Year |
Citation |
Score |
2020 |
Fan J, Chen W, Yuan W, Fan X, Zhang G. Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model. Optics Express. 28: 13921-13937. PMID 32403858 DOI: 10.1364/Oe.387660 |
0.33 |
|
2020 |
Cui Z, Fan J, Ginkel HJv, Fan X, Zhang G. The interface adhesion of CaAlSiN 3 : Eu 2+ phosphor/silicone used in light-emitting diode packaging: A first principles study Applied Surface Science. 510: 145251. DOI: 10.1016/J.Apsusc.2020.145251 |
0.312 |
|
2019 |
Fan J, Wang Z, Deng Z, Fan X, Zhang G. High Moisture Accelerated Mechanical Behavior Degradation of Phosphor/Silicone Composites Used in White Light-Emitting Diodes. Polymers. 11. PMID 31370367 DOI: 10.3390/Polym11081277 |
0.33 |
|
2019 |
Zhang H, Liu Y, Wang L, Sun F, Fan J, Placette MD, Fan X, Zhang G. Effects of Sintering Pressure on the Densification and Mechanical Properties of Nanosilver Double-Side Sintered Power Module Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 963-972. DOI: 10.1109/Tcpmt.2018.2884032 |
0.3 |
|
2019 |
Chen W, Fan J, Qian C, Pu B, Fan X, Zhang G. Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method Ieee Access. 7: 68495-68502. DOI: 10.1109/Access.2019.2916878 |
0.349 |
|
2019 |
Sun B, Fan J, Fan X, Zhang G, Zhang G. A Reliability Prediction Methodology for LED Arrays Ieee Access. 7: 8127-8134. DOI: 10.1109/Access.2018.2887252 |
0.337 |
|
2019 |
Hoque A, Bradley RK, Fan J, Fan X. Effects of humidity and phosphor on silicone/phosphor composite in white light-emitting diode package Journal of Materials Science: Materials in Electronics. 30: 20471-20478. DOI: 10.1007/S10854-019-02393-8 |
0.319 |
|
2018 |
Jiang C, Fan J, Qian C, Zhang H, Fan X, Guo W, Zhang G. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages Ieee Transactions On Components, Packaging and Manufacturing Technology. 8: 1254-1262. DOI: 10.1109/Tcpmt.2018.2789345 |
0.327 |
|
2018 |
Sun B, Fan X, Driel WDv, Cui C, Zhang G. A stochastic process based reliability prediction method for LED driver Reliability Engineering & System Safety. 178: 140-146. DOI: 10.1016/J.Ress.2018.06.001 |
0.303 |
|
2018 |
Fan J, Cao J, Yu C, Qian C, Fan X, Zhang G. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures Microelectronics Reliability. 84: 140-148. DOI: 10.1016/J.Microrel.2018.03.033 |
0.323 |
|
2017 |
Qian C, Fan J, Fang J, Yu C, Ren Y, Fan X, Zhang G. Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method. Materials (Basel, Switzerland). 10. PMID 29035300 DOI: 10.3390/Ma10101181 |
0.337 |
|
2017 |
Hou F, Lin T, Cao L, Liu F, Li J, Fan X, Zhang GQ. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1721-1728. DOI: 10.1109/Tcpmt.2017.2726084 |
0.324 |
|
2017 |
Sun B, Fan X, Li L, Ye H, Driel Wv, Zhang G. A Reliability Prediction for Integrated LED Lamp With Electrolytic Capacitor-Free Driver Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1081-1088. DOI: 10.1109/Tcpmt.2017.2698468 |
0.331 |
|
2017 |
Sun B, Fan X, Ye H, Fan J, Qian C, van Driel W, Zhang G. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation Reliability Engineering & System Safety. 163: 14-21. DOI: 10.1016/J.Ress.2017.01.017 |
0.313 |
|
2017 |
Lu G, van Driel W, Fan X, Fan J, Qian C, Zhang G. Color shift acceleration on mid-power LED packages Microelectronics Reliability. 78: 294-298. DOI: 10.1016/J.Microrel.2017.09.014 |
0.32 |
|
2017 |
Tang H, Ye H, Wong CKY, Leung SYY, Fan J, Chen X, Fan X, Zhang G. Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component Microelectronics Reliability. 78: 197-204. DOI: 10.1016/J.Microrel.2017.09.008 |
0.317 |
|
2017 |
Qian C, Li Y, Fan J, Fan X, Fu J, Zhao L, Zhang G. Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method Microelectronics Reliability. 74: 173-178. DOI: 10.1016/J.Microrel.2017.04.015 |
0.313 |
|
2017 |
Fan J, Yu C, Qian C, Fan X, Zhang G. Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages Microelectronics Reliability. 74: 179-185. DOI: 10.1016/J.Microrel.2017.04.012 |
0.329 |
|
2017 |
Fan J, Zhang M, Luo X, Qian C, Fan X, Ji A, Zhang G. Phosphor–silicone interaction effects in high power white light emitting diode packages Journal of Materials Science: Materials in Electronics. 28: 17557-17569. DOI: 10.1007/S10854-017-7692-X |
0.329 |
|
2016 |
Sun B, Fan X, Qian C, Zhang G. PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers Ieee Transactions On Industrial Electronics. 63: 6726-6735. DOI: 10.1109/Tie.2016.2581156 |
0.31 |
|
2016 |
Huang J, Golubovic DS, Koh S, Yang D, Li X, Fan X, Zhang G. Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation Ieee Transactions On Electron Devices. 63: 2807-2814. DOI: 10.1109/Ted.2016.2565709 |
0.317 |
|
2016 |
Shen Y, Zhang L, Zhu W, Zhou J, Fan X. Finite-Element Analysis and Experimental Test for a Capped-Die Flip-Chip Package Design Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 1308-1316. DOI: 10.1109/Tcpmt.2016.2592947 |
0.324 |
|
2016 |
Cai M, Yang D, Tian K, Chen W, Chen X, Zhang P, Fan X, Zhang G. A hybrid prediction method on luminous flux maintenance of high-power LED lamps Applied Thermal Engineering. 95: 482-490. DOI: 10.1016/J.Applthermaleng.2015.11.034 |
0.342 |
|
2015 |
Huang J, Golubovic DS, Koh S, Yang D, Li X, Fan X, Zhang GQ. Rapid Degradation of Mid-Power White-Light LEDs in Saturated Moisture Conditions Ieee Transactions On Device and Materials Reliability. 15: 478-485. DOI: 10.1109/Tdmr.2015.2468587 |
0.337 |
|
2015 |
Huang J, Golubović DS, Koh S, Yang D, Li X, Fan X, Zhang GQ. Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests Microelectronics Reliability. DOI: 10.1016/J.Microrel.2015.09.008 |
0.3 |
|
2013 |
Fan X, Ranouta AS, Dhiman HS. Effects of Package Level Structure and Material Properties on Solder Joint Reliability Under Impact Loading Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 52-60. DOI: 10.1109/Tcpmt.2012.2217744 |
0.323 |
|
2012 |
Fan X, Ranouta AS. Finite Element Modeling of System Design and Testing Conditions for Component Solder Ball Reliability Under Impact Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 1802-1810. DOI: 10.1109/Tcpmt.2012.2204884 |
0.312 |
|
2012 |
Fan X, Nagaraj V. In-situ moisture desorption characterization of epoxy mold compound 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Eurosime 2012. DOI: 10.1109/ESimE.2012.6191772 |
0.455 |
|
2012 |
Fan X, Nagaraj V. Finite element modeling of anomalous moisture diffusion with dual stage model Proceedings - Electronic Components and Technology Conference. 1190-1193. DOI: 10.1109/ECTC.2012.6248987 |
0.485 |
|
2011 |
Dandu P, Fan X. Assessment of current density singularity in electromigration of solder bumps Proceedings - Electronic Components and Technology Conference. 2192-2196. DOI: 10.1109/ECTC.2011.5898823 |
0.655 |
|
2008 |
Fan X, Zhang GQ, Driel WDv, Ernst LJ. Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning Ieee Transactions On Components and Packaging Technologies. 31: 252-259. DOI: 10.1109/Tcapt.2008.921629 |
0.316 |
|
2004 |
Driel WDv, Wisse G, Chang AYL, Janssen JHJ, Fan X, Zhang KGQ, Ernst LJ. Influence of material combinations on delamination failures in a cavity-down TBGA package Ieee Transactions On Components and Packaging Technologies. 27: 651-658. DOI: 10.1109/Tcapt.2004.838859 |
0.317 |
|
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