| Year |
Citation |
Score |
| 2020 |
Alghoul T, Wentlent L, Sivasubramony R, Greene C, Thompson P, Borgesen P. Diffusion Creep of Realistic SnAgCu Solder Joints at Times and Stresses of Relevance to Thermal Fatigue Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 288-295. DOI: 10.1109/Tcpmt.2019.2929051 |
0.465 |
|
| 2019 |
Muralidharan R, Raj A, Sivasubramony RS, Yadav M, Alhendi M, Nilsson M, Greene C, Poliks MD, Borgesen P. Effect of substrate properties on isothermal fatigue of aerosol jet printed nano-Ag traces on flex Journal of Materials Research. 34: 2903-2910. DOI: 10.1557/Jmr.2019.226 |
0.436 |
|
| 2019 |
Alghoul T, Wentlent L, Sivasubramony R, Greene C, Thompson P, Borgesen P. Effects of Thermal Cycling on Creep of SnAgCu Solder Joints Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 888-894. DOI: 10.1109/Tcpmt.2018.2884731 |
0.46 |
|
| 2019 |
Borgesen P, Wentlent L, Alghoul T, Sivasubramony R, Yadav M, Thekkut S, Cuevas JLT, Greene C. A mechanistic model of damage evolution in lead free solder joints under combinations of vibration and thermal cycling with varying amplitudes Microelectronics Reliability. 95: 65-73. DOI: 10.1016/J.Microrel.2019.02.001 |
0.51 |
|
| 2018 |
Hamasha S, Akkara F, Su S, Ali H, Borgesen P. Effect of Cycling Amplitude Variations on SnAgCu Solder Joint Fatigue Life Ieee Transactions On Components, Packaging and Manufacturing Technology. 8: 1896-1904. DOI: 10.1109/Tcpmt.2018.2795347 |
0.532 |
|
| 2018 |
Wentlent L, Alghoul TM, Greene CM, Borgesen P. Effects of Amplitude Variations on Deformation and Damage Evolution in SnAgCu Solder in Isothermal Cycling Journal of Electronic Materials. 47: 2752-2760. DOI: 10.1007/S11664-018-6129-5 |
0.53 |
|
| 2018 |
Borgesen P, Wentlent L, Hamasha S, Khasawneh S, Shirazi S, Schmitz D, Alghoul T, Greene C, Yin L. A Mechanistic Thermal Fatigue Model for SnAgCu Solder Joints Journal of Electronic Materials. 47: 2526-2544. DOI: 10.1007/S11664-018-6121-0 |
0.524 |
|
| 2016 |
Hamasha S, Borgesen P. Effects of strain rate and amplitude variations on solder joint fatigue life in isothermal cycling Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032881 |
0.534 |
|
| 2016 |
Borgesen P, Hamasha S, Wentlent L, Watson D, Greene C. Interpreting accelerated test results for lead free solder joints 2016 Pan Pacific Microelectronics Symposium, Pan Pacific 2016. DOI: 10.1109/PanPacific.2016.7428390 |
0.417 |
|
| 2015 |
Qasaimeh A, Hamasha S, Jaradat Y, Borgesen P. Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue Journal of Electronic Packaging. 137: 21012. DOI: 10.1115/1.4029441 |
0.782 |
|
| 2015 |
Hamasha S, Wentlent L, Borgesen P. Statistical Variations of Solder Joint Fatigue Life Under Realistic Service Conditions Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2460244 |
0.564 |
|
| 2015 |
Hamasha S, Qasaimeh A, Jaradat Y, Borgesen P. Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2453989 |
0.79 |
|
| 2015 |
Batieha F, Hamasha S, Jaradat Y, Wentlent L, Qasaimeh A, Borgesen P. Challenges for the prediction of solder joint life in long term vibration Proceedings - Electronic Components and Technology Conference. 2015: 1553-1559. DOI: 10.1109/ECTC.2015.7159804 |
0.782 |
|
| 2015 |
Shirazi S, Yin L, Khasawneh S, Wentlent L, Borgesen P. Effects of solder joint dimensions and assembly process on acceleration factors and life in thermal cycling of SnAgCu solder joints Proceedings - Electronic Components and Technology Conference. 2015: 92-98. DOI: 10.1109/ECTC.2015.7159577 |
0.438 |
|
| 2014 |
Schmitz D, Shirazi S, Wentlent L, Hamasha S, Yin L, Qasaimeh A, Borgesen P. Towards a quantitative mechanistic understanding of the thermal cycling of SnAgCu solder joints Proceedings - Electronic Components and Technology Conference. 371-378. DOI: 10.1109/ECTC.2014.6897314 |
0.765 |
|
| 2014 |
Mayyas A, Qasaimeh A, Borgesen P, Meilunas M. Effects of latent damage of recrystallization on lead free solder joints Microelectronics Reliability. 54: 447-456. DOI: 10.1016/J.Microrel.2013.10.006 |
0.774 |
|
| 2014 |
Schnabl K, Wentlent L, Mootoo K, Khasawneh S, Zinn AA, Beddow J, Hauptfleisch E, Blass D, Borgesen P. Nanocopper Based Solder-Free Electronic Assembly Journal of Electronic Materials. 43: 4515-4521. DOI: 10.1007/S11664-014-3478-6 |
0.391 |
|
| 2014 |
Hamasha S, Jaradat Y, Qasaimeh A, Obaidat M, Borgesen P. Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions Journal of Electronic Materials. 43: 4472-4484. DOI: 10.1007/S11664-014-3436-3 |
0.791 |
|
| 2013 |
Sahaym U, Talebanpour B, Seekins S, Dutta I, Kumar P, Borgesen P. Recrystallization and Ag3Sn particle redistribution during thermomechanical treatment of bulk Sn-Ag-Cu solder alloys Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1868-1875. DOI: 10.1109/Tcpmt.2013.2272543 |
0.417 |
|
| 2013 |
Yang L, Yin L, Arafei B, Roggeman B, Borgesen P. On the assessment of the life of SnAgCu solder joints in cycling with varying amplitudes Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 430-440. DOI: 10.1109/Tcpmt.2013.2238234 |
0.666 |
|
| 2013 |
Obaidat M, Hamasha S, Jaradat Y, Qasaimeh A, Arfaei B, Anselm M, Borgesen P. Effects of varying amplitudes on the fatigue life of lead free solder joints Proceedings - Electronic Components and Technology Conference. 1308-1314. DOI: 10.1109/ECTC.2013.6575741 |
0.807 |
|
| 2013 |
Arfaei B, Mahin-Shirazi S, Joshi S, Anselm M, Borgesen P, Cotts E, Wilcox J, Coyle R. Reliability and failure mechanism of solder joints in thermal cycling tests Proceedings - Electronic Components and Technology Conference. 976-985. DOI: 10.1109/ECTC.2013.6575693 |
0.471 |
|
| 2013 |
Borgesen P, Hamasha S, Obaidat M, Raghavan V, Dai X, Meilunas M, Anselm M. Solder joint reliability under realistic service conditions Microelectronics Reliability. 53: 1587-1591. DOI: 10.1016/J.Microrel.2013.07.091 |
0.675 |
|
| 2013 |
Raghavan VA, Roggeman B, Meilunas M, Borgesen P. Effects of 'Latent Damage' on pad cratering: Reduction in life and a potential change in failure mode Microelectronics Reliability. 53: 303-313. DOI: 10.1016/J.Microrel.2012.08.019 |
0.461 |
|
| 2012 |
Arfaei B, Wentlent L, Joshi S, Anselm M, Borgesen P. Controlling the superior reliability of lead free assemblies with short standoff height through design and materials selection Asme International Mechanical Engineering Congress and Exposition, Proceedings (Imece). 9: 467-473. DOI: 10.1115/IMECE2012-89584 |
0.333 |
|
| 2012 |
Borgesen P, Blass D, Meilunas M. Effects of corner/edge bonding and underfill properties on the thermal cycling performance of lead free ball grid array assemblies Journal of Electronic Packaging, Transactions of the Asme. 134. DOI: 10.1115/1.4005904 |
0.422 |
|
| 2012 |
Jaradat Y, Chen J, Owens JE, Yin L, Qasaimeh A, Wentlent L, Arfaei B, Borgesen P. Effects of variable amplitude loading on lead-free solder joint propoerties and damage accumulation Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 740-744. DOI: 10.1109/ITHERM.2012.6231501 |
0.774 |
|
| 2012 |
Arfaei B, Wentlent L, Joshi S, Alazzam A, Tashtoush T, Halaweh M, Chivukula S, Yin L, Meilunas M, Cotts E, Borgesen P. Improving the thermomechanical behavior of lead free solder joints by controlling the microstructure Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 392-398. DOI: 10.1109/ITHERM.2012.6231456 |
0.335 |
|
| 2012 |
Yin L, Meilunas M, Arfaei B, Wentlent L, Borgesen P. Effect of microstructure evolution on Pb-free solder joint reliability in thermomechanical fatigue Proceedings - Electronic Components and Technology Conference. 493-499. DOI: 10.1109/ECTC.2012.6248876 |
0.521 |
|
| 2012 |
Borgesen P, Yin L, Kondos P. Acceleration of the growth of Cu 3Sn voids in solder joints Microelectronics Reliability. 52: 1121-1127. DOI: 10.1016/J.Microrel.2011.12.005 |
0.397 |
|
| 2012 |
Wafula F, Yin L, Borgesen P, Andala D, Dimitrov N. Influence of poly(ethylene glycol) degradation on voiding sporadically occurring in solder joints with electroplated Cu Journal of Electronic Materials. 41: 1898-1906. DOI: 10.1007/S11664-012-2017-6 |
0.368 |
|
| 2012 |
Yin L, Wafula F, Dimitrov N, Borgesen P. Toward a better understanding of the effect of cu electroplating process parameters on Cu 3Sn voiding Journal of Electronic Materials. 41: 302-312. DOI: 10.1007/S11664-011-1764-0 |
0.364 |
|
| 2012 |
Yin L, Wentlent L, Yang L, Arfaei B, Oasaimeh A, Borgesen P. Recrystallization and precipitate coarsening in Pb-Free solder joints during thermomechanical fatigue Journal of Electronic Materials. 41: 241-252. DOI: 10.1007/S11664-011-1762-2 |
0.634 |
|
| 2011 |
Yina L, Borgesen P. On the root cause of Kirkendall voiding in Cu 3Sn Journal of Materials Research. 26: 455-466. DOI: 10.1557/Jmr.2010.47 |
0.346 |
|
| 2011 |
Roggeman BD, Raghavan V, Borgesen P. Joint level test methods for solder pad cratering investigations Journal of Electronic Packaging, Transactions of the Asme. 133. DOI: 10.1115/1.4004182 |
0.458 |
|
| 2011 |
Meilunas M, Borgesen P. Effects of cycling parameters on the thermal fatigue life of mixed SnAgCu/SnPb solder joints Journal of Electronic Packaging, Transactions of the Asme. 133. DOI: 10.1115/1.4003863 |
0.524 |
|
| 2011 |
Borgesen P, Meilunas M. Effects of solder paste volume and reflow profiles on the thermal cycling performance of mixed SnAgCu/SnPb solder joints Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1205-1213. DOI: 10.1109/Tcpmt.2010.2101072 |
0.496 |
|
| 2011 |
Blass D, Meilunas M, Borgesen P. On the incorporation of fine pitch lead free CSPs in high reliability SnPb based microelectronics assemblies Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 92-99. DOI: 10.1109/Tcpmt.2010.2099990 |
0.459 |
|
| 2011 |
Qasaimeh A, Jaradat Y, Wentlent L, Yang L, Yin L, Arfaei B, Borgesen P. Recrystallization behavior of lead free and lead containing solder in cycling Proceedings - Electronic Components and Technology Conference. 1775-1781. DOI: 10.1109/ECTC.2011.5898753 |
0.773 |
|
| 2011 |
Qasaimeh A, Lu S, Borgesen P. Crack evolution and rapid life assessment for lead free solder joints Proceedings - Electronic Components and Technology Conference. 1283-1290. DOI: 10.1109/ECTC.2011.5898676 |
0.764 |
|
| 2011 |
Jaradat Y, Qasaimeh A, Kondos P, Arfaei B, Borgesen P. On the evolution of the properties and microstructure of backward compatible solder joints during cycling and aging Proceedings - Electronic Components and Technology Conference. 722-730. DOI: 10.1109/ECTC.2011.5898593 |
0.793 |
|
| 2011 |
Arfaei B, Tashtoush T, Kim N, Wentlent L, Cotts E, Borgesen P. Dependence of SnAgCu solder joint properties on solder microstructure Proceedings - Electronic Components and Technology Conference. 125-132. DOI: 10.1109/ECTC.2011.5898502 |
0.359 |
|
| 2011 |
Borgesen P, Yin L, Kondos P. Assessing the risk of Kirkendall voiding in Cu3Sn Microelectronics Reliability. 51: 837-846. DOI: 10.1016/J.Microrel.2010.11.014 |
0.415 |
|
| 2011 |
Rae DF, Borgesen P, Cotts EJ. The effect of filler-network heterogeneity on thermal resistance of polymeric thermal bondlines Jom. 63: 78-84. DOI: 10.1007/S11837-011-0180-5 |
0.353 |
|
| 2011 |
Wafula F, Liu Y, Yin L, Borgesen P, Cotts EJ, Dimitrov N. Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell Journal of Applied Electrochemistry. 41: 469-480. DOI: 10.1007/S10800-011-0257-4 |
0.346 |
|
| 2010 |
Wafula F, Liu Y, Yin L, Bliznakov S, Borgesen P, Cotts EJ, Dimitrov N. Impact of key deposition parameters on the voiding sporadically occurring in solder joints with electroplated copper Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3271129 |
0.354 |
|
| 2010 |
Mayyas A, Yin L, Borgesen P. Recrystallization of lead free solder joints - confounding the interpretation of accelerated thermal cycling results? Asme International Mechanical Engineering Congress and Exposition, Proceedings. 5: 319-326. DOI: 10.1115/IMECE2009-12749 |
0.507 |
|
| 2010 |
Blass D, Borgesen P. Interactions between flip chip underfill and solder alloy Journal of Electronic Packaging, Transactions of the Asme. 132. DOI: 10.1115/1.4002010 |
0.435 |
|
| 2010 |
Raghavan V, Roggeman B, Meilunas M, Borgesen P. Effects of pre-stressing on solder joint failure by pad cratering Proceedings - Electronic Components and Technology Conference. 456-463. DOI: 10.1109/ECTC.2010.5490932 |
0.311 |
|
| 2010 |
Yang L, Yin L, Roggeman B, Borgesen P. Effects of microstructure evolution on damage accumulation in lead-free solder joints Proceedings - Electronic Components and Technology Conference. 1518-1523. DOI: 10.1109/ECTC.2010.5490795 |
0.527 |
|
| 2009 |
Venkatadri V, Yin L, Xing Y, Cotts E, Srihari K, Borgesen P. Accelerating the effects of aging on the reliability of lead free solder joints in a quantitative fashion Proceedings - Electronic Components and Technology Conference. 398-405. DOI: 10.1109/ECTC.2009.5074045 |
0.369 |
|
| 2009 |
Godbole G, Roggeman B, Borgesen P, Srihari K. On the nature of pad cratering Proceedings - Electronic Components and Technology Conference. 100-108. DOI: 10.1109/ECTC.2009.5074003 |
0.321 |
|
| 2008 |
Liu Y, Wang J, Yin L, Kondos P, Parks C, Borgesen P, Henderson DW, Bliznakov S, Cotts EJ, Dimitrov N. Improving copper electrodeposition in the microelectronics industry Proceedings - Electronic Components and Technology Conference. 2105-2110. DOI: 10.1109/Tcapt.2009.2020172 |
0.392 |
|
| 2008 |
Roggeman B, Borgesen P, Li J, Godbole G, Tumne P, Srihari K, Levo T, Pitarresi J. Assessment of PCB pad cratering resistance by joint level testing Proceedings - Electronic Components and Technology Conference. 884-892. DOI: 10.1109/ECTC.2008.4550081 |
0.404 |
|
| 2008 |
Arfaei B, Xing Y, Woods J, Wolcott J, Tumne P, Borgesen P, Cotts E. The effect of Sn grain number and orientation on the shear fatigue life of SnAgCu solder joints Proceedings - Electronic Components and Technology Conference. 459-465. DOI: 10.1109/ECTC.2008.4550012 |
0.309 |
|
| 2008 |
Liu Y, Wang J, Yin L, Kondos P, Parks C, Borgesen P, Henderson DW, Cotts EJ, Dimitrov N. Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper-solder interface : PPPlating in acidic copper solution with and without polyethylene glycol Journal of Applied Electrochemistry. 38: 1695-1705. DOI: 10.1007/S10800-008-9618-Z |
0.356 |
|
| 2007 |
Borgesen P, Bieler T, Lehman LP, Cotts EJ. Pb-free solder: New materials considerations for microelectronics processing Mrs Bulletin. 32: 360-365. DOI: 10.1557/Mrs2007.236 |
0.457 |
|
| 2007 |
Gopakumar S, Borgesen P, Srihari K. Assembly issues with Sn/Ag/Cu bumped flip chips Soldering and Surface Mount Technology. 19: 3-10. DOI: 10.1108/09540910710848491 |
0.383 |
|
| 2005 |
Lehman LP, Kinyanjui RK, Wang J, Xing Y, Zavalij L, Borgesen P, Cotts EJ. Microstructure and damage evolution in Sn-Ag-Cu solder joints Proceedings - Electronic Components and Technology Conference. 1: 674-681. |
0.432 |
|
| 2004 |
Lehman LP, Athavale SN, Fullem TZ, Giamis AC, Kinyanjui RK, Lowenstein M, Mather K, Patel R, Rae D, Wang J, Xing Y, Zavalij L, Borgesen P, Cotts EJ. Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder Journal of Electronic Materials. 33: 1429-1439. DOI: 10.1007/S11664-004-0083-0 |
0.362 |
|
| 2002 |
Zribi A, Kinyanjui R, Borgesen P, Zavalij L, Cotts EJ. Aspects of the structural evolution of lead-free solder joints Jom. 54: 38-40. DOI: 10.1007/Bf02701848 |
0.391 |
|
| 2002 |
Tonapi S, Gopakumar S, Borgesen P, Srihari K. Reliability of lead-free solder interconnects - a review Proceedings of the Annual Reliability and Maintainability Symposium. 423-428. |
0.34 |
|
| 2001 |
Zribi A, Borgesen P, Zavalij L, Cotts EJ. Growth of Cu-Ni-Sn alloys in Pb free CuSnAg solder/Au-Ni metallization reactions Materials Research Society Symposium - Proceedings. 652. DOI: 10.1557/Proc-652-Y8.10 |
0.379 |
|
| 2001 |
Zribi A, Clark A, Zavalij L, Borgesen P, Cotts EJ. The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure Journal of Electronic Materials. 30: 1157-1164. DOI: 10.1007/S11664-001-0144-6 |
0.348 |
|
| 1996 |
Sha Y, Hui CY, Kramer EJ, Borgesen P, Westby G. Delamination Trends of Underfill in Dca Assemblies Mrs Proceedings. 445: 3. DOI: 10.1557/Proc-445-3 |
0.348 |
|
| 1994 |
Dion J, Borgesen P, Yost B, Lilienfeld DA, Li CY. Material and reliability considerations for anisotropically conductive adhesive based interconnects Materials Research Society Symposium Proceedings. 323: 27-32. DOI: 10.1557/Proc-323-27 |
0.303 |
|
| 1993 |
Borgesen P, Bolton SC, Yost B, Maggard JG, Brown DD, Li CY. Effects of composition on fatigue crack growth rates in area array solder joints American Society of Mechanical Engineers, Eep. 4: 969-977. |
0.39 |
|
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