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Hsin-Ping Chen, Ph.D. - Publications

Affiliations: 
2010 University of California, Los Angeles, Los Angeles, CA 
Area:
3D IC packaging and joule heating, metal-silicon interfaces, electromigration, pb-free solder joints
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1 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Chen HP, Huang CW, Wang CW, Wu WW, Liao CN, Chen LJ, Tu KN. Optimization of the nanotwin-induced zigzag surface of copper by electromigration. Nanoscale. PMID 26787289 DOI: 10.1039/C5Nr05418D  0.329
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