Yuk C. Chan, Ph.D.

Affiliations: 
2008 The Chinese University of Hong Kong, Hong Kong, Hong Kong 
Area:
1. Drug resistant of pathogenic bacteria. 2. Molecular virology of HIV and HBV.
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"Yuk Chan"
Mean distance: 23.26 (cluster 18)
 
SNBCP

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Sin M. Ng grad student 2008 Chinese University of Hong Kong
 (The novel role of angiotensin II in acute pancreatitis.)
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Publications

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Leung WP, Chan YC, So CW, et al. (2016) Reactivity Study of a Pyridyl-1-azaallylgermanium(I) Dimer: Synthesis of Heavier Ether and Ester Analogues of Germanium. Inorganic Chemistry
Chen G, Huang B, Liu H, et al. (2016) An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder Soldering and Surface Mount Technology. 28: 84-92
Li Y, Lim ABY, Luo K, et al. (2016) Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In-48Sn/Cu solder interconnects under current stressing Journal of Alloys and Compounds. 673: 372-382
Chen G, Wu F, Liu C, et al. (2016) Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets Journal of Alloys and Compounds. 656: 500-509
Fu YY, Chan YL, Yang MH, et al. (2015) Experimental study on the washing durability of electro-textile UHF RFID tags Ieee Antennas and Wireless Propagation Letters. 14: 466-469
Chan YC, Guo J, Wong EWM, et al. (2015) Performance analysis for overflow loss systems of processor-sharing queues Proceedings - Ieee Infocom. 26: 1409-1417
Zhang XD, Yang MH, Virkki J, et al. (2015) Impact of antenna-fiber alignment and recurrent stretching on the performance of passive UHF RFID tags based on textile antennas Conference Proceedings - 2014 Ieee Mtt-S International Microwave Workshop Series On: Rf and Wireless Technologies For Biomedical and Healthcare Applications, Imws-Bio 2014
Peng H, Huang B, Chen G, et al. (2015) Effect of 0.8 wt% Al2O3 nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint 16th International Conference On Electronic Packaging Technology, Icept 2015. 1014-1017
Hu X, Chan YC. (2015) Novel WO3 nanoparticles modified electroless metallization to retard interfacial reaction and reinforce the reliability of solder interconnection Proceedings - Electronic Components and Technology Conference. 2015: 1464-1469
Chen G, Wu F, Liu C, et al. (2015) Effect of fullerene-C60&C70 on the microstructure and properties of 96.5Sn-3Ag-0.5Cu solder Proceedings - Electronic Components and Technology Conference. 2015: 1262-1267
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