Year |
Citation |
Score |
2020 |
Chakraborty B, Joshi-Imre A, Maeng J, Cogan SF. Sputtered ruthenium oxide coatings for neural stimulation and recording electrodes. Journal of Biomedical Materials Research. Part B, Applied Biomaterials. PMID 32945088 DOI: 10.1002/Jbm.B.34728 |
0.331 |
|
2020 |
Rihani RT, Stiller AM, Usoro JO, Lawson J, Kim H, Black BJ, Danda VR, Maeng J, Varner VD, Ware TH, Pancrazio JJ. Deployable, liquid crystal elastomer-based intracortical probes. Acta Biomaterialia. PMID 32428679 DOI: 10.1016/J.Actbio.2020.04.032 |
0.365 |
|
2020 |
Maeng J, Rihani RT, Javed M, Rajput JS, Kim H, Bouton IG, Criss TA, Pancrazio JJ, Black BJ, Ware TH. Liquid crystal elastomers as substrates for 3D, robust, implantable electronics. Journal of Materials Chemistry. B. PMID 32315020 DOI: 10.1039/D0Tb00471E |
0.387 |
|
2019 |
Ghazavi A, Maeng J, Black M, Salvi S, Cogan S. Electrochemical characteristics of ultramicro-dimensioned SIROF electrodes for neural stimulation and recording. Journal of Neural Engineering. PMID 31665712 DOI: 10.1088/1741-2552/Ab52Ab |
0.309 |
|
2019 |
Maeng J, Chakraborty B, Geramifard N, Kang T, Rihani RT, Joshi-Imre A, Cogan SF. High-charge-capacity sputtered iridium oxide neural stimulation electrodes deposited using water vapor as a reactive plasma constituent. Journal of Biomedical Materials Research. Part B, Applied Biomaterials. PMID 31353822 DOI: 10.1002/Jbm.B.34442 |
0.33 |
|
2019 |
Kim H, Gibson J, Maeng J, Saed M, Pimentel K, Rihani R, Pancrazio JJ, Georgakopoulos S, Ware TH. Responsive, 3D Electronics Enabled by Liquid Crystal Elastomer Substrates. Acs Applied Materials & Interfaces. PMID 31070344 DOI: 10.1021/Acsami.9B04189 |
0.351 |
|
2019 |
Joshi-Imre A, Black BJ, Abbott J, Kanneganti A, Rihani R, Chakraborty B, Danda VR, Maeng J, Sharma R, Rieth L, Negi S, Pancrazio JJ, Cogan S. Chronic recording and electrochemical performance of amorphous silicon carbide-coated Utah electrode arrays implanted in rat motor cortex. Journal of Neural Engineering. PMID 31013489 DOI: 10.1088/1741-2552/Ab1Bc8 |
0.395 |
|
2018 |
Deku F, Mohammed S, Joshi-Imre A, Maeng J, Danda V, Gardner TJ, Cogan SF. Effect of oxidation on intrinsic residual stress in amorphous silicon carbide films. Journal of Biomedical Materials Research. Part B, Applied Biomaterials. PMID 30321479 DOI: 10.1002/Jbm.B.34258 |
0.34 |
|
2018 |
Gutierrez-Heredia G, Maeng J, Conde J, Rodriguez-Lopez O, Voit WE. Effect of annealing atmosphere on IGZO thin film transistors on a deformable softening polymer substrate Semiconductor Science and Technology. 33: 095001. DOI: 10.1088/1361-6641/Aad293 |
0.347 |
|
2016 |
Maeng J, Kim YJ, Meng C, Irazoqui PP. Three-Dimensional Microcavity Array Electrodes for High-Capacitance All-Solid-State Flexible Micro-Supercapacitors. Acs Applied Materials & Interfaces. PMID 27176134 DOI: 10.1021/Acsami.6B03559 |
0.61 |
|
2015 |
Kim YJ, Maeng J, Irazoqui PP. Eyeglasses-powered, contact lens-like platform with high power transfer efficiency. Biomedical Microdevices. 17: 9979. PMID 26149695 DOI: 10.1007/S10544-015-9979-0 |
0.55 |
|
2015 |
Maeng J, Meng C, Irazoqui PP. Wafer-scale integrated micro-supercapacitors on an ultrathin and highly flexible biomedical platform. Biomedical Microdevices. 17: 7. PMID 25653069 DOI: 10.1007/S10544-015-9930-4 |
0.61 |
|
2014 |
Meng C, Maeng J, John SWM, Irazoqui PP. Ultrasmall integrated 3d micro-supercapacitors solve energy storage for miniature devices Advanced Energy Materials. 4. DOI: 10.1002/Aenm.201301269 |
0.564 |
|
2012 |
Maeng J, Ha D, Chappell WJ, Irazoqui PP. Parylene as thin flexible 3-D packaging enabler for biomedical implants Proceedings - 2012 45th International Symposium On Microelectronics, Imaps 2012. 176-185. |
0.533 |
|
2011 |
Maeng J, Kim B, Ha D, Chappell WJ. Parylene interposer as thin flexible 3-D packaging enabler for wireless applications Ieee Transactions On Microwave Theory and Techniques. 59: 3410-3418. DOI: 10.1109/Tmtt.2011.2172626 |
0.424 |
|
2009 |
Song S, Kim Y, Maeng J, Lee H, Kwon Y, Seo K. A Millimeter-Wave System-on-Package Technology Using a Thin-Film Substrate With a Flip-Chip Interconnection Ieee Transactions On Advanced Packaging. 32: 101-108. DOI: 10.1109/Tadvp.2008.2006626 |
0.361 |
|
2008 |
Maeng J, Song S, Jeon N, Yoo C, Lee H, Seo K. Embedded Decoupling Capacitors up to 80 nF on Multichip Module-Deposited with Quasi-Three-Dimensional Metal–Insulator–Metal Structure Japanese Journal of Applied Physics. 47: 2535-2537. DOI: 10.1143/Jjap.47.2535 |
0.388 |
|
2007 |
Maeng J, Song S, Yoo C, Lee H, Seo K. Integration of MIM Capacitors on BCB with Thin-Film MCM-D Technology The Japan Society of Applied Physics. 2007: 384-385. DOI: 10.7567/Ssdm.2007.P-2-4 |
0.355 |
|
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