Matthew D. McDermott
Affiliations: | Purdue University, West Lafayette, IN, United States |
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"Matthew McDermott"Mean distance: 16.54 (cluster 51) | S | N | B | C | P |
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Publications
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Olczak KP, McDermott MD, Otto KJ. (2019) Electrochemical Evaluation of Layer-by-Layer Drug Delivery Coating for Neural Interfaces. Acs Applied Bio Materials. 2: 5597-5607 |
Olczak KP, McDermott MD, Otto KJ. (2019) Electrochemical Evaluation of Layer-by-Layer Drug Delivery Coating for Neural Interfaces Acs Applied Bio Materials. 2: 5597-5607 |
Spearman BS, Desai VH, Mobini S, et al. (2018) Neural Interfaces: Tissue-Engineered Peripheral Nerve Interfaces (Adv. Funct. Mater. 12/2018) Advanced Functional Materials. 28: 1870076 |
Spearman BS, Desai VH, Mobini S, et al. (2017) Tissue-Engineered Peripheral Nerve Interfaces. Advanced Functional Materials. 28 |
Lee HC, Gaire J, Currlin SW, et al. (2017) Foreign Body Response to Intracortical Microelectrodes Is Not Altered with Dip-Coating of Polyethylene Glycol (PEG). Frontiers in Neuroscience. 11: 513 |
Spearman BS, Desai VH, Mobini S, et al. (2017) Tissue-Engineered Peripheral Nerve Interfaces Advanced Functional Materials. 28: 1701713 |
McDermott MD, Otto KJ. (2016) The effect of multiple thin-film coatings of protein loaded sol-gel on total multi-electrode array thickness. Conference Proceedings : ... Annual International Conference of the Ieee Engineering in Medicine and Biology Society. Ieee Engineering in Medicine and Biology Society. Annual Conference. 2016: 129-132 |
McDermott MD, Otto KJ, McDermott MD, et al. (2016) The effect of multiple thin-film coatings of protein loaded sol-gel on total multi-electrode array thickness. Conference Proceedings : ... Annual International Conference of the Ieee Engineering in Medicine and Biology Society. Ieee Engineering in Medicine and Biology Society. Annual Conference. 2016: 129-132 |
McDermott MD, Zhang J, Otto KJ. (2015) Improving the brain machine interface via multiple Tetramethyl Orthosilicate sol-gel coatings on microelectrode arrays International Ieee/Embs Conference On Neural Engineering, Ner. 2015: 422-425 |