Yi Tao, Ph.D. - Publications
Affiliations: | 2003 | University of Arkansas, Little Rock, AR |
Area:
Mechanical Engineering, Packaging EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2010 | Tao Y, Malshe AP, Brown WD, DeReus DR, Cunningham S. Correction to "Laser-Assisted Sealing and Testing for Ceramic Packaging of MEMS Devices" [Aug 03 283-288] Ieee Transactions On Advanced Packaging. 33: 569-569. DOI: 10.1109/Tadvp.2010.2049287 | 0.507 | |||
2005 | Tao Y, Malshe AP. Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E Microelectronics Reliability. 45: 559-566. DOI: 10.1016/J.Microrel.2004.08.004 | 0.501 | |||
2004 | Tao Y, Malshe AP, Brown WD. Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems Microelectronics Reliability. 44: 251-258. DOI: 10.1016/S0026-2714(03)00192-6 | 0.522 | |||
2003 | Tao Y, Malshe AP, Brown WD, DeReus DR, Cunningham S. Laser-Assisted Sealing and Testing for Ceramic Packaging of MEMS Devices Ieee Transactions On Advanced Packaging. 26: 283-288. DOI: 10.1109/Tadvp.2003.817969 | 0.525 | |||
2002 | Tao Y, Malshe AP, Brown WD. Investigation of Laser-assisted Bonding for MEMS Packaging International Journal of Nonlinear Sciences and Numerical Simulation. 3. DOI: 10.1515/Ijnsns.2002.3.3-4.427 | 0.304 | |||
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