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Melida Chin, Ph.D. - Publications

Affiliations: 
2005 University of Michigan, Ann Arbor, Ann Arbor, MI 
Area:
Mechanical Engineering
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3 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2007 Yue J, Camelio JA, Chin M, Cai W. Product-Oriented Sensitivity Analysis for Multistation Compliant Assemblies Journal of Mechanical Design. 129: 844-851. DOI: 10.1115/1.2735341  0.395
2007 Chin M, Hu SJ. A multiple particle model for the prediction of electrical contact resistance in anisotropic conductive adhesive assemblies Ieee Transactions On Components and Packaging Technologies. 30: 745-753. DOI: 10.1109/TCAPT.2007.910136  0.4
2005 Chin M, Hu SJ, Barber JR. Design guidelines for anisotropic conductive adhesive assemblies in microelectronics packaging American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 5: 371-374. DOI: 10.1115/1.2912180  0.404
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