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Yung-Cheng Lee - Publications

Affiliations: 
Mechanical Engineering University of Colorado, Boulder, Boulder, CO, United States 
Area:
Mechanical Engineering, Materials Science Engineering, Packaging Engineering
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24 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2018 Wen R, Xu S, Zhao D, Yang L, Ma X, Liu W, Lee Y, Yang R. Sustaining enhanced condensation on hierarchical mesh-covered surfaces National Science Review. 5: 878-887. DOI: 10.1093/Nsr/Nwy098  0.329
2018 Wen R, Xu S, Lee Y, Yang R. Capillary-driven liquid film boiling heat transfer on hybrid mesh wicking structures Nano Energy. 51: 373-382. DOI: 10.1016/J.Nanoen.2018.06.063  0.338
2018 Wen R, Ma X, Lee Y, Yang R. Liquid-Vapor Phase-Change Heat Transfer on Functionalized Nanowired Surfaces and Beyond Joule. 2: 2307-2347. DOI: 10.1016/J.Joule.2018.08.014  0.323
2018 Wen R, Xu S, Ma X, Lee Y, Yang R. Three-Dimensional Superhydrophobic Nanowire Networks for Enhancing Condensation Heat Transfer Joule. 2: 269-279. DOI: 10.1016/J.Joule.2017.11.010  0.33
2017 Wen R, Xu S, Zhao D, Lee YC, Ma X, Yang R. Hierarchical Superhydrophobic Surfaces with Micropatterned Nanowire Arrays for High-Efficiency Jumping Droplet Condensation. Acs Applied Materials & Interfaces. PMID 29214806 DOI: 10.1021/Acsami.7B14960  0.342
2017 Wen R, Li Q, Wang W, Latour B, Li CH, Li C, Lee Y, Yang R. Enhanced bubble nucleation and liquid rewetting for highly efficient boiling heat transfer on two-level hierarchical surfaces with patterned copper nanowire arrays Nano Energy. 38: 59-65. DOI: 10.1016/J.Nanoen.2017.05.028  0.319
2016 Yersak AS, Lewis RJ, Liew LA, Wen R, Yang R, Lee YC. Atomic Layer Deposited Coatings on Nanowires for High Temperature Water Corrosion Protection. Acs Applied Materials & Interfaces. 8: 32616-32623. PMID 27933818 DOI: 10.1021/Acsami.6B11963  0.302
2016 Yersak AS, Lee Y. Probabilistic distributions of pinhole defects in atomic layer deposited films on polymeric substrates Journal of Vacuum Science and Technology. 34. DOI: 10.1116/1.4938496  0.333
2016 Xu S, Lewis RJ, Liew L, Lee Y, Yang R. Development of Ultra-Thin Thermal Ground Planes by Using Stainless-Steel Mesh as Wicking Structure Journal of Microelectromechanical Systems. 25: 842-844. DOI: 10.1109/Jmems.2016.2596142  0.304
2015 Lewis R, Xu S, Liew LA, Coolidge C, Yang R, Lee YC. Thin Flexible Thermal Ground Planes: Fabrication and Scaling Characterization Journal of Microelectromechanical Systems. DOI: 10.1109/Jmems.2015.2466540  0.314
2015 Lewis R, Liew L, Xu S, Lee Y, Yang R. Microfabricated ultra-thin all-polymer thermal ground planes Science Bulletin. 60: 701-706. DOI: 10.1007/S11434-015-0760-9  0.347
2014 Wang Y, Lewis R, Radebaugh R, Lin MM, Bright VM, Lee Y. A Monolithic Polyimide Micro Cryogenic Cooler: Design, Fabrication, and Test Journal of Microelectromechanical Systems. 23: 934-943. DOI: 10.1109/Jmems.2014.2301631  0.359
2013 Dai X, Famouri M, Abdulagatov AI, Yang R, Lee YC, George SM, Li C. Capillary evaporation on micromembrane-enhanced microchannel wicks with atomic layer deposited silica Applied Physics Letters. 103. DOI: 10.1063/1.4824439  0.314
2013 Dai X, Yang F, Yang R, Lee Y, Li C. Micromembrane-enhanced capillary evaporation International Journal of Heat and Mass Transfer. 64: 1101-1108. DOI: 10.1016/J.Ijheatmasstransfer.2013.05.030  0.312
2011 Kong M, Jeon S, Au H, Hwang C, Lee Y. Development and Experimental Validation of a 3-D Solder Self-Alignment Model for Alignment Accuracy Prediction of Flip-Chip Assembly Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1523-1532. DOI: 10.1109/Tcpmt.2011.2162837  0.352
2003 Faheem FF, Gupta KC, Lee YC. Flip-chip assembly and liquid crystal polymer encapsulation for variable MEMS capacitors Ieee Transactions On Microwave Theory and Techniques. 51: 2562-2567. DOI: 10.1109/Tmtt.2003.819778  0.676
2003 Zhang J, Lee YC, Tuantranont A, Bright VM. Thermal Analysis of Micromirrors for High-Energy Applications Ieee Transactions On Advanced Packaging. 26: 310-317. DOI: 10.1109/Tadvp.2003.818050  0.585
2003 Ma Z, Bradley E, Peacock T, Hertzberg JR, Lee YC. Solder-Assembled Large MEMS Flaps for Fluid Mixing Ieee Transactions On Advanced Packaging. 26: 268-276. DOI: 10.1109/Tadvp.2003.817966  0.572
2003 Ishikawa K, Zhang J, Tuantranont A, Bright VM, Lee YC. An integrated micro-optical system for VCSEL-to-fiber active alignment Sensors and Actuators, a: Physical. 103: 109-115. DOI: 10.1016/S0924-4247(02)00313-8  0.554
2002 Chen X, Ma Z, Lee Y. Reliability of Electrostatic MEMS: Charge Accumulation in Dielectric Layer International Journal of Nonlinear Sciences and Numerical Simulation. 3. DOI: 10.1515/Ijnsns.2002.3.3-4.665  0.495
2002 Ma Z, Chen X, Lee Y. Electrostatic MEMS Planar Fan for Enhancement of Fluid Mixing International Journal of Nonlinear Sciences and Numerical Simulation. 3: 277-282. DOI: 10.1515/Ijnsns.2002.3.3-4.277  0.512
1998 Kazlas PT, Johnson KM, Lee Y, Hareb S. Assembly and packaging of liquid-crystal-on-silicon displays High-Power Lasers and Applications. 3289: 52-59. DOI: 10.1117/12.305491  0.327
1998 Harsh KF, Lee Y. Modeling for solder self-assembled MEMS High-Power Lasers and Applications. 3289: 177-184. DOI: 10.1117/12.305485  0.684
1997 McLaren TS, Kang SY, Zhang W, Ju T, Lee Y. Thermosonic bonding of an optical transceiver based on an 8/spl times/8 vertical cavity surface emitting laser array Ieee Transactions On Components, Packaging, and Manufacturing Technology: Part B. 20: 152-160. DOI: 10.1109/96.575567  0.331
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