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Saikat Adhikari, Ph.D. - Publications

Affiliations: 
2008 Chemical and Biological Engineering Iowa State University, Ames, IA, United States 
Area:
Chemical Engineering
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8 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2011 Ai JH, Liu SP, Widharta NA, Adhikari S, Anderegg JW, Hebert KR. Copper layers deposited on aluminum by galvanic displacement Journal of Physical Chemistry C. 115: 22354-22359. DOI: 10.1021/Jp2054266  0.636
2010 Ji M, Wang CZ, Ho KM, Adhikari S, Hebert KR. Statistical model of defects in Al-H system Physical Review B - Condensed Matter and Materials Physics. 81. DOI: 10.1103/Physrevb.81.024105  0.613
2010 Adhikari S, Chumbley LS, Chen H, Jean YC, Geiculescu AC, Hillier AC, Hebert KR. Interfacial voids in aluminum created by aqueous dissolution Electrochimica Acta. 55: 6093-6100. DOI: 10.1016/J.Electacta.2010.05.073  0.619
2010 Adhikari S, Ai J, Hebert KR, Ho KM, Wang CZ. Hydrogen in aluminum during alkaline corrosion Electrochimica Acta. 55: 5326-5331. DOI: 10.1016/J.Electacta.2010.04.076  0.625
2008 Adhikari S, Hebert KR. Participation of aluminum hydride in the anodic dissolution of aluminum in alkaline solutions Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2883827  0.647
2008 Adhikari S, Lee J, Hebert KR. Formation of aluminum hydride during alkaline dissolution of aluminum Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2800770  0.668
2008 Adhikari S, Hebert KR. Factors controlling the time evolution of the corrosion potential of aluminum in alkaline solutions Corrosion Science. 50: 1414-1421. DOI: 10.1016/J.Corsci.2008.01.001  0.648
2005 Hebert KR, Adhikari S, Houser JE. Chemical mechanism of suppression of copper electrodeposition by poly(ethylene glycol) Journal of the Electrochemical Society. 152: C324-C329. DOI: 10.1149/1.1882112  0.596
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