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Bing Shi, Ph.D. - Publications

Affiliations: 
2013 Electrical Engineering University of Maryland, College Park, College Park, MD 
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9 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2014 Zhang Y, Shi B, Srivastava A. Statistical Framework for Designing On-Chip Thermal Sensing Infrastructure in Nanoscale Systems Ieee Transactions On Very Large Scale Integration Systems. 22: 270-279. DOI: 10.1109/Tvlsi.2013.2244926  0.494
2014 Shi B, Srivastava A. Optimized Micro-Channel Design for Stacked 3-D-ICs Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 33: 90-100. DOI: 10.1109/Tcad.2013.2279514  0.542
2014 Serafy C, Shi B, Srivastava A. A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs Integration. 47: 307-317. DOI: 10.1016/J.Vlsi.2013.11.004  0.487
2013 Bar-Cohen A, Srivastava A, Shi B. Thermo-electrical co-design of three-dimensional integrated circuits: Challenges and opportunities Computational Thermal Sciences. 5: 441-458. DOI: 10.1615/Computthermalscien.2013007643  0.55
2013 Shi B, Zhang Y, Srivastava A. Dynamic Thermal Management Under Soft Thermal Constraints Ieee Transactions On Very Large Scale Integration Systems. 21: 2045-2054. DOI: 10.1109/Tvlsi.2012.2227854  0.512
2013 Shi B, Srivastava A, Bar-Cohen A. Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit Iet Circuits, Devices and Systems. 7: 223-231. DOI: 10.1049/Iet-Cds.2013.0026  0.536
2013 Shi B, Srivastava A. Micro-Fluidic Cooling for Stacked 3D-ICs: Fundamentals, Modeling and Design Advances in Computers. 88: 79-124. DOI: 10.1016/B978-0-12-407725-6.00002-2  0.536
2012 Shi B, Zhang Y, Srivastava A. Accelerating Gate Sizing Using Graphics Processing Units Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 160-164. DOI: 10.1109/Tcad.2011.2164539  0.47
2011 Shi B, Srivastava A. Unified Datacenter Power Management Considering On-Chip and Air Temperature Constraints Sustainable Computing: Informatics and Systems. 1: 91-98. DOI: 10.1016/J.Suscom.2011.02.001  0.495
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