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Karthik K. Bodla, Ph.D. - Publications

Affiliations: 
2013 Mechanical Engineering Purdue University, West Lafayette, IN, United States 
Area:
Mechanical Engineering
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16 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2015 Diani A, Bodla KK, Rossetto L, Garimella SV. Numerical investigation of pressure drop and heat transfer through reconstructed metal foams and comparison against experiments International Journal of Heat and Mass Transfer. 88: 508-515. DOI: 10.1016/J.Ijheatmasstransfer.2015.04.038  0.501
2014 Bodla KK, Garimella SV. Simulated microstructural evolution and design of porous sintered wicks Journal of Heat Transfer. 136. DOI: 10.1115/1.4026969  0.525
2014 Bodla KK, Garimella SV, Murthy JY. 3D reconstruction and design of porous media from thin sections International Journal of Heat and Mass Transfer. 73: 250-264. DOI: 10.1016/J.Ijheatmasstransfer.2014.02.006  0.612
2014 Sarangi S, Bodla KK, Garimella SV, Murthy JY. Manifold microchannel heat sink design using optimization under uncertainty International Journal of Heat and Mass Transfer. 69: 92-105. DOI: 10.1016/J.Ijheatmasstransfer.2013.09.067  0.625
2014 Diani A, Bodla KK, Rossetto L, Garimella SV. Numerical analysis of air flow through metal foams Energy Procedia. 45: 645-652. DOI: 10.1016/J.Egypro.2014.01.069  0.311
2014 Krishnan SG, Bodla KK, Weibel JA, Garimella SV. Numerical investigation of fluid flow and heat transfer in periodic porous lattice-frame materials Proceedings of the 15th International Heat Transfer Conference, Ihtc 2014.  0.45
2013 Bodla KK, Weibel JA, Garimella SV. Advances in fluid and thermal transport property analysis and design of sintered porous wick microstructures Journal of Heat Transfer. 135. DOI: 10.1115/1.4023569  0.51
2013 Bodla KK, Murthy JY, Garimella SV. Optimization under uncertainty applied to heat sink design Journal of Heat Transfer. 135. DOI: 10.1115/1.4007669  0.567
2013 Bodla KK, Murthy JY, Garimella SV. Evaporation analysis in sintered wick microstructures International Journal of Heat and Mass Transfer. 61: 729-741. DOI: 10.1016/J.Ijheatmasstransfer.2013.02.038  0.638
2012 Sarangi S, Bodla KK, Garimella SV, Murthy JY. Optimization under uncertainty of manifold microchannel heat sinks Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 9: 1141-1153. DOI: 10.1115/IMECE2012-89261  0.381
2012 Bodla KK, Murthy JY, Garimella SV. Analysis of thin-film evaporation through sintered wick microstructures Asme 2012 Heat Transfer Summer Conf. Collocated With the Asme 2012 Fluids Engineering Div. Summer Meeting and the Asme 2012 10th Int. Conf. On Nanochannels, Microchannels and Minichannels, Ht 2012. 2: 801-813. DOI: 10.1115/HT2012-58598  0.428
2012 Bodla KK, Murthy JY, Garimella SV. Direct simulation of thermal transport through sintered wick microstructures Journal of Heat Transfer. 134. DOI: 10.1115/1.4004804  0.639
2012 Bodla KK, Murthy JY, Garimella SV. Optimization under uncertainty for electronics cooling design applications Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 1191-1201. DOI: 10.1109/ITHERM.2012.6231558  0.481
2010 Bodla KK, Murthy JY, Garimella SV. XMT-based direct simulation of flow and heat transfer through open-cell aluminum foams 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501338  0.616
2010 Bodla KK, Murthy JY, Garimella SV. Microtomography-based simulation of transport through open-cell metal foams Numerical Heat Transfer; Part a: Applications. 58: 527-544. DOI: 10.1080/10407782.2010.511987  0.62
2010 Bodla KK, Murthy JY, Garimella SV. Resistance network-based thermal conductivity model for metal foams Computational Materials Science. 50: 622-632. DOI: 10.1016/J.Commatsci.2010.09.026  0.574
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