Year |
Citation |
Score |
2020 |
Nezhadbadeh S, Neumann A, Zarkesh-Ha P, Brueck SRJ. Chirped-grating spectrometer-on-a-chip. Optics Express. 28: 24501-24510. PMID 32906990 DOI: 10.1364/Oe.398072 |
0.386 |
|
2017 |
Fahs B, Chowdhury AJ, Zhang Y, Ghasemi J, Hitchcock C, Zarkesh-Ha P, Hella MM. Design and Modeling of Blue-Enhanced and Bandwidth-Extended PN Photodiode in Standard CMOS Technology Ieee Transactions On Electron Devices. 64: 2859-2866. DOI: 10.1109/Ted.2017.2700389 |
0.312 |
|
2016 |
Fiorante GRC, Ghasemi J, Zarkesh-Ha P, Krishna S. Spatio-Temporal Bias-Tunable Readout Circuit for On-Chip Intelligent Image Processing Ieee Transactions On Circuits and Systems I: Regular Papers. 63: 1825-1832. DOI: 10.1109/Tcsi.2016.2593991 |
0.37 |
|
2016 |
Fahs B, Chellis J, Senneca MJ, Chowdhury A, Ray S, Mirvakili A, Mazzara B, Zhang Y, Ghasemi J, Miao Y, Zarkesh-Ha P, Koomson VJ, Hella MM. A 6-m OOK VLC Link Using CMOS-Compatible p-n Photodiode and Red LED Ieee Photonics Technology Letters. 28: 2846-2849. DOI: 10.1109/Lpt.2016.2623558 |
0.33 |
|
2015 |
Neumann A, Ghasemi J, Nezhadbadeh S, Nie X, Zarkesh-Ha P, Brueck SR. CMOS-compatible plenoptic detector for LED lighting applications. Optics Express. 23: 23208-16. PMID 26368423 DOI: 10.1364/Oe.23.023208 |
0.301 |
|
2014 |
Atghiaee A, Masoumi N, Zarkesh-Ha P, Mehri M. Predictive application of PIDF and PPC for interconnects' crosstalk, TSV, and LER issues in UDSM ICs and nano-systems Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 22: 438-443. DOI: 10.1109/Tvlsi.2013.2243849 |
0.334 |
|
2012 |
Jang WY, Hayat MM, Zarkesh-Ha P, Krishna S. Continuous time-varying biasing approach for spectrally tunable infrared detectors. Optics Express. 20: 29823-37. PMID 23388809 DOI: 10.1364/Oe.20.029823 |
0.314 |
|
2011 |
Zarkesh-Ha P, Shahi AAM. Stochastic analysis and design guidelines for CNFETs in gigascale integrated systems Ieee Transactions On Electron Devices. 58: 530-539. DOI: 10.1109/Ted.2010.2092780 |
0.367 |
|
2011 |
Xu JF, Fiorante GRC, Zarkesh-Ha P, Krishna S. A Readout Integrated Circuit (ROIC) with hybrid source/sensor array Ieee Photonic Society 24th Annual Meeting, Pho 2011. 97-98. DOI: 10.1109/Pho.2011.6110443 |
0.373 |
|
2010 |
Zarkesh-Ha P, Jang W, Nguyen P, Khoshakhlagh A, Xu J. A reconfigurable ROIC for integrated infrared spectral sensing 2010 23rd Annual Meeting of the Ieee Photonics Society, Photinics 2010. 714-715. DOI: 10.1109/Photonics.2010.5699088 |
0.353 |
|
2009 |
Ghaida RS, Doniger K, Zarkesh-Ha P. Random yield prediction based on a stochastic layout sensitivity model Ieee Transactions On Semiconductor Manufacturing. 22: 329-337. DOI: 10.1109/Tsm.2009.2024821 |
0.344 |
|
2009 |
Ghaida RS, Zarkesh-Ha P. A layout sensitivity model for eestimating electromigration-vulnerable narrow interconnects Journal of Electronic Testing: Theory and Applications (Jetta). 25: 67-77. DOI: 10.1007/S10836-008-5079-X |
0.352 |
|
2008 |
Mallajosyula A, Zarkesh-Ha P. A robust single event upset hardened clock distribution network Ieee International Integrated Reliability Workshop Final Report. 121-124. DOI: 10.1109/IRWS.2008.4796101 |
0.306 |
|
2007 |
Sarvari R, Naeemi A, Zarkesh-Ha P, Meindl JD. Design and optimization for nanoscale power distribution networks in gigascale systems Proceedings of the Ieee 2007 International Interconnect Technology Conference - Digest of Technical Papers. 190-192. |
0.711 |
|
2004 |
Joyner JW, Zarkesh-Ha P, Meindl JD. Global interconnect design in a three-dimensional system-on-a-chip Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 12: 367-372. DOI: 10.1109/Tvlsi.2004.825835 |
0.751 |
|
2004 |
Zarkesh-Ha P, Doniger K, Loh W, Bendix P. Prediction of interconnect adjacency distribution: Derivation, validation, and applications International Workshop On System Level Interconnect Prediction, Slip. 99-106. |
0.347 |
|
2003 |
Zarkesh-Ha P, Doniger K, Loh W, Sun D, Stephani R, Priebe G. A compact model for analysis and design of on-chip power network with decoupling capacitors Proceedings - Ieee International Conference On Computer Design: Vlsi in Computers and Processors. 84-89. |
0.317 |
|
2002 |
Meindl JD, Davis JA, Zarkesh-Ha P, Patel CS, Martin KP, Kohl PA. Interconnect opportunities for gigascale integration Ibm Journal of Research and Development. 46: 245-263. DOI: 10.1147/Rd.462.0245 |
0.735 |
|
2001 |
Joyner JW, Venkatesan R, Zarkesh-Ha P, Davis JA, Meindl JD. Impact of three-dimensional architectures on interconnects in gigascale integration Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 9: 922-928. DOI: 10.1109/92.974905 |
0.745 |
|
2001 |
Meindl JD, Venkatesan R, Davis JA, Joyner J, Naeemi A, Zarkesh-Ha P, Bakir M, Mulé T, Kohl PA, Martin KP. Interconnecting device opportunities for gigascale integration (GSI) Technical Digest - International Electron Devices Meeting. 525-528. |
0.734 |
|
2001 |
Joyner JW, Zarkesh-Ha P, Meindl JD. A stochastic global net-length distribution for a three-dimensional system-on-a-chip (3D-SoC) Proceedings of the Annual Ieee International Asic Conference and Exhibit. 147-151. |
0.757 |
|
2001 |
Naeemi A, Patel CS, Bakir MS, Zarkesh-Ha P, Martin KP, Meindl JD. Sea of leads: A disruptive paradigm for a system-on-a-chip (SoC) Digest of Technical Papers - Ieee International Solid-State Circuits Conference. 280-281. |
0.723 |
|
2001 |
Saint-Laurent M, Zarkesh-Ha P, Swaminathan M, Meindl JD. Optimal clock distribution with an array of phase-locked loops for multiprocessor chips Midwest Symposium On Circuits and Systems. 1: 454-457. |
0.334 |
|
2000 |
Joyner JW, Zarkesh-Ha P, Davis JA, Meindl JD. A three-dimensional stochastic wire-length distribution for variable separation of strata Proceedings of the Ieee 2000 International Interconnect Technology Conference, Iitc 2000. 126-128. DOI: 10.1109/IITC.2000.854301 |
0.755 |
|
2000 |
Chen Q, Davis JA, Zarkesh-Ha P, Meindl JD. A novel via blockage model and its implications Proceedings of the Ieee 2000 International Interconnect Technology Conference, Iitc 2000. 15-17. DOI: 10.1109/IITC.2000.854267 |
0.368 |
|
2000 |
Chen Q, Davis JA, Zarkesh-Ha P, Meindl JD. A compact physical via blockage model Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 8: 689-692. DOI: 10.1109/92.902263 |
0.571 |
|
2000 |
Zarkesh-Ha P, Davis JA, Meindl JD. Prediction of net-length distribution for global interconnects in a heterogeneous system-on-a-chip Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 8: 649-659. DOI: 10.1109/92.902259 |
0.571 |
|
2000 |
Joyner JW, Zarkesh-Ha P, Davis JA, Meindl JD. Vertical pitch limitations on performance enhancement in bonded three-dimensional interconnect architectures International Workshop On System-Level Interconnect Prediction (Slip 2000). 123-127. |
0.764 |
|
2000 |
Naeemi A, Zarkesh-Ha P, Patel CS, Meindl JD. Performance improvement using on-board wires for on-chip interconnects Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 325-328. |
0.572 |
|
2000 |
Zarkesh-Ha P, Meindl JD. Integrated architecture for global interconnects in a gigascale system-on-a-chip (GSoC) Digest of Technical Papers - Symposium On Vlsi Technology. 194-195. |
0.425 |
|
2000 |
Zarkesh-Ha P, Davis JA, Loh W, Meindl JD. Prediction of interconnect fan-out distribution using Rent's rule International Workshop On System-Level Interconnect Prediction (Slip 2000). 107-112. |
0.523 |
|
1999 |
Zarkesh-Ha P, Meindl JD. Asymptotically zero power dissipation gigahertz clock distribution networks Ieee Topical Meeting On Electrical Performance of Electronic Packaging. 57-60. |
0.305 |
|
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