☰

Sakethraman Mahalingam, Ph.D. - Publications

Affiliations: 
2005 Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering, Materials Science Engineering
Tree Info Similar researchers PubMed Report error

2 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2005 Mahalingam S, Tonapi S, Sitaraman SK. The characterization of underfill-passivation interface under monotonic and fatigue loading and ITS application to flip chip reliability prediction American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 5: 219-224. DOI: 10.1115/IMECE2005-83029  0.417
2005 Mahalingam S, Tonapi S, Sitaraman SK. A fracture mechanics analysis of underfill delamination in flip chip packages Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 1341-1346.  0.423
Show low-probability matches.