☰

Xingsheng Liu, Ph.D. - Publications

Affiliations: 
2001 Virginia Polytechnic Institute and State University, Blacksburg, VA, United States 
Area:
Packaging Engineering, Materials Science Engineering, Electronics and Electrical Engineering
Tree Info Similar researchers PubMed Report error

4 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2005 Lin Y, Chen X, Liu X, Lu G. Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling Microelectronics Reliability. 45: 143-154. DOI: 10.1016/J.Microrel.2004.06.009  0.562
2002 Liu X, Xu S, Lu G, Dillard DA. Effect of substrate flexibility on solder joint reliability Microelectronics Reliability. 42: 1883-1891. DOI: 10.1016/S0026-2714(02)00269-X  0.566
2001 Liu X, Xu S, Lu G, Dillard DA. Stacked solder bumping technology for improved solder joint reliability Microelectronics Reliability. 41: 1979-1992. DOI: 10.1016/S0026-2714(01)00117-2  0.551
2001 Haque S, Siddabattula K, Craven M, Wen S, Liu X, Boroyevich D, Lu G. Design issues of a three-dimensional packaging scheme for power modules Microelectronics Reliability. 41: 295-305. DOI: 10.1016/S0026-2714(00)00208-0  0.51
Show low-probability matches.