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Zhonglin Li, Ph.D. - Publications

Affiliations: 
2005 University of Arizona, Tucson, AZ 
Area:
Chemical Engineering
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8 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2006 Li Z, Lee H, Borucki L, Rogers C, Kikuma R, Rikita N, Nagasawa K, Philipossian A. Effects of disk design and kinematics of conditioners on process hydrodynamics during copper CMP Journal of the Electrochemical Society. 153. DOI: 10.1149/1.2177067  0.609
2006 Lee H, Seike Y, Li Z, Zhuang Y, Takaoka M, Miyachi K, Philipossian A. Characterization of slurry residues in pad grooves for diamond disc and high pressure micro jet pad conditioning processes Japanese Journal of Applied Physics, Part 2: Letters. 45. DOI: 10.1143/Jjap.45.L1325  0.623
2005 Zhuang Y, Li Z, Shimazu Y, Uotani N, Borucki L, Philipossian A. Experimental and numerical analysis of an inhibitor-containing slurry for copper chemical mechanical planarization Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers. 44: 82-86. DOI: 10.1143/Jjap.44.82  0.626
2004 Borucki L, Li Z, Philipossian A. Experimental and theoretical investigation of heating and convection in copper polishing Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1774489  0.61
2004 Li Z, Borucki L, Koshiyama I, Philipossian A. Effect of slurry flow rate on tribological, thermal, and removal rate attributes of copper CMP Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1758818  0.588
2004 Sorooshian J, DeNardis D, Charns L, Li Z, Shadman F, Boning D, Hetherington D, Philipossian A. Arrhenius Characterization of ILD and Copper CMP Processes Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1635388  0.503
2003 Li Z, Ina K, Lefevre P, Philipossian A. Determining the effects of slurry surfactant, abrasive size and abrasive content on the tribology and kientics of copper CMP Proceedings - Electrochemical Society. 21: 92-103. DOI: 10.1149/1.1869974  0.597
2003 Li Z, Rader S, Lefevre P, Ina K, Boning D, Philipossian A. Comparison of copper disc and copper wafer polishing processes in terms of their kinetic, tribological and thermal characteristics Proceedings - Electrochemical Society. 21: 35-43. DOI: 10.1109/Tsm.2005.858522  0.621
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