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Awni Qasaimeh, Ph.D. - Publications

Affiliations: 
2012 Industrial Engineering State University of New York at Binghamton, Vestal, NY, United States 
Area:
Materials Science Engineering, Industrial Engineering
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12 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2015 Qasaimeh A, Hamasha S, Jaradat Y, Borgesen P. Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue Journal of Electronic Packaging. 137: 21012. DOI: 10.1115/1.4029441  0.767
2015 Hamasha S, Qasaimeh A, Jaradat Y, Borgesen P. Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2453989  0.775
2015 Batieha F, Hamasha S, Jaradat Y, Wentlent L, Qasaimeh A, Borgesen P. Challenges for the prediction of solder joint life in long term vibration Proceedings - Electronic Components and Technology Conference. 2015: 1553-1559. DOI: 10.1109/ECTC.2015.7159804  0.768
2014 Schmitz D, Shirazi S, Wentlent L, Hamasha S, Yin L, Qasaimeh A, Borgesen P. Towards a quantitative mechanistic understanding of the thermal cycling of SnAgCu solder joints Proceedings - Electronic Components and Technology Conference. 371-378. DOI: 10.1109/ECTC.2014.6897314  0.651
2014 Mayyas A, Qasaimeh A, Borgesen P, Meilunas M. Effects of latent damage of recrystallization on lead free solder joints Microelectronics Reliability. 54: 447-456. DOI: 10.1016/J.Microrel.2013.10.006  0.673
2014 Hamasha S, Jaradat Y, Qasaimeh A, Obaidat M, Borgesen P. Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions Journal of Electronic Materials. 43: 4472-4484. DOI: 10.1007/S11664-014-3436-3  0.768
2013 Obaidat M, Hamasha S, Jaradat Y, Qasaimeh A, Arfaei B, Anselm M, Borgesen P. Effects of varying amplitudes on the fatigue life of lead free solder joints Proceedings - Electronic Components and Technology Conference. 1308-1314. DOI: 10.1109/ECTC.2013.6575741  0.796
2012 Hamasha MM, Dhakal T, Alzoubi K, Albahri S, Qasaimeh A, Lu S, Westgate CR. Stability of ITO thin film on flexible substrate under thermal aging and thermal cycling conditions Ieee/Osa Journal of Display Technology. 8: 383-388. DOI: 10.1109/Jdt.2011.2176532  0.32
2012 Jaradat Y, Chen J, Owens JE, Yin L, Qasaimeh A, Wentlent L, Arfaei B, Borgesen P. Effects of variable amplitude loading on lead-free solder joint propoerties and damage accumulation Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 740-744. DOI: 10.1109/ITHERM.2012.6231501  0.764
2011 Qasaimeh A, Jaradat Y, Wentlent L, Yang L, Yin L, Arfaei B, Borgesen P. Recrystallization behavior of lead free and lead containing solder in cycling Proceedings - Electronic Components and Technology Conference. 1775-1781. DOI: 10.1109/ECTC.2011.5898753  0.755
2011 Qasaimeh A, Lu S, Borgesen P. Crack evolution and rapid life assessment for lead free solder joints Proceedings - Electronic Components and Technology Conference. 1283-1290. DOI: 10.1109/ECTC.2011.5898676  0.651
2011 Jaradat Y, Qasaimeh A, Kondos P, Arfaei B, Borgesen P. On the evolution of the properties and microstructure of backward compatible solder joints during cycling and aging Proceedings - Electronic Components and Technology Conference. 722-730. DOI: 10.1109/ECTC.2011.5898593  0.775
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