| Year |
Citation |
Score |
| 2016 |
Costa M, Wang H, Hu J, Wu R, Na SM, Chun H, Flatau AB. Orientation dependences of surface morphologies and energies of iron-gallium alloys Surface Science. 647: 26-32. DOI: 10.1016/J.Susc.2015.11.023 |
0.449 |
|
| 2011 |
Chun H, Na S, Yoo J, Wuttig M, Flatau AB. Publisher’s Note: “Tension and strain annealing for abnormal grain growth in magnetostrictive Galfenol rolled sheet” [J. Appl. Phys. 109, 07A941 (2011)] Journal of Applied Physics. 110: 039905. DOI: 10.1063/1.3617344 |
0.505 |
|
| 2011 |
Chun H, Na SM, Yoo JH, Wuttig M, Flatau AB. Tension and strain annealing for abnormal grain growth in magnetostrictive Galfenol rolled sheet Journal of Applied Physics. 109. DOI: 10.1063/1.3565419 |
0.529 |
|
| 2010 |
Chun H, Na S, Mudivarthi C, Flatau AB. The role of misorientation and coincident site lattice boundaries in Goss-textured Galfenol rolled sheet Journal of Applied Physics. 107: 09A960. DOI: 10.1063/1.3371686 |
0.51 |
|
| 2009 |
Yoon J, Chun H, Jung S. Liquid-state and solid-state interfacial reactions of fluxless-bonded Au–20Sn/ENIG solder joint Journal of Alloys and Compounds. 469: 108-115. DOI: 10.1016/J.Jallcom.2008.01.077 |
0.417 |
|
| 2008 |
Yoon J, Chun H, Jung S. Reliability evaluation of Au–20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 473: 119-125. DOI: 10.1016/J.Msea.2007.03.050 |
0.399 |
|
| 2008 |
Yoon J, Chun H, Jung S. Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing. 483: 731-734. DOI: 10.1016/J.Msea.2006.09.162 |
0.393 |
|
| 2008 |
Yoon J, Chun H, Noh B, Koo J, Kim J, Lee H, Jung S. Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method Microelectronics Reliability. 48: 1857-1863. DOI: 10.1016/J.Microrel.2008.09.008 |
0.406 |
|
| 2007 |
Yoon J, Chun H, Lee H, Jung S. Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging Journal of Materials Research. 22: 2817-2824. DOI: 10.1557/Jmr.2007.0352 |
0.396 |
|
| 2007 |
Yoon J, Chun H, Jung S. Reliability analysis of Au–Sn flip-chip solder bump fabricated by co-electroplating Journal of Materials Research. 22: 1219-1229. DOI: 10.1557/Jmr.2007.0145 |
0.426 |
|
| 2007 |
Yoon J, Chun H, Kang H, Park M, Yang C, Lee H, Jung S. Morphology, Thermal Stability, And Solderability Of Electroless Nickel–Phosphorus Plating Layer Surface Review and Letters. 14: 827-832. DOI: 10.1142/S0218625X07010111 |
0.35 |
|
| 2007 |
Yoon J, Chun H, Koo J, Lee H, Jung S. Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions Scripta Materialia. 56: 661-664. DOI: 10.1016/J.Scriptamat.2006.12.031 |
0.402 |
|
| 2007 |
Chun H, Yoon J, Jung S. Solid-state interfacial reactions between Sn–3.5Ag–0.7Cu solder and electroless Ni-immersion Au substrate during high temperature storage test Journal of Alloys and Compounds. 439: 91-96. DOI: 10.1016/J.Jallcom.2006.08.240 |
0.411 |
|
| 2007 |
Yoon J, Chun H, Jung S. Investigation of interfacial reaction and joint reliability between eutectic Sn-3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test Journal of Materials Science: Materials in Electronics. 18: 559-567. DOI: 10.1007/S10854-006-9085-4 |
0.428 |
|
| 2005 |
Yoon J, Chun H, Jung S. Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging Materials Transactions. 46: 2386-2393. DOI: 10.2320/Matertrans.46.2386 |
0.416 |
|
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