan YC, Sharif A, Yung WKC. Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads Journal of Alloys and Compounds. 509: 1885-1892. DOI: 10.1016/j.jallcom.2010.10.081  0.6
2011 Gu X, Yung KC, Chan YC, Yang D. Thermomigration and electromigration in Sn8Zn3Bi solder joints Journal of Materials Science: Materials in Electronics. 22: 217-222. DOI: 10.1007/s10854-010-0116-9  0.6
2011 Shafiq I, Chan YC, Xu S, Li QQ. Electro-migration study of nano Al doped lead-free Sn-58Bi on Cu and Au/Ni/Cu ball grid array (BGA) packages Empc-2011 - 18th European Microelectronics and Packaging Conference, Proceedings 0.6
2010 Tang QY, Shafiq I, Chan YC, Wong NB, Cheung R. Study of the dispersion and electrical properties of carbon nanotubes treated by surfactants in dimethylacetamide Journal of Nanoscience and Nanotechnology. 10: 4967-4974. DOI: 10.1166/jnn.2010.2224  0.6
2010 Tang QY, Chan YC. Fast-response polyimide/multiwall carbon nanotube composite films for monitoring humidity in microelectronic packages 2010 12th Electronics Packaging Technology Conference, Eptc 2010. 265-268. DOI: 10.1109/EPTC.2010.5702645  0.6
2010 Dou G, Whalley DC, Liu C, Chan YC. An experimental methodology for the study of co-planarity variation effects in anisotropic conductive adhesive assemblies Soldering and Surface Mount Technology. 22: 47-55. DOI: 10.1108/09540911011015148  0.6
2010 Tang QY, Chen J, Chan YC, Chung CY. Effect of carbon nanotubes and their dispersion on thermal curing of polyimide precursors Polymer Degradation and Stability. 95: 1672-1678. DOI: 10.1016/j.polymdegradstab.2010.05.023  0.6
2010 Chan YC, Yang D. Failure mechanisms of solder interconnects under current stressing in advanced electronic packages Progress in Materials Science. 55: 428-475. DOI: 10.1016/j.pmatsci.2010.01.001  0.6
2010 Fouzder T, Gain AK, Chan YC, Sharif A, Yung WKC. Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads Microelectronics Reliability. 50: 2051-2058. DOI: 10.1016/j.microrel.2010.06.013  0.6
2010 Ahmed M, Fouzder T, Sharif A, Gain AK, Chan YC. Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy Microelectronics Reliability. 50: 1134-1141. DOI: 10.1016/j.microrel.2010.03.017  0.6
2010 Gain AK, Fouzder T, Chan YC, Sharif A, Wong NB, Yung WKC. The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn-Ag-Cu solder on Au/Ni metallized Cu pads Journal of Alloys and Compounds. 506: 216-223. DOI: 10.1016/j.jallcom.2010.06.180  0.6
2010 Gain AK, Fouzder T, Chan YC, Sharif A, Yung WKC. Investigation of small Sn-3.5Ag-0.5Cu additions on the microstructure and properties of Sn-8Zn-3Bi solder on Au/Ni/Cu pads Journal of Alloys and Compounds. 489: 678-684. DOI: 10.1016/j.jallcom.2009.09.150  0.6
2010 Gu X, Yung KC, Chan YC. Thermomigration and electromigration in Sn58Bi ball grid array solder joints Journal of Materials Science: Materials in Electronics. 21: 1090-1098. DOI: 10.1007/s10854-009-9992-2  0.6
2010 Tang QY, Chan YC, Wong NB, Cheungc R. Surfactant-assisted processing of polyimide/multiwall carbon nanotube nanocomposites formicroelectronics applications Polymer International. 59: 1240-1245. DOI: 10.1002/pi.2855  0.6
2009 Hua L, Chan YC, Wu YP, Wu BY. The determination of hexavalent chromium (Cr6+) in electronic and electrical components and products to comply with RoHS regulations. Journal of Hazardous Materials. 163: 1360-8. PMID 18838223 DOI: 10.1016/j.jhazmat.2008.07.150  0.6
2009 Alam MO, Lu H, Bailey C, Chan YC. Finite-element simulation of stress intensity factors in solder joint intermetallic compounds Ieee Transactions On Device and Materials Reliability. 9: 40-48. DOI: 10.1109/TDMR.2008.2010595  0.6
2009 Gaina AK, Chan YC, Sharif A, Yung WKC. Effect of small Sn-Ag-Cu additions on structure and properties of Sn-Zn-Bi solder/BGA during as-soldered and as-aged conditions Proceedings - Electronic Components and Technology Conference. 1021-1026. DOI: 10.1109/ECTC.2009.5074137  0.6
2009 Gu X, Chan YC. Thermomigration and electromigration in Sn58Bi solder joints Journal of Applied Physics. 105. DOI: 10.1063/1.3125458  0.6
2009 Gain AK, Chan YC, Yung WKC. Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages Materials Science and Engineering B: Solid-State Materials For Advanced Technology. 162: 92-98. DOI: 10.1016/j.mseb.2009.03.010  0.6
2009 Gain AK, Chan YC, Sharif A, Wong NB, Yung WKC. Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages Microelectronics Reliability. 49: 746-753. DOI: 10.1016/j.microrel.2009.05.004  0.6
2009 Shen J, Chan YC. Research advances in nano-composite solders Microelectronics Reliability. 49: 223-234. DOI: 10.1016/j.microrel.2008.10.004  0.6
2009 Gain AK, Chan YC, Sharif A, Yung WKC. Effect of small Sn-3.5Ag-0.5Cu additions on the structure and properties of Sn-9Zn solder in ball grid array packages Microelectronic Engineering. 86: 2347-2353. DOI: 10.1016/j.mee.2009.04.015  0.6
2009 Das SK, Sharif A, Chan YC, Wong NB, Yung WKC. Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads Microelectronic Engineering. 86: 2086-2093. DOI: 10.1016/j.mee.2009.01.087  0.6
2009 Das SK, Sharif A, Chan YC, Wong NB, Yung WKC. Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn-9Zn binary eutectic solder alloy Journal of Alloys and Compounds. 481: 167-172. DOI: 10.1016/j.jallcom.2009.03.017  0.6
2009 Shen J, Chan YC. Effect of metal/ceramic nanoparticle-doped fluxes on the wettability between Sn-Ag-Cu solder and a Cu layer Journal of Alloys and Compounds. 477: 909-914. DOI: 10.1016/j.jallcom.2008.11.015  0.6
2009 Shen J, Chan YC. Effects of ZrO2 nanoparticles on the mechanical properties of Sn-Zn solder joints on Au/Ni/Cu pads Journal of Alloys and Compounds. 477: 552-559. DOI: 10.1016/j.jallcom.2008.10.140  0.6
2009 Gu X, Chan YC, Yang D, Wu BY. The shearing behavior and microstructure of Sn-4Ag-0.5Cu solder joints on a Ni-P-carbon nanotubes composite coating Journal of Alloys and Compounds. 468: 553-557. DOI: 10.1016/j.jallcom.2008.01.080  0.6
2009 Alam MO, Lu H, Bailey C, Chan YC. Fracture mechanics analysis of solder joint intermetallic compounds in shear test Computational Materials Science. 45: 576-583. DOI: 10.1016/j.commatsci.2008.12.001  0.6
2009 Shen J, Chan YC, Liu SY. Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction Acta Materialia. 57: 5196-5206. DOI: 10.1016/j.actamat.2009.07.021  0.6
2009 Tang QY, Chan YC, Wong NB. Investigation of polyimide/carbon nanotube nanocomposites for high temperature electronic packaging applications Proceedings - 2009 Imaps International Conference On High Temperature Electronics Network, Hiten 2009. 110-115.  0.6
2008 Alam MO, Chan YC. Effect of 0.5 wt% Cu in Sn-3.5%Ag solder to retard interfacial reactions with the electroless Ni-P metallization for BGA solder joints application Ieee Transactions On Components and Packaging Technologies. 31: 431-438. DOI: 10.1109/TCAPT.2008.921641  0.6
2008 Kumar S, Torres M, Chan YC, Pecht M. A hybrid prognostics methodology for electronic products Proceedings of the International Joint Conference On Neural Networks. 3479-3485. DOI: 10.1109/IJCNN.2008.4634294  0.6
2008 Gain AK, Chan YC, Yung KC, Sharif A, Ali L. Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, Estc. 1291-1294. DOI: 10.1109/ESTC.2008.4684540  0.6
2008 Ying KT, Stoyanov S, Bailey C, Chan YC. Uncertainty analysis to minimise risk in designing micro-electronics manufacturing processes Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, Estc. 941-946. DOI: 10.1109/ESTC.2008.4684478  0.6
2008 Gu X, Chan YC. Microstructural evolution by electromigration in line-type Cu/SnBi/Cu solder joint Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, Estc. 885-890. DOI: 10.1109/ESTC.2008.4684469  0.6
2008 Alam MO, Lu H, Bailey C, Chan YC. Fracture mechanics analysis of cracks in solder joint intermetallic compounds Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, Estc. 757-762. DOI: 10.1109/ESTC.2008.4684445  0.6
2008 Ali L, Chan YC. Impact of RoHS/WEEE- on effective recycling- electronics system integration Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, Estc. 521-524. DOI: 10.1109/ESTC.2008.4684403  0.6
2008 Leung WS, Chan YC, Lui SM. Corrosion reliability study of indium tin oxide (ITO) for chip-on-glass (COG) Proceedings of 2008 Asia Pacific Microwave Conference, Apmc 2008. DOI: 10.1109/APMC.2008.4958130  0.6
Show low-probability matches.