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Roy W. Knight - Publications

Affiliations: 
Auburn University, Auburn, AL, United States 
Area:
Heat Transfer, Electronics Cooling
Website:
https://www.eng.auburn.edu/directory/knighrw
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12 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2019 Henry MA, Reid KE, Maddox JF, Knight RW, Bhavnani SH. A Numerical and Experimental Study of Staggered Submerged Liquid Jet Arrays Using Variable Angle Discharge Manifolds Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 2168-2176. DOI: 10.1109/Tcpmt.2019.2921738  0.357
2016 Roy CK, Bhavnani S, Hamilton MC, Johnson RW, Knight RW, Harris DK. Durability of low melt alloys as thermal interface materials Journal of Electronic Packaging, Transactions of the Asme. 138. DOI: 10.1115/1.4032462  0.437
2016 Peacock MA, Roy CK, Hamilton MC, Wayne Johnson R, Knight RW, Harris DK. Characterization of transferred vertically aligned carbon nanotubes arrays as thermal interface materials International Journal of Heat and Mass Transfer. 97: 94-100. DOI: 10.1016/J.Ijheatmasstransfer.2016.01.071  0.354
2016 Roy CK, Bhavnani S, Hamilton MC, Johnson RW, Knight RW, Harris DK. Thermal performance of low melting temperature alloys at the interface between dissimilar materials Applied Thermal Engineering. 99: 72-79. DOI: 10.1016/J.Applthermaleng.2016.01.036  0.451
2015 Maddox JF, Knight RW, Bhavnani SH. Liquid Jet Impingement with an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling with Local Thermal Measurements Journal of Electronic Packaging, Transactions of the Asme. 137. DOI: 10.1115/1.4030953  0.341
2015 Roy CK, Bhavnani S, Hamilton MC, Johnson RW, Knight RW, Harris DK. Accelerated aging and thermal cycling of low melting temperature alloys as wet thermal interface materials Microelectronics Reliability. DOI: 10.1016/J.Microrel.2015.08.020  0.426
2015 Roy CK, Bhavnani S, Hamilton MC, Johnson RW, Nguyen JL, Knight RW, Harris DK. Investigation into the application of low melting temperature alloys as wet thermal interface materials International Journal of Heat and Mass Transfer. 85: 996-1002. DOI: 10.1016/J.Ijheatmasstransfer.2015.02.029  0.444
2012 Jackson RL, Ghaednia H, Elkady YA, Bhavnani SH, Knight RW. A closed-form multiscale thermal contact resistance model Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 1158-1171. DOI: 10.1109/Tcpmt.2012.2193584  0.346
2008 Evans JL, Lall P, Knight R, Crain E, Shete T, Thompson JR. System Design Issues for Harsh Environment Electronics Employing Metal-Backed Laminate Substrates Ieee Transactions On Components and Packaging Technologies. 31: 74-85. DOI: 10.1109/Tcapt.2008.916792  0.327
1997 Mackowski DW, Rao VR, Walker DG, Knight RW. Numerical investigation of the effects of thermal creep in physical vapor transport Journal of Crystal Growth. 179: 297-308. DOI: 10.1016/S0022-0248(97)00087-0  0.411
1996 Mackowski DW, Rao VR, Knight RW. Effect of solid phase heat transfer and wall deposition on crystal growth in physical vapor transport ampoules Journal of Crystal Growth. 165: 323-334. DOI: 10.1016/0022-0248(96)00192-3  0.336
1991 Knight RW, Goodling JS, Hall DJ. Optimal Thermal Design of Forced Convection Heat Sinks-Analytical Journal of Electronic Packaging. 113: 313-321. DOI: 10.1115/1.2905412  0.351
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