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Michael G. Pecht - Publications

Affiliations: 
Mechanical Engineering University of Maryland, College Park, College Park, MD 
Area:
Mechanical Engineering
Website:
https://enme.umd.edu/clark/faculty/574/Michael-Pecht
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286 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Lee C, Jo S, Kwon D, Pecht M. Capacity-fading Behavior Analysis for Early Detection of Unhealthy Li-ion Batteries Ieee Transactions On Industrial Electronics. 1-1. DOI: 10.1109/Tie.2020.2972468  0.568
2020 Hu X, Zheng Y, Howey DA, Perez H, Foley A, Pecht M. Battery warm-up methodologies at subzero temperatures for automotive applications: Recent advances and perspectives Progress in Energy and Combustion Science. 77: 100806. DOI: 10.1016/J.Pecs.2019.100806  0.332
2020 Romero J, Azarian MH, Pecht M. Reliability analysis of multilayer polymer aluminum electrolytic capacitors Microelectronics Reliability. 112: 113725. DOI: 10.1016/J.Microrel.2020.113725  0.361
2020 Su L, Yu X, Li K, Pecht M. Defect inspection of flip chip solder joints based on non-destructive methods: A review Microelectronics Reliability. 110: 113657. DOI: 10.1016/J.Microrel.2020.113657  0.323
2020 Liu X, Li L, Das D, Pecht M. An electro-thermal parametric degradation model of insulated gate bipolar transistor modules Microelectronics Reliability. 104: 113559. DOI: 10.1016/J.Microrel.2019.113559  0.36
2020 Romero JA, Azarian MH, Pecht M. Life model for tantalum electrolytic capacitors with conductive polymers Microelectronics Reliability. 104: 113550. DOI: 10.1016/J.Microrel.2019.113550  0.335
2020 Hu X, Xu L, Lin X, Pecht M. Battery Lifetime Prognostics Joule. 4: 310-346. DOI: 10.1016/J.Joule.2019.11.018  0.317
2020 Jameson NJ, Azarian MH, Pecht M. Improved electromagnetic coil insulation health monitoring using equivalent circuit model analysis International Journal of Electrical Power & Energy Systems. 119: 105829. DOI: 10.1016/J.Ijepes.2020.105829  0.326
2020 Diao W, Naqvi IH, Pecht M. Early detection of anomalous degradation behavior in lithium-ion batteries Journal of Energy Storage. 32: 101710. DOI: 10.1016/J.Est.2020.101710  0.356
2020 Pandian G, Pecht M, Zio E, Hodkiewicz M. Data-driven reliability analysis of Boeing 787 Dreamliner Chinese Journal of Aeronautics. 33: 1969-1979. DOI: 10.1016/J.Cja.2020.02.003  0.312
2019 Wu Y, Wang Y, Yung WKC, Pecht M. Ultrasonic Health Monitoring of Lithium-Ion Batteries Electronics. 8: 751. DOI: 10.3390/Electronics8070751  0.317
2019 Xiong R, Zhang Y, Wang J, He H, Peng S, Pecht M. Lithium-Ion Battery Health Prognosis Based on a Real Battery Management System Used in Electric Vehicles Ieee Transactions On Vehicular Technology. 68: 4110-4121. DOI: 10.1109/Tvt.2018.2864688  0.32
2019 Lee J, Kwon D, Pecht MG. Reduction of Li-ion Battery Qualification Time Based on Prognostics and Health Management Ieee Transactions On Industrial Electronics. 66: 7310-7315. DOI: 10.1109/Tie.2018.2880701  0.496
2019 Ning Y, Azarian MH, Pecht M. Development of a Microvia Fatigue Life Model Using a Response Surface Method Ieee Transactions On Device and Materials Reliability. 19: 176-188. DOI: 10.1109/Tdmr.2019.2898179  0.368
2019 Dinmohammadi F, Flynn D, Bailey C, Pecht M, Yin C, Rajaguru P, Robu V. Predicting Damage and Life Expectancy of Subsea Power Cables in Offshore Renewable Energy Applications Ieee Access. 7: 54658-54669. DOI: 10.1109/Access.2019.2911260  0.362
2019 Huang C, Romero JA, Osterman M, Das D, Pecht M. Life cycle trends of electronic materials, processes and components Microelectronics Reliability. 99: 262-276. DOI: 10.1016/J.Microrel.2019.05.023  0.329
2019 Zhang Y, Xiong R, He H, Pecht M. Validation and verification of a hybrid method for remaining useful life prediction of lithium-ion batteries Journal of Cleaner Production. 212: 240-249. DOI: 10.1016/J.Jclepro.2018.12.041  0.308
2019 Saxena S, Xing Y, Kwon D, Pecht M. Accelerated degradation model for C-rate loading of lithium-ion batteries International Journal of Electrical Power & Energy Systems. 107: 438-445. DOI: 10.1016/J.Ijepes.2018.12.016  0.546
2018 Patel NK, Bishop SR, Utter RG, Das D, Pecht M. Failure Modes, Mechanisms, Effects, and Criticality Analysis of Ceramic Anodes of Solid Oxide Fuel Cells Electronics. 7: 323. DOI: 10.3390/Electronics7110323  0.318
2018 Diao W, Xing Y, Saxena S, Pecht M. Evaluation of Present Accelerated Temperature Testing and Modeling of Batteries Applied Sciences. 8: 1786. DOI: 10.3390/App8101786  0.353
2018 Romero J, Azarian MH, Morillo C, Pecht M. Effects of Moisture and Temperature on Membrane Switches in Laptop Keyboards Ieee Transactions On Device and Materials Reliability. 18: 535-545. DOI: 10.1109/Tdmr.2018.2866776  0.319
2018 Wang K, Guo H, Xu A, Jameson NJ, Pecht M, Yan B. Creating Self-Aware Low-Voltage Electromagnetic Coils for Incipient Insulation Degradation Monitoring for Smart Manufacturing Ieee Access. 6: 69860-69868. DOI: 10.1109/Access.2018.2880266  0.342
2018 Ye X, Chen C, Kang M, Zhai G, Pecht M. A Joint Distribution-Based Testability Metric Estimation Model for Unreliable Tests Ieee Access. 6: 42566-42577. DOI: 10.1109/Access.2018.2859750  0.314
2018 Liu Z, Jia Z, Vong C, Han J, Yan C, Pecht M. A Patent Analysis of Prognostics and Health Management (PHM) Innovations for Electrical Systems Ieee Access. 6: 18088-18107. DOI: 10.1109/Access.2018.2818114  0.377
2017 Cheng X, Yao L, Pecht M. Lithium-ion battery state-of-charge estimation based on deconstructed equivalent circuit at different open-circuit voltage relaxation times Journal of Zhejiang University Science. 18: 256-267. DOI: 10.1631/Jzus.A1600251  0.314
2017 Chang M, Kang M, Pecht M. Prognostics-Based LED Qualification Using Similarity-Based Statistical Measure With RVM Regression Model Ieee Transactions On Industrial Electronics. 64: 5667-5677. DOI: 10.1109/Tie.2017.2677301  0.303
2017 Jameson NJ, Azarian MH, Pecht M. Impedance-Based Condition Monitoring for Insulation Systems Used in Low-Voltage Electromagnetic Coils Ieee Transactions On Industrial Electronics. 64: 3748-3757. DOI: 10.1109/Tie.2017.2652359  0.377
2017 Shrivastava A, Azarian MH, Pecht M. Failure of Polymer Aluminum Electrolytic Capacitors Under Elevated Temperature Humidity Environments Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 745-750. DOI: 10.1109/Tcpmt.2017.2658446  0.342
2017 Sood B, Pecht M. The effect of epoxy/glass interfaces on CAF failures in printed circuit boards Microelectronics Reliability. 82: 235-243. DOI: 10.1016/J.Microrel.2017.10.027  0.352
2017 Cheng S, Huang C, Pecht M. A review of lead-free solders for electronics applications Microelectronics Reliability. 75: 77-95. DOI: 10.1016/J.Microrel.2017.06.016  0.544
2017 Pandian GP, Das D, Li C, Zio E, Pecht M. A critique of reliability prediction techniques for avionics applications Chinese Journal of Aeronautics. 31: 10-20. DOI: 10.1016/J.Cja.2017.11.004  0.373
2016 Kohani M, Pecht M. New Minimum Relative Humidity Requirements Are Expected to Lead to More Medical Device Failures. Journal of Medical Systems. 40: 58. PMID 26660689 DOI: 10.1007/S10916-015-0421-1  0.306
2016 Tian J, Morillo C, Azarian MH, Pecht M. Motor Bearing Fault Detection Using Spectral Kurtosis-Based Feature Extraction Coupled with K-Nearest Neighbor Distance Analysis Ieee Transactions On Industrial Electronics. 63: 1793-1803. DOI: 10.1109/Tie.2015.2509913  0.577
2016 Kwon D, Hodkiewicz MR, Fan J, Shibutani T, Pecht MG. IoT-Based Prognostics and Systems Health Management for Industrial Applications Ieee Access. 4: 3659-3670. DOI: 10.1109/Access.2016.2587754  0.504
2016 Mohammed A, Pecht M. A stretchable and screen-printable conductive ink for stretchable electronics Applied Physics Letters. 109: 184101. DOI: 10.1063/1.4965706  0.309
2016 Shrivastava A, Azarian MH, Pecht M. Rapid Assessment Testing of Polymer Aluminum Electrolytic Capacitors in Elevated Temperature–Humidity Environments Journal of Failure Analysis and Prevention. 16: 1059-1066. DOI: 10.1007/S11668-016-0184-0  0.323
2016 Pearl A, Osterman M, Pecht M. Evaluation of ENEPIG and Immersion Silver Surface Finishes Under Drop Loading Journal of Electronic Materials. 45: 391-402. DOI: 10.1007/S11664-015-4104-Y  0.357
2015 Fan J, Qian C, Yung K, Fan X, Zhang G, Pecht M. Optimal Design of Life Testing for High-Brightness White LEDs Using the Six Sigma DMAIC Approach Ieee Transactions On Device and Materials Reliability. 15: 576-587. DOI: 10.1109/Tdmr.2015.2483751  0.337
2015 Williard N, Baek D, Park JW, Choi B, Osterman M, Pecht M. A Life Model for Supercapacitors Ieee Transactions On Device and Materials Reliability. 15: 519-528. DOI: 10.1109/Tdmr.2015.2479466  0.349
2015 Ning Y, Azarian MH, Pecht M. Effects of Voiding on Thermomechanical Reliability of Copper-Filled Microvias: Modeling and Simulation Ieee Transactions On Device and Materials Reliability. 15: 500-510. DOI: 10.1109/Tdmr.2015.2476823  0.627
2015 Kwon D, Azarian MH, Pecht M. Remaining-life prediction of solder joints using RF impedance analysis and Gaussian process regression Ieee Transactions On Components, Packaging and Manufacturing Technology. 5: 1602-1609. DOI: 10.1109/Tcpmt.2015.2477098  0.726
2015 Geng J, Azarian M, Pecht M. Opportunistic maintenance for multi-component systems considering structural dependence and economic dependence Journal of Systems Engineering and Electronics. 26: 493-501. DOI: 10.1109/Jsee.2015.00057  0.578
2015 Tian J, Azarian MH, Pecht M. Rolling element bearing fault detection using density-based clustering 2014 International Conference On Prognostics and Health Management, Phm 2014. DOI: 10.1109/ICPHM.2014.7036387  0.54
2015 Jameson NJ, Azarian MH, Pecht M. Fault diagnostic opportunities for solenoid operated valves using physics-of-failure analysis 2014 International Conference On Prognostics and Health Management, Phm 2014. DOI: 10.1109/ICPHM.2014.7036385  0.57
2015 He W, Miao Q, Azarian M, Pecht M. Health monitoring of cooling fan bearings based on wavelet filter Mechanical Systems and Signal Processing. 64: 149-161. DOI: 10.1016/J.Ymssp.2015.04.002  0.596
2015 Oh H, Choi S, Kim K, Youn BD, Pecht M. An empirical model to describe performance degradation for warranty abuse detection in portable electronics Reliability Engineering and System Safety. 142: 92-99. DOI: 10.1016/J.Ress.2015.04.019  0.476
2015 Patil N, Das D, Pecht MG. Anomaly detection for IGBTs using Mahalanobis distance Microelectronics Reliability. 55: 1054-1059. DOI: 10.1016/J.Microrel.2015.04.001  0.474
2015 Hendricks C, Williard N, Mathew S, Pecht M. A failure modes, mechanisms, and effects analysis (FMMEA) of lithium-ion batteries Journal of Power Sources. 297: 113-120. DOI: 10.1016/J.Jpowsour.2015.07.100  0.367
2015 Guo J, Li Z, Pecht M. A Bayesian approach for Li-Ion battery capacity fade modeling and cycles to failure prognostics Journal of Power Sources. 281: 173-184. DOI: 10.1016/J.Jpowsour.2015.01.164  0.327
2015 Wang K, Tian J, Pecht M, Xu A. A Prognostics and Health Management Based Method for Refurbishment Decision Making for Electromechanical Systems Ifac-Papersonline. 48: 454-459. DOI: 10.1016/J.Ifacol.2015.06.123  0.309
2015 Fan J, Yung KC, Pecht M. Predicting long-term lumen maintenance life of LED light sources using a particle filter-based prognostic approach Expert Systems With Applications. 42: 2411-2420. DOI: 10.1016/J.Eswa.2014.10.021  0.318
2015 Menon S, Osterman M, Pecht M. Evaluating the Impact of Dwell Time on Solder Interconnect Durability Under Bending Loads Journal of Electronic Materials. 44: 4549-4556. DOI: 10.1007/S11664-015-3931-1  0.388
2015 Menon S, George E, Osterman M, Pecht M. High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives Journal of Materials Science: Materials in Electronics. 26: 4021-4030. DOI: 10.1007/S10854-015-2940-4  0.337
2014 Bakhshi R, Kunche S, Pecht M. Intermittent Failures in Hardware and Software Journal of Electronic Packaging. 136: 11014. DOI: 10.1115/1.4026639  0.345
2014 Shrivastava A, Azarian MH, Morillo C, Sood B, Pecht M. Detection and reliability risks of counterfeit electrolytic capacitors Ieee Transactions On Reliability. 63: 468-479. DOI: 10.1109/Tr.2014.2315914  0.659
2014 Chauhan P, Mathew S, Osterman M, Pecht M. In situ interconnect failure prediction using canaries Ieee Transactions On Device and Materials Reliability. 14: 826-832. DOI: 10.1109/Tdmr.2014.2326184  0.386
2014 Fritzler T, Azarian MH, Pecht MG. Scintillation conditioning of tantalum capacitors with manganese dioxide cathodes Ieee Transactions On Device and Materials Reliability. 14: 630-638. DOI: 10.1109/TDMR.2014.2314731  0.58
2014 Chai F, Osterman M, Pecht M. Strain-range-based solder life predictions under temperature cycling with varying amplitude and mean Ieee Transactions On Device and Materials Reliability. 14: 351-357. DOI: 10.1109/Tdmr.2013.2273121  0.556
2014 Bakhshi R, Azarian MH, Pecht MG. Effects of voiding on the degradation of microvias in high density interconnect printed circuit boards under thermomechanical stresses Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1374-1379. DOI: 10.1109/TCPMT.2014.2322105  0.56
2014 Oh H, Azarian MH, Morillo C, Pecht M, Rhem E. Failure mechanisms of ball bearings under lightly loaded, non-accelerated usage conditions Tribology International. 81: 291-299. DOI: 10.1016/J.Triboint.2014.09.014  0.703
2014 He X, Azarian MH, Pecht MG. Analysis of the kinetics of electrochemical migration on printed circuit boards using Nernst-Planck transport equation Electrochimica Acta. 142: 1-10. DOI: 10.1016/j.electacta.2014.06.041  0.557
2014 Vasan A, Sood B, Pecht M. Carbon footprinting of electronic products Applied Energy. 136: 636-648. DOI: 10.1016/J.Apenergy.2014.09.074  0.319
2014 Xing Y, He W, Pecht M, Tsui KL. State of charge estimation of lithium-ion batteries using the open-circuit voltage at various ambient temperatures Applied Energy. 113: 106-115. DOI: 10.1016/J.Apenergy.2013.07.008  0.329
2014 Ratzker M, Pearl A, Osterman M, Pecht M, Milad G. Review of Capabilities of the ENEPIG Surface Finish Journal of Electronic Materials. 43: 3885-3897. DOI: 10.1007/S11664-014-3322-Z  0.301
2014 Shrivastava A, Pecht M. Counterfeit capacitors in the supply chain Journal of Materials Science: Materials in Electronics. 25: 645-652. DOI: 10.1007/S10854-013-1147-9  0.346
2014 Shrivastava A, Bangerth S, Azarian MH, Morillo C, Pecht M, Levin M, Steinhardt L, Callini A. Detection of capacitor electrolyte residues with FTIR in failure analysis Journal of Materials Science: Materials in Electronics. 25: 635-644. DOI: 10.1007/S10854-013-1146-X  0.635
2014 Haddad G, Sandborn PA, Pecht MG. Using maintenance options to maximize the benefits of prognostics for wind farms Wind Energy. 17: 775-791. DOI: 10.1002/We.1610  0.509
2013 Pecht M. The Counterfeit Electronics Problem Open Journal of Social Sciences. 1: 12-16. DOI: 10.4236/Jss.2013.17003  0.309
2013 George E, Osterman M, Pecht M, Coyle R, Parker R, Benedetto E. Thermal Cycling Reliability of Alternative Low-Silver Tin-Based Solders Journal of Microelectronics and Electronic Packaging. 2013: 120-127. DOI: 10.4071/Isom-2013-Ta45  0.338
2013 Williard N, He W, Hendricks C, Pecht M. Lessons Learned from the 787 Dreamliner Issue on Lithium-Ion Battery Reliability Energies. 6: 4682-4695. DOI: 10.3390/En6094682  0.314
2013 Chen Y, Miao Q, Zheng B, Wu S, Pecht M. Quantitative Analysis of Lithium-Ion Battery Capacity Prediction via Adaptive Bathtub-Shaped Function Energies. 6: 3082-3096. DOI: 10.3390/En6063082  0.326
2013 Song B, Azarian MH, Pecht MG. Effect of temperature and relative humidity on the impedance degradation of dust-contaminated electronics Journal of the Electrochemical Society. 160. DOI: 10.1149/2.024303Jes  0.641
2013 Vasan ASS, Long B, Pecht M. Diagnostics and Prognostics Method for Analog Electronic Circuits Ieee Transactions On Industrial Electronics. 60: 5277-5291. DOI: 10.1109/Tie.2012.2224074  0.323
2013 Oh H, Azarian MH, Das D, Pecht M. A critique of the IPC-9591 standard: Performance parameters for air moving devices Ieee Transactions On Device and Materials Reliability. 13: 146-155. DOI: 10.1109/Tdmr.2012.2223820  0.689
2013 Challa V, Rundle P, Pecht M. Challenges in the qualification of electronic components and systems Ieee Transactions On Device and Materials Reliability. 13: 26-35. DOI: 10.1109/Tdmr.2011.2173801  0.583
2013 Sreenilayam-Raveendran RK, Azarian MH, Pecht M, Rhem E. Detection of under-lubricated ball bearings using vibration signals Phm 2013 - 2013 Ieee International Conference On Prognostics and Health Management, Conference Proceedings. DOI: 10.1109/ICPHM.2013.6621431  0.578
2013 Sreenilayam-Raveendran RK, Azarian MH, Morillo C, Pecht MG, Kida K, Santos EC, Honda T, Koike H. Comparative evaluation of metal and polymer ball bearings Wear. 302: 1499-1505. DOI: 10.1016/j.wear.2013.01.057  0.545
2013 Patil N, Das D, Scanff E, Pecht MG. Long term storage reliability of antifuse field programmable gate arrays Microelectronics Reliability. 53: 2052-2056. DOI: 10.1016/J.Microrel.2013.06.016  0.504
2013 Wang D, Miao Q, Pecht M. Prognostics of lithium-ion batteries based on relevance vectors and a conditional three-parameter capacity degradation model Journal of Power Sources. 239: 253-264. DOI: 10.1016/J.Jpowsour.2013.03.129  0.303
2013 Dai J, Das D, Ohadi M, Pecht M. Reliability risk mitigation of free air cooling through prognostics and health management Applied Energy. 111: 104-112. DOI: 10.1016/J.Apenergy.2013.04.047  0.311
2013 Alam MA, Azarian MH, Pecht MG. Modeling the electrical conduction in epoxy-BaTiO3 nanocomposites Journal of Electronic Materials. 42: 1101-1107. DOI: 10.1007/S11664-013-2523-1  0.651
2012 Alam MA, Azarian MH, Osterman M, Pecht M. Accelerated temperature and voltage stress tests of embedded planar capacitors with epoxy-BaTiO3 composite dielectric Journal of Electronic Packaging, Transactions of the Asme. 134. DOI: 10.1115/1.4006704  0.708
2012 Haddad G, Sandborn PA, Pecht MG. An options approach for decision support of systems with prognostic capabilities Ieee Transactions On Reliability. 61: 872-883. DOI: 10.1109/Tr.2012.2220699  0.535
2012 Elerath JG, Pecht M. IEEE 1413: A standard for reliability predictions Ieee Transactions On Reliability. 61: 125-129. DOI: 10.1109/Tr.2011.2172030  0.757
2012 Jin X, Ma EWM, Cheng LL, Pecht M. Health Monitoring of Cooling Fans Based on Mahalanobis Distance With mRMR Feature Selection Ieee Transactions On Instrumentation and Measurement. 61: 2222-2229. DOI: 10.1109/Tim.2012.2187240  0.352
2012 Chai F, Osterman M, Pecht M. Reliability of gull-wing and leadless packages subjected to temperature cycling after rework Ieee Transactions On Device and Materials Reliability. 12: 510-519. DOI: 10.1109/Tdmr.2012.2191786  0.604
2012 Huang Y, Vasan ASS, Doraiswami R, Osterman M, Pecht M. MEMS Reliability Review Ieee Transactions On Device and Materials Reliability. 12: 482-493. DOI: 10.1109/Tdmr.2012.2191291  0.353
2012 Fan J, Yung K, Pecht M. Lifetime Estimation of High-Power White LED Using Degradation-Data-Driven Method Ieee Transactions On Device and Materials Reliability. 12: 470-477. DOI: 10.1109/Tdmr.2012.2190415  0.344
2012 Cheng S, Tom K, Pecht M. Anomaly Detection of Polymer Resettable Circuit Protection Devices Ieee Transactions On Device and Materials Reliability. 12: 420-427. DOI: 10.1109/Tdmr.2011.2170689  0.591
2012 Alam MA, Azarian MH, Pecht MG. Reliability of embedded planar capacitors with epoxy-BaTiO 3 composite dielectric during temperature-humidity-bias tests Ieee Transactions On Device and Materials Reliability. 12: 86-93. DOI: 10.1109/Tdmr.2011.2168527  0.672
2012 Sun J, Cheng S, Pecht M. Prognostics of Multilayer Ceramic Capacitors Via the Parameter Residuals Ieee Transactions On Device and Materials Reliability. 12: 49-57. DOI: 10.1109/Tdmr.2011.2162517  0.577
2012 Alam MA, Azarian MH, Pecht MG. Highly accelerated life testing of embedded planar capacitors with epoxy-BaTiO 3 Nanocomposite Dielectric Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 1580-1586. DOI: 10.1109/Tcpmt.2012.2204994  0.674
2012 Kumar R, Azarian MH, Pecht MG, Kim NH. Gear fault diagnosis using electrical signals and its application to wind power systems Phm 2012 - 2012 Ieee Int. Conf.On Prognostics and Health Management: Enhancing Safety, Efficiency, Availability, and Effectiveness of Systems Through Phm Technology and Application, Conference Program. DOI: 10.1109/ICPHM.2012.6299527  0.556
2012 Patil N, Das D, Pecht MG. A prognostic approach for non-punch through and field stop IGBTs Microelectronics Reliability. 52: 482-488. DOI: 10.1016/J.Microrel.2011.10.017  0.524
2012 Kumar S, Vichare NM, Dolev E, Pecht M. A health indicator method for degradation detection of electronic products Microelectronics Reliability. 52: 439-445. DOI: 10.1016/J.Microrel.2011.09.030  0.777
2012 Cheng S, Pecht M. Using cross-validation for model parameter selection of sequential probability ratio test Expert Systems With Applications. 39: 8467-8473. DOI: 10.1016/J.Eswa.2012.01.172  0.567
2012 Mathew S, Alam M, Pecht M. Identification of Failure Mechanisms to Enhance Prognostic Outcomes Journal of Failure Analysis and Prevention. 12: 66-73. DOI: 10.1007/S11668-011-9508-2  0.535
2012 Han S, Osterman M, Meschter S, Pecht M. Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation Journal of Electronic Materials. 41: 2508-2518. DOI: 10.1007/S11664-012-2179-2  0.553
2012 Cheng S, Tom K, Pecht M. Failure Causes of a Polymer Resettable Circuit Protection Device Journal of Electronic Materials. 41: 2419-2430. DOI: 10.1007/S11664-012-2148-9  0.587
2012 Alam MA, Azarian MH, Pecht MG. Embedded capacitors in printed wiring board: A technological review Journal of Electronic Materials. 41: 2286-2303. DOI: 10.1007/S11664-012-2044-3  0.678
2012 Alam MA, Azarian MH, Pecht MG. Effects of moisture absorption on the electrical parameters of embedded capacitors with epoxy-BaTiO 3 nanocomposite dielectric Journal of Materials Science: Materials in Electronics. 23: 1504-1510. DOI: 10.1007/S10854-011-0618-0  0.647
2012 Oh H, Shibutani T, Pecht M. Precursor monitoring approach for reliability assessment of cooling fans Journal of Intelligent Manufacturing. 23: 173-178. DOI: 10.1007/S10845-009-0342-2  0.542
2011 Alam MA, Azarian MH, Osterman M, Pecht M. Prognostics of failures in embedded planar capacitors using model-based and data-driven approaches Journal of Intelligent Material Systems and Structures. 22: 1293-1304. DOI: 10.1177/1045389X11416024  0.73
2011 Wang W, Pecht M. Economic Analysis of Canary-Based Prognostics and Health Management Ieee Transactions On Industrial Electronics. 58: 3077-3089. DOI: 10.1109/Tie.2010.2072897  0.314
2011 Fan J, Yung KC, Pecht M. Physics-of-Failure-Based Prognostics and Health Management for High-Power White Light-Emitting Diode Lighting Ieee Transactions On Device and Materials Reliability. 11: 407-416. DOI: 10.1109/Tdmr.2011.2157695  0.357
2011 George E, Das D, Osterman M, Pecht M. Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High-Temperature Applications Ieee Transactions On Device and Materials Reliability. 11: 328-338. DOI: 10.1109/Tdmr.2011.2134100  0.381
2011 Ma L, Sood B, Pecht M. Effect of Moisture on Thermal Properties of Halogen-Free and Halogenated Printed-Circuit-Board Laminates Ieee Transactions On Device and Materials Reliability. 11: 66-75. DOI: 10.1109/Tdmr.2011.2106785  0.327
2011 Mathew S, Wang W, Osterman M, Pecht M. Assessment of Solder-Dipping as a Tin Whisker Mitigation Strategy Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 957-963. DOI: 10.1109/Tcpmt.2011.2104963  0.366
2011 Wang W, Osterman M, Das D, Pecht M. Solder Joint Reliability of SnAgCu Solder Refinished Components Under Temperature Cycling Test Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 798-808. DOI: 10.1109/Tcpmt.2010.2095273  0.36
2011 Azarian MH, Lando E, Pecht M. An analytical model of the RF impedance change due to solder joint cracking 2011 Ieee 15th Workshop On Signal Propagation On Interconnects, Spi 2011 - Proceedings. 89-92. DOI: 10.1109/SPI.2011.5898847  0.552
2011 Jin X, Azarian MH, Lau C, Cheng LL, Pecht M. Physics-of-failure analysis of cooling fans 2011 Prognostics and System Health Management Conference, Phm-Shenzhen 2011. DOI: 10.1109/PHM.2011.5939584  0.617
2011 Gray KA, Pecht M. Long-Term Thermal Overstressing of Computers Ieee Design & Test of Computers. 28: 58-65. DOI: 10.1109/Mdt.2011.127  0.307
2011 Kwon D, Azarian MH, Pecht M. Nondestructive sensing of interconnect failure mechanisms using time-domain reflectometry Ieee Sensors Journal. 11: 1236-1241. DOI: 10.1109/Jsen.2010.2088118  0.737
2011 Miao Q, Azarian M, Pecht M. Cooling fan bearing fault identification using vibration measurement 2011 Ieee International Conference On Prognostics and Health Management, Phm 2011 - Conference Proceedings. DOI: 10.1109/ICPHM.2011.6024350  0.574
2011 Sood B, Osterman M, Pecht M. Tin whisker analysis of Toyota's electronic throttle controls Circuit World. 37: 4-9. DOI: 10.1108/03056121111155611  0.367
2011 Alam MA, Azarian MH, Osterman M, Pecht M. Temperature and voltage aging effects on electrical conduction mechanism in epoxy-BaTiO3 composite dielectric used in embedded capacitors Microelectronics Reliability. 51: 946-952. DOI: 10.1016/J.Microrel.2011.01.002  0.649
2011 Wu C-, Yang C-, Lo S-, Vichare NM, Rhem E, Pecht MG. Automatic data mining for telemetry database of computer systems Microelectronics Reliability. 51: 263-269. DOI: 10.1016/J.Microrel.2010.09.008  0.772
2011 Woo S, Park J, Pecht M. Reliability design and case study of refrigerator parts subjected to repetitive loads under consumer usage conditions Engineering Failure Analysis. 18: 1818-1830. DOI: 10.1016/J.Engfailanal.2011.05.007  0.331
2011 Woo S, O’Neal DL, Pecht M. Reliability design of residential sized refrigerators subjected to repetitive random vibration loads during rail transport Engineering Failure Analysis. 18: 1322-1332. DOI: 10.1016/J.Engfailanal.2011.03.021  0.321
2011 He X, Azarian MH, Pecht MG. Evaluation of electrochemical migration on printed circuit boards with lead-free and tin-lead solder Journal of Electronic Materials. 40: 1921-1936. DOI: 10.1007/s11664-011-1672-3  0.564
2011 Sood B, Das D, Pecht M. Screening for counterfeit electronic parts Journal of Materials Science: Materials in Electronics. 22: 1511-1522. DOI: 10.1007/S10854-011-0500-0  0.328
2011 Williard N, Sood B, Osterman M, Pecht M. Disassembly methodology for conducting failure analysis on lithium–ion batteries Journal of Materials Science: Materials in Electronics. 22: 1616-1630. DOI: 10.1007/S10854-011-0452-4  0.352
2011 Sood B, Pecht M. Conductive filament formation in printed circuit boards: effects of reflow conditions and flame retardants Journal of Materials Science: Materials in Electronics. 22: 1602-1615. DOI: 10.1007/S10854-011-0449-Z  0.364
2010 Cheng S, Azarian MH, Pecht MG. Sensor systems for prognostics and health management. Sensors (Basel, Switzerland). 10: 5774-97. PMID 22219686 DOI: 10.3390/S100605774  0.676
2010 Gu J, Pecht M. Prognostics and Health Assessment Implementation for Electronic Products Journal of the Iest. 53: 44-58. DOI: 10.17764/Jiet.53.1.18763271G23N61X0  0.52
2010 Wang W, Osterman M, Das D, Pecht M. Solder Joint Reliability of SnBi Finished TSOPs with Alloy 42 Lead-Frame under Temperature Cycling Journal of Astm International. 7: 102939. DOI: 10.1520/Jai102939  0.355
2010 Kumar S, Chow TWS, Pecht M. Approach to Fault Identification for Electronic Products Using Mahalanobis Distance Ieee Transactions On Instrumentation and Measurement. 59: 2055-2064. DOI: 10.1109/Tim.2009.2032884  0.452
2010 Han S, Osterman M, Pecht MG. Electrical Shorting Propensity of Tin Whiskers Ieee Transactions On Electronics Packaging Manufacturing. 33: 205-211. DOI: 10.1109/Tepm.2010.2053377  0.519
2010 Sood B, Sanapala R, Das D, Pecht M, Huang CY, Tsai MY. Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-Free Soldering Ieee Transactions On Electronics Packaging Manufacturing. 33: 98-111. DOI: 10.1109/Tepm.2010.2042453  0.36
2010 Cheng S, Tom K, Pecht M. Failure Precursors for Polymer Resettable Fuses Ieee Transactions On Device and Materials Reliability. 10: 374-380. DOI: 10.1109/Tdmr.2010.2053371  0.591
2010 Nie L, Osterman M, Pecht MG. Microstructural Analysis of Reworked Ball Grid Array Assemblies Under Thermomechanical Loading Conditions Ieee Transactions On Device and Materials Reliability. 10: 276-286. DOI: 10.1109/Tdmr.2010.2048327  0.403
2010 Challa V, Lopez LD, Osterman M, Pecht MG. Stress relaxation testing of stamped metal land-grid-array sockets Ieee Transactions On Device and Materials Reliability. 10: 55-61. DOI: 10.1109/Tdmr.2009.2032922  0.752
2010 Weininger S, Kapur KC, Pecht M. Exploring medical device reliability and its relationship to safety and effectiveness Ieee Transactions On Components and Packaging Technologies. 33: 240-245. DOI: 10.1109/Tcapt.2010.2044093  0.326
2010 Kwon D, Azarian MH, Pecht M. Degradation of digital signal characteristics due to intermediate stages of interconnect failure 2010 Ieee 14th Workshop On Signal Propagation On Interconnects, Spi 2010 - Proceedings. 55-58. DOI: 10.1109/SPI.2010.5483578  0.708
2010 Oh H, Azarian MH, Pecht M, White CH, Sohaney RC, Rhem E. Physics-of-failure approach for fan PHM in electronics applications 2010 Prognostics and System Health Management Conference, Phm '10. DOI: 10.1109/PHM.2010.5413501  0.629
2010 Cheng S, Tom K, Thomas L, Pecht M. A Wireless Sensor System for Prognostics and Health Management Ieee Sensors Journal. 10: 856-862. DOI: 10.1109/Jsen.2009.2035817  0.537
2010 Challa V, Pecht M, Liu S, Yu Q. A verification of application specific component qualification Proceedings - 2010 11th International Conference On Electronic Packaging Technology and High Density Packaging, Icept-Hdp 2010. 1265-1268. DOI: 10.1109/ICEPT.2010.5582783  0.524
2010 Elerath JG, Pecht M. IEEE 1413: An IEEE standard for reliability predictions Proceedings - 2010 11th International Conference On Electronic Packaging Technology and High Density Packaging, Icept-Hdp 2010. 1-6. DOI: 10.1109/ICEPT.2010.5582388  0.743
2010 Shrivastava A, Sood B, Azarian M, Osterman M, Pecht M. An investigation into a low insulation resistance failure of multilayer ceramic capacitors Proceedings - Electronic Components and Technology Conference. 1811-1815. DOI: 10.1109/ECTC.2010.5490718  0.603
2010 Alam MA, Azarian MH, Osterman M, Pecht M. Effectiveness of embedded capacitors in reducing the number of surface mount capacitors for decoupling applications Circuit World. 36: 22-30. DOI: 10.1108/03056121011015068  0.672
2010 Tiku S, Pecht M. Validation of reliability capability evaluation model using a quantitative assessment process International Journal of Quality and Reliability Management. 27: 938-952. DOI: 10.1108/02656711011075125  0.694
2010 Kumar S, Dolev E, Pecht MG. Parameter selection for health monitoring of electronic products Microelectronics Reliability. 50: 161-168. DOI: 10.1016/J.Microrel.2009.09.016  0.416
2010 Woo S, O’Neal DL, Pecht M. Reliability design of a reciprocating compressor suction reed valve in a common refrigerator subjected to repetitive pressure loads Engineering Failure Analysis. 17: 979-991. DOI: 10.1016/J.Engfailanal.2009.12.001  0.335
2010 Woo S, O’Neal DL, Pecht M. Failure analysis and redesign of the evaporator tubing in a Kimchi refrigerator Engineering Failure Analysis. 17: 369-379. DOI: 10.1016/J.Engfailanal.2009.08.003  0.349
2010 Miao Q, Wang D, Pecht M. A probabilistic description scheme for rotating machinery health evaluation Journal of Mechanical Science and Technology. 24: 2421-2430. DOI: 10.1007/S12206-010-0908-0  0.338
2010 Nie L, Mueller M, Osterman M, Pecht M. Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test Journal of Electronic Materials. 39: 1218-1232. DOI: 10.1007/S11664-010-1209-1  0.495
2009 Pecht M, Gu J. Physics-of-failure-based prognostics for electronic products: Transactions of the Institute of Measurement and Control. 31: 309-322. DOI: 10.1177/0142331208092031  0.551
2009 Patil N, Celaya J, Das D, Goebel K, Pecht M. Precursor Parameter Identification for Insulated Gate Bipolar Transistor (IGBT) Prognostics Ieee Transactions On Reliability. 58: 271-276. DOI: 10.1109/Tr.2009.2020134  0.569
2009 Lopez LD, Pecht MG. Modeling of IC socket contact resistance for reliability and health monitoring applications Ieee Transactions On Reliability. 58: 264-270. DOI: 10.1109/Tr.2009.2020122  0.723
2009 Sanapala R, Sood B, Das D, Pecht M. Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates Ieee Transactions On Electronics Packaging Manufacturing. 32: 272-280. DOI: 10.1109/Tepm.2009.2029566  0.317
2009 Qi H, Osterman M, Pecht M. Design of Experiments for Board-Level Solder Joint Reliability of PBGA Package Under Various Manufacturing and Multiple Environmental Loading Conditions Ieee Transactions On Electronics Packaging Manufacturing. 32: 32-40. DOI: 10.1109/Tepm.2008.2005905  0.572
2009 Khuu V, Osterman M, Bar-Cohen A, Pecht M. Effects of Temperature Cycling and Elevated Temperature/Humidity on the Thermal Performance of Thermal Interface Materials Ieee Transactions On Device and Materials Reliability. 9: 379-391. DOI: 10.1109/Tdmr.2009.2025367  0.318
2009 Tsai M, Chang H, Pecht M. Warpage Analysis of Flip-Chip PBGA Packages Subject to Thermal Loading Ieee Transactions On Device and Materials Reliability. 9: 419-424. DOI: 10.1109/Tdmr.2009.2023847  0.317
2009 Kwon D, Azarian MH, Pecht M. Early detection of interconnect degradation by continuous monitoring of RF impedance Ieee Transactions On Device and Materials Reliability. 9: 296-304. DOI: 10.1109/Tdmr.2009.2020170  0.728
2009 Lopez LD, Challa V, Pecht MG. Assessing the reliability of elastomer sockets in temperature environments Ieee Transactions On Device and Materials Reliability. 9: 80-86. DOI: 10.1109/Tdmr.2008.2012117  0.763
2009 Pecht M, Zuga L. China as Hegemon of the Global Electronics Industry: How It Got That Way and Why It Won't Change Ieee Transactions On Components and Packaging Technologies. 32: 935-939. DOI: 10.1109/Tcapt.2009.2032830  0.326
2009 Chauhan P, Pecht M, Osterman M, Lee SWR. Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability Ieee Transactions On Components and Packaging Technologies. 32: 693-700. DOI: 10.1109/Tcapt.2009.2030983  0.345
2009 Pecht M, Kumar S. Baseline Performance of Notebook Computers Under Various Environmental and Usage Conditions for Prognostics Ieee Transactions On Components and Packaging Technologies. 32: 667-676. DOI: 10.1109/Tcapt.2009.2026890  0.47
2009 Nie L, Osterman M, Song F, Lo J, Lee SWR, Pecht M. Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages Ieee Transactions On Components and Packaging Technologies. 32: 901-908. DOI: 10.1109/Tcapt.2009.2021392  0.531
2009 Qi H, Osterman M, Pecht M. A Rapid Life-Prediction Approach for PBGA Solder Joints Under Combined Thermal Cycling and Vibration Loading Conditions Ieee Transactions On Components and Packaging Technologies. 32: 283-292. DOI: 10.1109/Tcapt.2009.2015231  0.566
2009 Varghese J, Dasgupta A, Song B, Azarian M, Pecht M. The role of aging on dynamic failure envelopes of OSP-Sn37Pb interconnects in Plastic Ball Grid Array (PBGA) packages Ieee Transactions On Components and Packaging Technologies. 32: 173-179. DOI: 10.1109/Tcapt.2009.2013985  0.622
2009 Shibutani T, Osterman M, Pecht M. Standards for Tin Whisker Test Methods on Lead-Free Components Ieee Transactions On Components and Packaging Technologies. 32: 216-219. DOI: 10.1109/Tcapt.2009.2013311  0.36
2009 Gu J, Vichare NM, Tinsley MG, Pecht MG. Computer usage monitoring for design and reliability tests Ieee Transactions On Components and Packaging Technologies. 32: 550-556. DOI: 10.1109/Tcapt.2009.2013202  0.784
2009 Elerath JG, Pecht M. A highly accurate method for assessing reliability of redundant arrays of inexpensive disks (RAID) Ieee Transactions On Computers. 58: 289-299. DOI: 10.1109/Tc.2008.163  0.776
2009 Kwon D, Azarian MH, Pecht M. Identification of interconnect failure mechanisms using RF impedance analysis 2009 Ieee Workshop On Signal Propagation On Interconnects, Spi '09. DOI: 10.1109/SPI.2009.5089855  0.713
2009 Gu J, Barker D, Pecht M. Health Monitoring and Prognostics of Electronics Subject to Vibration Load Conditions Ieee Sensors Journal. 9: 1479-1485. DOI: 10.1109/Jsen.2009.2026988  0.531
2009 Kwon D, Azarian MH, Pecht M. Detection of solder joint failure precursors on tin-lead and lead-free assemblies using RF impedance analysis Proceedings - Electronic Components and Technology Conference. 663-667. DOI: 10.1109/ECTC.2009.5074085  0.725
2009 Woo S, Pecht M, O'Neal DL. Reliability design and case study of a refrigerator compressor subjected to repetitive loads International Journal of Refrigeration-Revue Internationale Du Froid. 32: 478-486. DOI: 10.1016/J.Ijrefrig.2008.07.006  0.335
2009 Woo S, Ryu D, Pecht M. Design evaluation of a French refrigerator drawer system subjected to repeated food storage loads Engineering Failure Analysis. 16: 2224-2234. DOI: 10.1016/J.Engfailanal.2009.03.005  0.335
2009 Woo S, O’Neal DL, Pecht M. Design of a hinge kit system in a Kimchi refrigerator receiving repetitive stresses Engineering Failure Analysis. 16: 1655-1665. DOI: 10.1016/J.Engfailanal.2008.11.010  0.333
2009 Woo S, O’Neal DL, Pecht M. Improving the reliability of a water dispenser lever in a refrigerator subjected to repetitive stresses Engineering Failure Analysis. 16: 1597-1606. DOI: 10.1016/J.Engfailanal.2008.10.017  0.342
2009 Wang W, Choubey A, Azarian MH, Pecht M. An assessment of immersion silver surface finish for lead-free electronics Journal of Electronic Materials. 38: 815-827. DOI: 10.1007/S11664-009-0761-Z  0.734
2008 Yang D, Chan YC, Wu BY, Pecht M. Electromigration and thermomigration behavior of flip chip solder joints in high current density packages Journal of Materials Research. 23: 2333-2339. DOI: 10.1557/Jmr.2008.0305  0.312
2008 Wang W, Chan YC, Pecht M. Anisotropic Conductive Adhesives for Flip-Chip Interconnects Journal of Adhesion Science and Technology. 22: 871-892. DOI: 10.1163/156856108X305552  0.302
2008 Zhan S, Azarian MH, Pecht M. Reliability of printed circuit boards processed using no-clean flux technology in temperature-humidity-bias conditions Ieee Transactions On Device and Materials Reliability. 8: 426-434. DOI: 10.1109/Tdmr.2008.922908  0.73
2008 Choubey A, Osterman M, Pecht M. Microstructure and intermetallic formation in SnAgCu BGA components attached with SnPb solder under isothermal aging Ieee Transactions On Device and Materials Reliability. 8: 160-166. DOI: 10.1109/Tdmr.2007.915049  0.602
2008 Keimasi M, Azarian MH, Pecht MG. Flex cracking of multilayer ceramic capacitors assembled with Pb-free and tin-lead solders Ieee Transactions On Device and Materials Reliability. 8: 182-192. DOI: 10.1109/Tdmr.2007.912256  0.782
2008 Qi H, Vichare NM, Azarian MH, Pecht M. Analysis of solder joint failure criteria and measurement techniques in the qualification of electronic products Ieee Transactions On Components and Packaging Technologies. 31: 469-477. DOI: 10.1109/Tcapt.2008.921647  0.802
2008 Lantz L, Pecht MG, Wood M. The measurement of ion diffusion in epoxy molding compounds by dynamic secondary ion mass spectroscopy Ieee Transactions On Components and Packaging Technologies. 31: 527-535. DOI: 10.1109/Tcapt.2008.2001126  0.672
2008 Qi H, Zhang Q, Tinsley EC, Osterman M, Pecht MG. High Cycle Cyclic Torsion Fatigue of PBGA Pb-Free Solder Joints Ieee Transactions On Components and Packaging Technologies. 31: 309-314. DOI: 10.1109/Tcapt.2007.898337  0.519
2008 Qi H, Osterman M, Pecht M. Modeling of Combined Temperature Cycling and Vibration Loading on PBGA Solder Joints Using an Incremental Damage Superposition Approach Ieee Transactions On Advanced Packaging. 31: 463-472. DOI: 10.1109/Tadvp.2008.927847  0.556
2008 Kwon D, Azarian MH, Pecht MG. Effect of solder joint degradation on RF impedance 12th Ieee Workshop On Signal Propagation On Interconnects, Spi. DOI: 10.1109/SPI.2008.4558411  0.706
2008 Lopez LD, Pecht MG. Maxima-SPRT methodology for health monitoring of contact resistance in IC sockets 2008 International Conference On Prognostics and Health Management, Phm 2008. DOI: 10.1109/PHM.2008.4711465  0.739
2008 Gu J, Azarian MH, Pecht MG. Failure prognostics of multilayer ceramic capacitors in temperature-humidity-bias conditions 2008 International Conference On Prognostics and Health Management, Phm 2008. DOI: 10.1109/PHM.2008.4711464  0.615
2008 Kwon D, Azarian MH, Pecht MG. Early detection of interconnect degradation using RF impedance and SPRT 2008 International Conference On Prognostics and Health Management, Phm 2008. DOI: 10.1109/PHM.2008.4711443  0.62
2008 Lopez LD, Pecht MG. Assessing the operating temperature and relative humidity environment of IC sockets 2008 International Conference On Prognostics and Health Management, Phm 2008. DOI: 10.1109/PHM.2008.4711442  0.736
2008 Weiqiang W, Azarian MH, Pecht M. Qualification for product development Proceedings, 2008 International Conference On Electronic Packaging Technology and High Density Packaging, Icept-Hdp 2008. DOI: 10.1109/ICEPT.2008.4606933  0.608
2008 Challa V, Torres M, Osterman M, Pecht M, Lopez L. Stress relaxation in a commercial stamped metal land grid array socket Proceedings - Electronic Components and Technology Conference. 2139-2144. DOI: 10.1109/ECTC.2008.4550281  0.524
2008 Kwon D, Azarian MH, Pecht MG. Detection of solder joint degradation using RF impedance analysis Proceedings - Electronic Components and Technology Conference. 606-610. DOI: 10.1109/ECTC.2008.4550035  0.708
2008 Qi H, Ganesan S, Pecht MG. No-fault-found and intermittent failures in electronic products. Microelectronics Reliability. 48: 663-674. DOI: 10.1016/J.Microrel.2008.02.003  0.526
2008 Woo S, Pecht M. Failure analysis and redesign of a helix upper dispenser Engineering Failure Analysis. 15: 642-653. DOI: 10.1016/J.Engfailanal.2007.10.005  0.33
2008 Choubey A, Yu H, Osterman M, Pecht M, Yun F, Yonghong L, Ming X. Intermetallics characterization of lead-free solder joints under isothermal aging Journal of Electronic Materials. 37: 1130-1138. DOI: 10.1007/S11664-008-0466-8  0.587
2007 Mathew S, Das D, Osterman M, Pecht M, Ferebee R, Clayton J. Virtual Remaining Life Assessment of Electronic Hardware Subjected to Shock and Random Vibration Life Cycle Loads Journal of the Iest. 50: 86-97. DOI: 10.17764/Jiet.50.1.L5721M6160258L22  0.349
2007 Fukuda Y, Osterman M, Pecht M. Length Distribution Analysis for Tin Whisker Growth Ieee Transactions On Electronics Packaging Manufacturing. 30: 36-40. DOI: 10.1109/Tepm.2006.890638  0.566
2007 Eveloy V, Hwang Y, Pecht MG. The Effect of Electrostatic Discharge on Electrical Overstress Susceptibility in a Gallium Arsenide MESFET-Based Device Ieee Transactions On Device and Materials Reliability. 7: 200-208. DOI: 10.1109/Tdmr.2007.891529  0.382
2007 Deng Y, Pecht MG, Swift JA, Wallace SJ. Carbon Fiber-Based Grid Array Interconnects Ieee Transactions On Components and Packaging Technologies. 30: 716-723. DOI: 10.1109/Tcapt.2007.901719  0.477
2007 Qi H, Osterman M, Pecht M. Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications Ieee Transactions On Components and Packaging Technologies. 30: 242-247. DOI: 10.1109/Tcapt.2007.898346  0.571
2007 Elerath JG, Pecht M. Enhanced reliability modeling of RAID storage systems Proceedings of the International Conference On Dependable Systems and Networks. 175-184. DOI: 10.1109/DSN.2007.41  0.771
2007 Osterman M, Pecht M. Strain range fatigue life assessment of lead‐free solder interconnects subject to temperature cycle loading Soldering & Surface Mount Technology. 19: 12-17. DOI: 10.1108/09540910710836494  0.34
2007 Nie L, Azaruan MH, Keimasi M, Pecht M. Prognostics of ceramic capacitor temperature-humidity-bias reliability using Mahalanobis distance analysis Circuit World. 33: 21-28. DOI: 10.1108/03056120710776988  0.803
2007 Nie L, Pecht M, Ciocci R. Regulations and market trends in lead-free and halogen-free electronics Circuit World. 33: 4-9. DOI: 10.1108/03056120710750201  0.786
2007 Fang T, Mathew S, Osterman M, Pecht M. Assessment of risk resulting from unattached tin whisker bridging Circuit World. 33: 5-8. DOI: 10.1108/03056120710723652  0.573
2007 Tiku S, Azarian M, Pecht M. Using a reliability capability maturity model to benchmark electronics companies International Journal of Quality and Reliability Management. 24: 547-563. DOI: 10.1108/02656710710748394  0.773
2007 Vichare N, Rodgers P, Eveloy V, Pecht M. Environment and Usage Monitoringof Electronic Products for Health Assessment and Product Design Quality Technology and Quantitative Management. 4: 235-250. DOI: 10.1080/16843703.2007.11673148  0.794
2007 Gu J, Barker D, Pecht MG. Prognostics implementation of electronics under vibration loading Microelectronics Reliability. 47: 1849-1856. DOI: 10.1016/J.Microrel.2007.02.015  0.447
2007 Keimasi M, Azarian MH, Pecht M. Isothermal aging effects on flex cracking of multilayer ceramic capacitors with standard and flexible terminations Microelectronics Reliability. 47: 2215-2225. DOI: 10.1016/J.Microrel.2006.12.005  0.773
2007 Fukuda Y, Osterman MD, Pecht MG. The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth Microelectronics Reliability. 47: 88-92. DOI: 10.1016/J.Microrel.2006.04.011  0.5
2006 Mathew S, Das D, Osterman M, Pecht M, Ferebee R. Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board Journal of Electronic Packaging. 128: 339-345. DOI: 10.1115/1.2351897  0.388
2006 Fukuda Y, Osterman M, Pecht M. The Effect of Annealing on Tin Whisker Growth Ieee Transactions On Electronics Packaging Manufacturing. 29: 252-258. DOI: 10.1109/Tepm.2006.887390  0.538
2006 Zhan S, Azarian MH, Pecht MG. Surface insulation resistance of conformally coated printed circuit boards processed with no-clean flux Ieee Transactions On Electronics Packaging Manufacturing. 29: 217-223. DOI: 10.1109/Tepm.2006.882496  0.699
2006 Deng Y, Pecht M, Rogers K. Analysis of Phosphorus Flame Retardant Induced Leakage Currents in IC Packages Using SQUID Microscopy Ieee Transactions On Components and Packaging Technologies. 29: 804-808. DOI: 10.1109/Tcapt.2006.885960  0.688
2006 Pecht M, Tiku S. Bogus: electronic manufacturing and consumers confront a rising tide of counterfeit electronics Ieee Spectrum. 43: 37-46. DOI: 10.1109/Mspec.2006.1628506  0.669
2006 Ciocci R, Pecht M. Impact of environmental regulations on green electronics manufacture Microelectronics International. 23: 45-50. DOI: 10.1108/13565360610659716  0.781
2006 Pecht M, Humphrey D. Uprating of electronic parts to address obsolescence Microelectronics International. 23: 32-36. DOI: 10.1108/13565360610659699  0.312
2006 Ciocci R, Pecht M. Learning from the migration to lead‐free solder Soldering & Surface Mount Technology. 18: 14-18. DOI: 10.1108/09540910610685394  0.786
2006 Fang T, Osterman M, Mathew S, Pecht M. Tin whisker risk assessment Circuit World. 32: 25-29. DOI: 10.1108/03056120610663371  0.573
2006 Rogers KL, Pecht MG. A variant of conductive filament formation failures in PWBs with 3 and 4 mil spacings Circuit World. 32: 11-18. DOI: 10.1108/03056120610663362  0.587
2006 Pecht MG, Deng Y. Electronic device encapsulation using red phosphorus flame retardants Microelectronics Reliability. 46: 53-62. DOI: 10.1016/J.Microrel.2005.09.001  0.5
2006 Keimasi M, Ganesan S, Pecht M. Low temperature electrical measurements of silicon bipolar monolithic microwave integrated circuit (MMIC) amplifiers Microelectronics Reliability. 46: 326-334. DOI: 10.1016/J.Microrel.2005.07.002  0.779
2006 Fang T, Osterman MD, Pecht MG. Statistical analysis of tin whisker growth Microelectronics Reliability. 46: 846-849. DOI: 10.1016/J.Microrel.2005.06.002  0.527
2006 Donahoe DN, Pecht M, Lloyd IK, Ganesan S. Moisture induced degradation of multilayer ceramic capacitors Microelectronics Reliability. 46: 400-408. DOI: 10.1016/J.Microrel.2005.05.008  0.783
2005 Tiku S, Veneruso AF, Etchells RK, Pecht M. Risk Factors in Oil and Gas Well Electronics Compared to Other Electronic Industries Oil & Gas Science and Technology-Revue De L Institut Francais Du Petrole. 60: 721-730. DOI: 10.2516/Ogst:2005051  0.613
2005 Varghese J, Song B, Azarian MH, Dasgupta A, Pecht M. Failure site transition during drop testing of printed wiring assemblies American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 5: 139-146. DOI: 10.1115/IMECE2005-82428  0.559
2005 Zhao P, Pecht M. Mixed flowing gas studies of creep corrosion on plastic encapsulated microcircuit packages with noble metal pre-plated leadframes Ieee Transactions On Device and Materials Reliability. 5: 268-276. DOI: 10.1109/Tdmr.2005.846981  0.304
2005 Eveloy V, Ganesan S, Fukuda Y, Wu J, Pecht MG. Are you ready for lead-free electronics? Ieee Transactions On Components and Packaging Technologies. 28: 884-894. DOI: 10.1109/Tcapt.2005.859353  0.539
2005 Huang Y, Zhan S, Bigio D, Pecht MG. Distribution of a minor solid constituent in a transfer molded e-pad leadframe package Ieee Transactions On Components and Packaging Technologies. 28: 549-554. DOI: 10.1109/Tcapt.2005.848579  0.474
2005 Ganesan S, Pecht M. Open trace defects in FR4 printed circuit boards Circuit World. 32: 3-7. DOI: 10.1108/03056120610616490  0.341
2004 Murray S, Hillman C, Pecht M. Environmental Aging and Deadhesion of Polyimide Dielectric Films Journal of Electronic Packaging. 126: 390-397. DOI: 10.1115/1.1773853  0.348
2004 Xie J, Pecht M. Contact discontinuity modeling of electromechanical switches Ieee Transactions On Reliability. 53: 279-283. DOI: 10.1109/Tr.2004.829151  0.308
2004 Vichare N, Rodgers P, Eveloy V, Pecht MG. In situ temperature measurement of a notebook computer - a case study in health and usage monitoring of electronics Ieee Transactions On Device and Materials Reliability. 4: 658-663. DOI: 10.1109/Tdmr.2004.838403  0.803
2004 Pecht M, Fukuda Y, Rajagopal S. The impact of lead-free legislation exemptions on the electronics industry Ieee Transactions On Electronics Packaging Manufacturing. 27: 221-232. DOI: 10.1109/Agec.2004.1290860  0.568
2004 Ciocci R, Pecht M. Questions concerning the migration to lead‐free solder Circuit World. 30: 34-40. DOI: 10.1108/03056120410512226  0.794
2003 Fukuda Y, Casey P, Pecht M. Evaluation of selected japanese lead-free consumer electronics [Abstracts of Forthcoming Manuscripts] Ieee Transactions On Electronics Packaging Manufacturing. 26: 265-265. DOI: 10.1109/Tepm.2003.823167  0.481
2003 Fukuda Y, Casey P, Pecht M. Evaluation of selected Japanese lead-free consumer electronics Ieee Transactions On Electronics Packaging Manufacturing. 26: 305-312. DOI: 10.1109/Tepm.2003.820820  0.58
2003 Xie J, Pecht M. Reliability prediction modeling of semiconductor light emitting device Ieee Transactions On Device and Materials Reliability. 3: 218-222. DOI: 10.1109/Tdmr.2003.820294  0.31
2003 Donahoe DN, Pecht M. Are U.S. Jobs Moving to China? Ieee Transactions On Components and Packaging Technologies. 26: 682-686. DOI: 10.1109/Tcapt.2003.816655  0.772
2003 Lantz L, Pecht MG. Ion transport in encapsulants used in microcircuit packaging Ieee Transactions On Components and Packaging Technologies. 26: 199-205. DOI: 10.1109/Tcapt.2002.806183  0.67
2002 Li L, Xie J, Ramahi OM, Pecht M, Donham B. Airborne operation of portable electronic devices Ieee Antennas and Propagation Magazine. 44: 30-39. DOI: 10.1109/Map.2002.1043145  0.303
2002 Lantz L, Hwang S, Pecht M. Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing Microelectronics Reliability. 42: 1163-1170. DOI: 10.1016/S0026-2714(02)00091-4  0.699
2001 Pecht M, Dube M, Natishan M, Williams R, Banner J, Knowles I. Evaluation of built-in test Ieee Transactions On Aerospace and Electronic Systems. 37: 266-271. DOI: 10.1109/7.913684  0.354
2001 Rogers K, Hillman C, Pecht M. Hollow Fibers Can Accelerate Conductive Filament Formation Practical Failure Analysis. 1: 57-60. DOI: 10.1007/Bf02715335  0.563
2000 Das D, Pendse N, Pecht M, Condra L, Wilkinson C. Deciphering the deluge of data Ieee Circuits & Devices. 16: 26-34. DOI: 10.1109/101.876903  0.316
2000 Zhang K, Pecht M. Effectiveness of conformal coatings on a PBGA subjected to unbiased high humidity, high temperature tests Microelectronics International. 17: 16-20. DOI: 10.1108/13565360010352136  0.325
1999 Pecht M, Hillman C, Rogers K, Jennings D. Conductive filament formation: a potential reliability issue in laminated printed circuit cards with hollow fibers Ieee Transactions On Electronics Packaging Manufacturing. 22: 80-84. DOI: 10.1109/6104.755092  0.567
1999 Biagini RB, Rowland MA, Jackson M, Pecht M. Tipping the scales in your favor when uprating. How to avoid the legal risks of parts use outside the manufacturer's specified temperature range Ieee Circuits and Devices Magazine. 15: 15-23. DOI: 10.1109/101.780969  0.328
1999 Hillman C, Rogers K, Dasgupta A, Pecht M, Dusek R, Lorence B. Solder failure mechanisms in single‐sided insertion‐mount printed wiring boards Circuit World. 25: 28-38. DOI: 10.1108/03056129910269025  0.605
1999 Rogers K, Hillman C, Pecht M, Nachbor S. Conductive filament formation failure in a printed circuit board Circuit World. 25: 6-8. DOI: 10.1108/03056129910268882  0.611
1999 Kimseng K, Hoit M, Tiwari N, Pecht M. Physics-of-failure assessment of a cruise control module Microelectronics Reliability. 39: 1423-1444. DOI: 10.1016/S0026-2714(99)00018-9  0.363
1999 Ming S, Pecht M, Natishan MAE. A comparative assessment of gold plating thickness required for stationary electrical contacts Microelectronics Journal. 30: 217-222. DOI: 10.1016/S0026-2692(98)00109-8  0.326
1999 Jackson M, Mathur A, Pecht M, Kendall R. Part manufacturer assessment process Quality and Reliability Engineering International. 15: 457-468. DOI: 10.1002/(Sici)1099-1638(199911/12)15:6<457::Aid-Qre293>3.0.Co;2-6  0.306
1998 Sinnadurai N, Shukla AA, Pecht M. A critique of the Reliability Analysis Center failure-rate-model for plastic encapsulated microcircuits Ieee Transactions On Reliability. 47: 110-113. DOI: 10.1109/24.722270  0.379
1998 Pecht M, Rogers K, Fowler A. Characterization of a non‐woven randomly dispersed short fiber laminate Circuit World. 24: 34-37. DOI: 10.1108/03056129810212992  0.58
1998 Zhang Y, Pecht M, Lantz L. A case study of IC storage failures in Taipei trains Microelectronics Reliability. 38: 1811-1816. DOI: 10.1016/S0026-2714(98)00186-3  0.742
1998 Mahajan R, Pecht M. Reliability assessment of a plastic encapsulated RF switching device Microelectronics Reliability. 38: 1607-1610. DOI: 10.1016/S0026-2714(98)00020-1  0.316
1998 Sharma P, Upadhyayula K, Lantz L, Pecht M. Impact of pre-conditioning, voltage bias and temperature on reliability of plastic encapsulated microcircuits Microelectronics Reliability. 38: 581-584. DOI: 10.1016/S0026-2714(97)00201-1  0.73
1998 Williams R, Banner J, Knowles I, Dube M, Natishan M, Pecht M. An investigation of ‘cannot duplicate’ failures Quality and Reliability Engineering International. 14: 331-337. DOI: 10.1002/(Sici)1099-1638(199809/10)14:5<331::Aid-Qre183>3.0.Co;2-L  0.399
1997 McCluskey P, Munamarty R, Pecht M. Popcorning in PBGA Packages During IR Reflow Soldering Microelectronics International. 14: 20-23. DOI: 10.1108/13565369710800439  0.33
1997 Shukla A, Pecht M, Jordan J, Rogers K, Jennings D. Hollow Fibres in PCB, MCM‐L and PBGA Laminates May Induce Reliability Degradation Circuit World. 23: 5-6. DOI: 10.1108/03056129710800116  0.609
1997 Hakim EB, Fink J, Tam SM, Mccluskey P, Pecht M. Plastic-encapsulated Microcircuits (PEMs): Long-term Dormancy Studies Circuit World. 23: 26-29. DOI: 10.1108/03056129710370286  0.345
1997 Pecht M, Ranade Y, Pecht J. Effect of Delamination on Moisture Accelerated Failures in Plastic Encapsulated Microcircuits Circuit World. 23: 11-15. DOI: 10.1108/03056129710370259  0.38
1997 Kelkar N, Dasgupta A, Pecht M, Knowles I, Hawley M, Jennings D. ‘Smart’ Electronic Systems For Condition‐Based Health Management Quality and Reliability Engineering International. 13: 3-8. DOI: 10.1002/(Sici)1099-1638(199701)13:1<3::Aid-Qre54>3.0.Co;2-D  0.357
1996 Gannamani R, Pecht M. An experimental study of popcorning in plastic encapsulated microcircuits Ieee Transactions On Components, Packaging, and Manufacturing Technology: Part A. 19: 194-201. DOI: 10.1109/95.506104  0.371
1996 Rudra B, Li MJ, Pecht M, Jennings D. Electrochemical Migration in Multichip Modules Circuit World. 22: 67-70. DOI: 10.1108/03056129610799868  0.367
1996 Pecht M, Lall P. A Life-Cycle Approach To Design And Manufacturing Simulation Of Multichip Modules International Journal of Modelling and Simulation. 16: 173-183. DOI: 10.1080/02286203.1996.11760297  0.307
1995 Li MJ, Pecht M. Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages Journal of Electronic Packaging. 117: 225-229. DOI: 10.1115/1.2792096  0.332
1995 Lall P, Pecht M, Hakim EB. Characterization of functional relationship between temperature and microelectronic reliability Microelectronics Reliability. 35: 377-402. DOI: 10.1016/0026-2714(95)93067-K  0.342
1994 Pecht M, Wu X. Characterization of polyimides used in high density interconnects Ieee Transactions On Components, Packaging, and Manufacturing Technology: Part B. 17: 632-639. DOI: 10.1109/96.338734  0.307
1994 Rudra B, Pecht M, Jennings D. Assessing time-to-failure due to conductive filament formation in multi-layer organic laminates Ieee Transactions On Components, Packaging, and Manufacturing Technology: Part B. 17: 269-276. DOI: 10.1109/96.311773  0.367
1993 Weil L, Pecht M, Hakim E. Reliability Evaluation of Plastic Encapsulated Parts Ieee Transactions On Reliability. 42: 536-540. DOI: 10.1109/24.273571  0.334
1992 Dasgupta A, Oyan C, Barker D, Pecht M. Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach Journal of Electronic Packaging. 114: 152-160. DOI: 10.1115/1.2906412  0.309
1992 Bhandarkar SM, Dasgupta A, Barker D, Pecht M, Engelmaier W. Influence of Selected Design Variables on Thermo-Mechanical Stress Distributions in Plated-Through-Hole Structures Journal of Electronic Packaging. 114: 8-13. DOI: 10.1115/1.2905447  0.339
1992 Pecht M, Hakim E. The future of military standards. A focus on electronics Ieee Aerospace and Electronic Systems Magazine. 7: 16-19. DOI: 10.1109/62.149787  0.318
1992 Pecht M, Ramappan V. Are components still the major problem: a review of electronic system and device field failure returns Ieee Transactions On Components, Hybrids, and Manufacturing Technology. 15: 1160-1164. DOI: 10.1109/33.206943  0.371
1992 Condra L, O'Rear S, Freedman T, Flancia L, Pecht M, Barker D. Comparison of Plastic and Hermetic Microcircuits Under Temperature Cycling and Temperature Humidity Bias Ieee Transactions On Components, Hybrids, and Manufacturing Technology. 15: 640-650. DOI: 10.1109/33.180026  0.306
1992 Pecht M, Lall P, Hakim EB. The influence of temperature on integrated circuit failure mechanisms Quality and Reliability Engineering International. 8: 167-176. DOI: 10.1002/Qre.4680080304  0.365
1991 Hu JM, Pecht M. Temperature Dependence of the Mechanical Properties of GaAs Wafers Journal of Electronic Packaging. 113: 331-336. DOI: 10.1115/1.2905416  0.322
1991 Dasgupta A, Pecht M. Material failure mechanisms and damage models Ieee Transactions On Reliability. 40: 531-536. DOI: 10.1109/24.106769  0.357
1990 Osterman MD, Pecht M. Placement for reliability and routability of convectively cooled PWBs Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 9: 734-744. DOI: 10.1109/43.55206  0.327
1990 Pecht M. A model for moisture induced corrosion failures in microelectronic packages Ieee Transactions On Components, Hybrids, and Manufacturing Technology. 13: 383-389. DOI: 10.1109/33.56172  0.364
1990 Pecht M, Lall P, Whelan SJ. Temperature dependence of microelectronic device failures Quality and Reliability Engineering International. 6: 275-284. DOI: 10.1002/Qre.4680060410  0.342
1990 Pecht M, Dasgupta A, Barker D, Leonard CT. The reliability physics approach to failure prediction modelling Quality and Reliability Engineering International. 6: 267-273. DOI: 10.1002/Qre.4680060409  0.367
1990 Leonard CT, Pecht M. How failure prediction methodology affects electronic equipment design Quality and Reliability Engineering International. 6: 243-249. DOI: 10.1002/Qre.4680060406  0.372
1989 Osterman MD, Pecht M. Component Placement for Reliability on Conductively Cooled Printed Wiring Boards Journal of Electronic Packaging. 111: 149-156. DOI: 10.1115/1.3226521  0.311
1988 Pecht M, Kang W. A critique of Mil-Hdbk-217E reliability prediction methods Ieee Transactions On Reliability. 37: 453-457. DOI: 10.1109/24.9859  0.334
1987 Pecht M, Palmer M, Schenke W, Porter R. An Investigation into PWB Component-Placement Tradeoffs Ieee Transactions On Reliability. 36: 524-527. DOI: 10.1109/Tr.1987.5222462  0.325
1987 Pecht M. CALCE/RAMCAD for Electronics Ieee Transactions On Reliability. 5: 501-506. DOI: 10.1109/Tr.1987.5222457  0.302
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