| Year |
Citation |
Score |
| 2017 |
Pei F, Buchovecky E, Bower A, Chason E. Stress evolution and whisker growth during thermal cycling of Sn films: A comparison of analytical modeling and experiments Acta Materialia. 129: 462-473. DOI: 10.1016/J.Actamat.2017.03.005 |
0.673 |
|
| 2016 |
Pei F, Jadhav N, Buchovecky E, Bower AF, Chason E, Liu W, Tischler JZ, Ice GE, Xu R. In-situ synchrotron micro-diffraction study of surface, interface, grain structure, and strain/stress evolution during Sn whisker/hillock formation Journal of Applied Physics. 119. DOI: 10.1063/1.4942920 |
0.628 |
|
| 2013 |
Chason E, Jadhav N, Pei F, Buchovecky E, Bower A. Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms Progress in Surface Science. 88: 103-131. DOI: 10.1016/J.Progsurf.2013.02.002 |
0.711 |
|
| 2010 |
Jadhav N, Buchovecky EJ, Reinbold L, Kumar S, Bower AF, Chason E. Understanding the correlation between intermetallic growth, stress evolution, and Sn whisker nucleation Ieee Transactions On Electronics Packaging Manufacturing. 33: 183-192. DOI: 10.1109/Tepm.2010.2043847 |
0.689 |
|
| 2010 |
Jadhav N, Buchovecky E, Chason E, Bower A. Real-time SEM/FIB studies of whisker growth and surface modification Jom. 62: 30-37. DOI: 10.1007/S11837-010-0105-8 |
0.621 |
|
| 2009 |
Buchovecky EJ, Du N, Bower AF. A model of Sn whisker growth by coupled plastic flow and grain boundary diffusion Applied Physics Letters. 94. DOI: 10.1063/1.3136865 |
0.625 |
|
| 2009 |
Buchovecky E, Jadhav N, Bower AF, Chason E. Finite element modeling of stress evolution in Sn films due to growth of the Cu 6Sn 5 intermetallic compound Journal of Electronic Materials. 38: 2676-2684. DOI: 10.1007/S11664-009-0911-3 |
0.691 |
|
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