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Yu-Ting Cheng, Ph.D. - Publications

Affiliations: 
2000 University of Michigan, Ann Arbor, Ann Arbor, MI 
Area:
micromachining technologies, micromachined sensors, actuators, and MEMS; analog integrated circuits; implantable biomedical microsystems; micropackaging; and low-power wireless sensing/actuating systems
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13 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Cheng YH, Zhang CY, Ren J, Tong KY. Hydrogen storage in Li-doped fullerene-intercalated hexagonal boron nitrogen layers Frontiers of Physics. 11. DOI: 10.1007/s11467-016-0559-4  0.349
2013 Wang C, Lee I, Wu C, Cheng Y, Yang P, Cheng H. High-performance polycrystalline silicon thin-film transistors prepared via the laser crystallization of the prepatterned channel layer on the bottom-gate structure Thin Solid Films. 529: 421-425. DOI: 10.1016/J.Tsf.2012.09.048  0.317
2012 Wang CL, Lee IC, Wu CY, Liao CY, Cheng YT, Cheng HC. High-performance polycrystalline silicon thin-film transistors with two-dimensional location control of the grain boundary via excimer laser crystallization. Journal of Nanoscience and Nanotechnology. 12: 5505-9. PMID 22966599 DOI: 10.1166/Jnn.2012.6308  0.305
2012 Wang C, Cheng H, Lee I, Wu C, Cheng Y, Yang P. High-performance excimer-laser-crystallized polycrystalline silicon thin-film transistors with the pre-patterned recessed channel Japanese Journal of Applied Physics. 51: 66502. DOI: 10.1143/Jjap.51.066502  0.305
2012 Wang C, Lee I, Wu C, Chou C, Yang P, Cheng Y, Cheng H. High-Performance Polycrystalline-Silicon Nanowire Thin-Film Transistors With Location-Controlled Grain Boundary via Excimer Laser Crystallization Ieee Electron Device Letters. 33: 1562-1564. DOI: 10.1109/Led.2012.2211857  0.304
2010 Chao T, Li C, Chen YC, Chen H, Cheng Y, Kuo C. An Interconnecting Technology for RF MEMS Heterogeneous Chip Integration Ieee Transactions On Electron Devices. 57: 928-938. DOI: 10.1109/Ted.2010.2040660  0.304
2009 Liu CM, Tseng YC, Chen C, Hsu MC, Chao TY, Cheng YT. Superparamagnetic and ferromagnetic Ni nanorod arrays fabricated on Si substrates using electroless deposition. Nanotechnology. 20: 415703. PMID 19762942 DOI: 10.1088/0957-4484/20/41/415703  0.312
2007 Kou CT, Chao TY, Chiang IT, Cheng Y. Wafer level fabrication of hermetically sealed microcavity with robust metal interconnects for chip cooling application Sensors and Actuators a-Physical. 139: 259-264. DOI: 10.1016/J.Sna.2006.10.043  0.311
2006 Tsai L, Cheng Y, Hsu W, Fang W. Ni-carbon nanotubes nanocomposite for robust microelectromechanical systems fabrication Journal of Vacuum Science & Technology B. 24: 205-210. DOI: 10.1116/1.2161222  0.317
2006 Liang Z, Cheng Y, Hsu W, Lee Y. A wafer-level hermetic encapsulation for MEMS manufacture application Ieee Transactions On Advanced Packaging. 29: 513-519. DOI: 10.1109/Tadvp.2006.875092  0.305
2006 Tsai L, Shen G, Cheng Y, Hsu W. Performance improvement of an electrothermal microactuator fabricated using Ni-diamond nanocomposite Ieee\/Asme Journal of Microelectromechanical Systems. 15: 149-158. DOI: 10.1109/Jmems.2005.863737  0.324
2005 Shen G, Cheng Y, Tsai L. Synthesis and characterization of Ni-P-CNT's nanocomposite film for MEMS applications Ieee Transactions On Nanotechnology. 4: 539-547. DOI: 10.1109/Tnano.2005.851397  0.321
2005 Teh KS, Cheng YT, Lin L. MEMS fabrication based on nickel-nanocomposite: Film deposition and characterization Journal of Micromechanics and Microengineering. 15: 2205-2215. DOI: 10.1088/0960-1317/15/12/001  0.324
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