Year |
Citation |
Score |
2017 |
Roshan MH, Zaliasl S, Joo K, Souri K, Palwai R, Chen LW, Singh A, Pamarti S, Miller NJ, Doll JC, Arft C, Tabatabaei S, Sechen C, Partridge A, Menon V. A MEMS-Assisted Temperature Sensor With 20- $\mu \text{K}$ Resolution, Conversion Rate of 200 S/s, and FOM of 0.04 pJK2 Ieee Journal of Solid-State Circuits. 52: 185-197. DOI: 10.1109/Jssc.2016.2621035 |
0.436 |
|
2016 |
Roshan MH, Zaliasl S, Joo K, Souri K, Palwai R, Chen W, Pamarti S, Doll JC, Miller N, Arft C, Tabatabaei S, Sechen C, Partridge A, Menon V. 11.1 Dual-MEMS-resonator temperature-to-digital converter with 40 K resolution and FOM of 0.12pJK2 Digest of Technical Papers - Ieee International Solid-State Circuits Conference. 59: 200-201. DOI: 10.1109/ISSCC.2016.7417976 |
0.325 |
|
2015 |
Ng E, Yang Y, Hong VA, Ahn CH, Heinz DB, Flader I, Chen Y, Everhart CLM, Kim B, Melamud R, Candler RN, Hopcroft MA, Salvia JC, Yoneoka S, Graham AB, ... ... Partridge A, et al. The long path from MEMS resonators to timing products Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 2015: 1-2. DOI: 10.1109/MEMSYS.2015.7050869 |
0.743 |
|
2015 |
Arumugam N, Hill G, Clark G, Arft C, Grosjean C, Palwai R, Pedicord J, Hagelin P, Partridge A, Menon V, Gupta P. 2-die wafer-level chip scale packaging enables the smallest TCXO for mobile and wearable applications Proceedings - Electronic Components and Technology Conference. 2015: 1338-1342. DOI: 10.1109/ECTC.2015.7159771 |
0.546 |
|
2014 |
Zaliasl S, Salvia JC, Hill GC, Chen LW, Joo K, Palwai R, Arumugam N, Phadke M, Mukherjee S, Lee HC, Grosjean C, Hagelin PM, Pamarti S, Fiez TS, Makinwa KAA, ... Partridge A, et al. A 3 ppm 1.5 × 0.8 mm 2 1.0 µA 32.768 kHz MEMS-Based Oscillator Ieee Journal of Solid-State Circuits. DOI: 10.1109/Jssc.2014.2360377 |
0.646 |
|
2014 |
Sevalia P, Partridge A. The top 6 reasons to use silicon MEMS timing solutions Electronic Products. 56. |
0.322 |
|
2013 |
Perrott MH, Salvia JC, Lee FS, Partridge A, Mukherjee S, Arft C, Kim J, Arumugam N, Gupta P, Tabatabaei S, Pamarti S, Lee H, Assaderaghi F. A temperature-to-digital converter for a MEMS-based programmable oscillator with <±0.5-ppm frequency stability and < 1-ps integrated jitter Ieee Journal of Solid-State Circuits. 48: 276-291. DOI: 10.1109/Jssc.2012.2218711 |
0.406 |
|
2013 |
Partridge A, Lee HC, Hagelin P, Menon V. We know that MEMS is replacing quartz. but why? and why now? 2013 Joint European Frequency and Time Forum and International Frequency Control Symposium, Eftf/Ifc 2013. 411-416. DOI: 10.1109/EFTF-IFC.2013.6702311 |
0.314 |
|
2012 |
Melamud R, Hagelin PM, Arft CM, Grosjean C, Arumugam N, Gupta P, Hill G, Lutz M, Partridge A, Assaderaghi F. Mems enables oscillators with sub-ppm frequency stability and sub-ps jitter Technical Digest - Solid-State Sensors, Actuators, and Microsystems Workshop. 66-69. |
0.673 |
|
2012 |
Partridge A, Lee H, Melamud R, Assaderaghi F. MEMS oscillators Technical Proceedings of the 2012 Nsti Nanotechnology Conference and Expo, Nsti-Nanotech 2012. 219-222. |
0.673 |
|
2011 |
Lee FS, Salvia J, Lee C, Mukherjee S, Melamud R, Arumugam N, Pamarti S, Arft C, Gupta P, Tabatabaei S, Garlepp B, Lee HC, Partridge A, Perrott MH, Assaderaghi F. A programmable MEMS-based clock generator with sub-ps jitter performance Ieee Symposium On Vlsi Circuits, Digest of Technical Papers. 158-159. |
0.603 |
|
2010 |
Tabatabaei S, Partridge A. Silicon MEMS oscillators for high-speed digital systems Ieee Micro. 30: 80-88. DOI: 10.1109/Mm.2010.39 |
0.419 |
|
2008 |
Brown J, Lutz M, Partridge A, Gupta P, Radza E. MEMS as low cost high volume semiconductor solutions it's all in the packaging and assembly Proceedings of Spie - the International Society For Optical Engineering. 6884. DOI: 10.1117/12.778250 |
0.312 |
|
2007 |
Kim B, Hopcroft M, Jha CM, Melamud R, Chandorkar S, Agarwal M, Chen KL, Park WT, Candler R, Yama G, Partridge A, Lutz M, Kenny TW. Using MEMS to build the device and the package Transducers and Eurosensors '07 - 4th International Conference On Solid-State Sensors, Actuators and Microsystems. 331-334. DOI: 10.1109/SENSOR.2007.4300135 |
0.777 |
|
2007 |
Lutz M, Partridge A, Gupta P, Buchan N, Klaassen E, McDonald J, Petersen K. MEMS oscillators for high volume commercial applications Transducers and Eurosensors '07 - 4th International Conference On Solid-State Sensors, Actuators and Microsystems. 49-52. DOI: 10.1109/SENSOR.2007.4300068 |
0.319 |
|
2007 |
Lutz M, McDonald J, Gupta P, Partridge A, Dimpel C, Petersen K, Grace R. New MEMS timing references for automotive applications Advanced Microsystems For Automotive Applications 2007. 279-289. DOI: 10.1007/978-3-540-71325-8_22 |
0.361 |
|
2006 |
Candler RN, Hopcroft MA, Kim B, Park WT, Melamud R, Agarwal M, Yama G, Partridge A, Lutz M, Kenny TW. Long-term and accelerated life testing of a novel single-wafer vacuum encapsulation for MEMS resonators Journal of Microelectromechanical Systems. 15: 1446-1456. DOI: 10.1109/Jmems.2006.883586 |
0.743 |
|
2006 |
Candler RN, Duwel A, Varghese M, Chandorkar SA, Hopcroft MA, Park WT, Kim B, Yama G, Partridge A, Lutz M, Kenny TW. Impact of geometry on thermoelastic dissipation in micromechanical resonant beams Journal of Microelectromechanical Systems. 15: 927-934. DOI: 10.1109/Jmems.2006.879374 |
0.754 |
|
2006 |
Park WT, Partridge A, Candler RN, Ayanoor-Vitikkate V, Yama G, Lutz M, Kenny TW. Encapsulated submillimeter piezoresistive accelerometers Journal of Microelectromechanical Systems. 15: 507-514. DOI: 10.1109/Jmems.2006.876648 |
0.772 |
|
2006 |
Partridge A, McDonald J. MEMS resonators look to displace quartz resonators Euroasia Semiconductor. 28: 11-14. |
0.307 |
|
2005 |
Park WT, Candler RN, Ayanoor-Vitikkate V, Lutz M, Partridge A, Yama G, Kenny TW. Fully encapsulated sub-millimeter accelerometers Proceedings of the Ieee International Conference On Micro Electro Mechanical Systems (Mems). 347-350. |
0.776 |
|
2003 |
Candler RN, Park WT, Li H, Yama G, Partridge A, Lutz M, Kenny TW. Single Wafer Encapsulation of MEMS Devices Ieee Transactions On Advanced Packaging. 26: 227-232. DOI: 10.1109/Tadvp.2003.818062 |
0.804 |
|
2003 |
Park WT, Candler RN, Kronmueller S, Lutz M, Partridge A, Yama G, Kenny TW. Wafer-scale film encapsulation of micromachined accelerometers Transducers 2003 - 12th International Conference On Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. 2: 1903-1906. DOI: 10.1109/SENSOR.2003.1217163 |
0.708 |
|
2003 |
Candler RN, Li H, Lutz M, Park WT, Partridge A, Yama G, Kenny TW. Investigation of energy loss mechanisms in micromechanical resonators Transducers 2003 - 12th International Conference On Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers. 1: 332-335. DOI: 10.1109/SENSOR.2003.1215320 |
0.695 |
|
2003 |
Lynch JP, Partridge A, Law KH, Kenny TW, Kiremidjian AS, Carryer E. Design of piezoresistive MEMS-based accelerometer for integration with wireless sensing unit for structural monitoring Journal of Aerospace Engineering. 16: 108-114. DOI: 10.1061/(Asce)0893-1321(2003)16:3(108) |
0.617 |
|
2003 |
Park WT, Cho J, Li H, Kenny TW, Candler RN, Li HJ, Partridge A, Yama G, Lutz M. Wafer scale encapsulation of MEMS devices Advances in Electronic Packaging. 1: 209-212. |
0.766 |
|
2002 |
Kenny TW, Candler RN, Li HJ, Park WT, Cho J, Li H, Partridge A, Yama G, Lutz M. An integrated wafer-scale packaging process for MEMS American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 2: 51-54. DOI: 10.1115/IMECE2002-39270 |
0.774 |
|
2002 |
Chow EM, Chandrasekaran V, Partridge A, Nishida T, Sheplak M, Quate CF, Kenny TW. Process compatible polysilicon-based electrical through-wafer interconnects in silicon substrates Journal of Microelectromechanical Systems. 11: 631-640. DOI: 10.1109/Jmems.2002.805206 |
0.775 |
|
2000 |
Partridge A, Reynolds JK, Chui BW, Chow EM, Fitzgerald AM, Zhang L, Maluf NI, Kenny TW. High-performance planar piezoresistive accelerometer Journal of Microelectromechanical Systems. 9: 58-66. DOI: 10.1109/84.825778 |
0.797 |
|
1999 |
Partridge A, Reynolds JK, Grade JD, Kane BJ, Maluf NI, Kovacs GTA, Kenny TW. Integrated controller for tunnel sensors Ieee Journal of Solid-State Circuits. 34: 1099-1107. DOI: 10.1109/4.777108 |
0.795 |
|
1998 |
Liu CH, Barzilai AM, Reynolds JK, Partridge A, Kenny TW, Grade JD, Rockstad HK. Characterization of a high-sensitivity micromachined tunneling accelerometer with micro-g resolution Journal of Microelectromechanical Systems. 7: 235-243. DOI: 10.1109/84.679388 |
0.777 |
|
1997 |
Grade J, Barzilai A, Reynolds JK, Liu C, Partridge A, Jerman H, Kenny T. Wafer-scale processing, assembly, and testing of tunneling infrared detectors Sensors. 2: 1241-1244. DOI: 10.1109/Sensor.1997.635453 |
0.8 |
|
1997 |
Grade J, Barzilai A, Reynolds JK, Liu C, Partridge A, Miller LM, Podosek JA, Kenny T. Low frequency drift in tunnel sensors Sensors. 2: 871-874. DOI: 10.1109/Sensor.1997.635240 |
0.801 |
|
1997 |
Liu CH, Grade JD, Barzilai AM, Reynolds JK, Partridge A, Rockstad HK, Kenny TW. Characterization of a high-sensitivity micromachined tunneling accelerometer Sensors. 1: 471-472. DOI: 10.1109/Sensor.1997.613688 |
0.79 |
|
1997 |
Liu CH, Reynolds JK, Partridge A, Grade JD, Barzilai AM, Kenny TW, Rockstad HK. A high-sensitivity micromachined accelerometer based on electron tunneling transducers American Society of Mechanical Engineers, Dynamic Systems and Control Division (Publication) Dsc. 62: 13-20. |
0.791 |
|
1997 |
Grade J, Barzilai A, Reynolds JK, Liu CH, Partridge A, Miller LM, Podosek JA, Kenny T. Low frequency drift in tunnel sensors International Conference On Solid-State Sensors and Actuators, Proceedings. 2: 871-874. |
0.791 |
|
1997 |
Grade J, Barzilai A, Reynolds JK, Liu CH, Partridge A, Jerman H, Kenny T. Wafer-scale processing, assembly, and testing of tunneling infrared detectors International Conference On Solid-State Sensors and Actuators, Proceedings. 2: 1241-1244. |
0.789 |
|
1995 |
Liu CH, Reynolds JK, Partridge A, Kenny TW, Miller LM, Podosek JA, Rockstad HK, Kaiser WJ. High-bandwidth feedback control of micromachined tunneling sensors American Society of Mechanical Engineers, Dynamic Systems and Control Division (Publication) Dsc. 57: 1001-1010. |
0.331 |
|
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