Yuk C. Chan, Ph.D.

2008 The Chinese University of Hong Kong, Hong Kong, Hong Kong 
1. Drug resistant of pathogenic bacteria. 2. Molecular virology of HIV and HBV.
"Yuk Chan"
Mean distance: 23.26 (cluster 18)


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Sin M. Ng grad student 2008 Chinese University of Hong Kong
 (The novel role of angiotensin II in acute pancreatitis.)
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Leung WP, Chan YC, So CW, et al. (2016) Reactivity Study of a Pyridyl-1-azaallylgermanium(I) Dimer: Synthesis of Heavier Ether and Ester Analogues of Germanium. Inorganic Chemistry
Chen G, Huang B, Liu H, et al. (2016) An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder Soldering and Surface Mount Technology. 28: 84-92
Li Y, Lim ABY, Luo K, et al. (2016) Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In-48Sn/Cu solder interconnects under current stressing Journal of Alloys and Compounds. 673: 372-382
Chen G, Wu F, Liu C, et al. (2016) Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets Journal of Alloys and Compounds. 656: 500-509
Fu YY, Chan YL, Yang MH, et al. (2015) Experimental study on the washing durability of electro-textile UHF RFID tags Ieee Antennas and Wireless Propagation Letters. 14: 466-469
Chan YC, Guo J, Wong EWM, et al. (2015) Performance analysis for overflow loss systems of processor-sharing queues Proceedings - Ieee Infocom. 26: 1409-1417
Zhang XD, Yang MH, Virkki J, et al. (2015) Impact of antenna-fiber alignment and recurrent stretching on the performance of passive UHF RFID tags based on textile antennas Conference Proceedings - 2014 Ieee Mtt-S International Microwave Workshop Series On: Rf and Wireless Technologies For Biomedical and Healthcare Applications, Imws-Bio 2014
Peng H, Huang B, Chen G, et al. (2015) Effect of 0.8 wt% Al2O3 nanoparticles addition on the microstructures and electromigration behavior of Sn-Ag-Cu solder joint 16th International Conference On Electronic Packaging Technology, Icept 2015. 1014-1017
Hu X, Chan YC. (2015) Novel WO3 nanoparticles modified electroless metallization to retard interfacial reaction and reinforce the reliability of solder interconnection Proceedings - Electronic Components and Technology Conference. 2015: 1464-1469
Chen G, Wu F, Liu C, et al. (2015) Effect of fullerene-C60&C70 on the microstructure and properties of 96.5Sn-3Ag-0.5Cu solder Proceedings - Electronic Components and Technology Conference. 2015: 1262-1267
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