Jongpil Cheong, Ph.D. - Publications
Affiliations: | 2005 | Pennsylvania State University, State College, PA, United States |
Area:
Mechanical EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2005 | Cheong J, Goyal A, Tadigadapa SA, Rahn CD. Fabrication and performance of a flextensional microactuator Journal of Micromechanics and Microengineering. 15: 1947-1955. DOI: 10.1088/0960-1317/15/10/022 | 0.636 | |||
2004 | Cheong J, Goyal A, Tadigadapa S, Rahn C. Reliable bonding using indium-based solders Proceedings of Spie. 5343: 114-120. DOI: 10.1117/12.524823 | 0.615 | |||
2004 | Cheong J, Tadigadapa SA, Rahn CD. Piezoelectric microflextensional actuator Proceedings of Spie. 5344: 106-114. DOI: 10.1117/12.524817 | 0.58 | |||
2004 | Goyal A, Cheong J, Tadigadapa S. Tin-based solder bonding for MEMS fabrication and packaging applications Journal of Micromechanics and Microengineering. 14: 819-825. DOI: 10.1088/0960-1317/14/6/009 | 0.641 | |||
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