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Valentin Dragoi - Publications

Affiliations: 
University of Texas, Houston, Houston, TX, United States 
Area:
Systems neuroscience
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59/189 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2023 Andrei AR, Akil AE, Kharas N, Rosenbaum R, Josić K, Dragoi V. Rapid compensatory plasticity revealed by dynamic correlated activity in monkeys in vivo. Nature Neuroscience. 26: 1960-1969. PMID 37828225 DOI: 10.1038/s41593-023-01446-w  0.354
2023 Parajuli A, Gutnisky D, Tandon N, Dragoi V. Endogenous fluctuations in cortical state selectively enhance different modes of sensory processing in human temporal lobe. Nature Communications. 14: 5591. PMID 37696880 DOI: 10.1038/s41467-023-41406-3  0.735
2023 Debes SR, Dragoi V. Suppressing feedback signals to visual cortex abolishes attentional modulation. Science (New York, N.Y.). 379: 468-473. PMID 36730414 DOI: 10.1126/science.ade1855  0.375
2023 Nigam S, Milton R, Pojoga S, Dragoi V. Adaptive coding across visual features during free-viewing and fixation conditions. Nature Communications. 14: 87. PMID 36604422 DOI: 10.1038/s41467-022-35656-w  0.436
2022 Kharas N, Andrei A, Debes SR, Dragoi V. Brain state limits propagation of neural signals in laminar cortical circuits. Proceedings of the National Academy of Sciences of the United States of America. 119: e2104192119. PMID 35858417 DOI: 10.1073/pnas.2104192119  0.346
2022 Iliescu BF, Hansen B, Dragoi V. Learning by Exposure in the Visual System. Brain Sciences. 12. PMID 35448039 DOI: 10.3390/brainsci12040508  0.606
2021 Chelaru MI, Eagleman S, Andrei AR, Milton R, Kharas N, Dragoi V. High-order interactions explain the collective behavior of cortical populations in executive but not sensory areas. Neuron. 109: 3954-3961.e5. PMID 34665999 DOI: 10.1016/j.neuron.2021.09.042  0.348
2021 Andrei AR, Debes S, Chelaru M, Liu X, Rodarte E, Spudich JL, Janz R, Dragoi V. Heterogeneous side-effects of cortical inactivation in behaving animals. Elife. 10. PMID 34505577 DOI: 10.7554/eLife.66400  0.367
2021 Nigam S, Pojoga S, Dragoi V. A distinct population of heterogeneously color-tuned neurons in macaque visual cortex. Science Advances. 7. PMID 33608266 DOI: 10.1126/sciadv.abc5837  0.316
2020 Pojoga SA, Kharas N, Dragoi V. Perceptually unidentifiable stimuli influence cortical processing and behavioral performance. Nature Communications. 11: 6109. PMID 33257683 DOI: 10.1038/s41467-020-19848-w  0.405
2020 Koren V, Andrei AR, Hu M, Dragoi V, Obermayer K. Pairwise Synchrony and Correlations Depend on the Structure of the Population Code in Visual Cortex. Cell Reports. 33: 108367. PMID 33176154 DOI: 10.1016/j.celrep.2020.108367  0.595
2020 Tremblay S, Acker L, Afraz A, Albaugh DL, Amita H, Andrei AR, Angelucci A, Aschner A, Balan PF, Basso MA, Benvenuti G, Bohlen MO, Caiola MJ, Calcedo R, Cavanaugh J, ... ... Dragoi V, et al. An Open Resource for Non-human Primate Optogenetics. Neuron. PMID 33080229 DOI: 10.1016/j.neuron.2020.09.027  0.465
2020 Milton R, Shahidi N, Dragoi V. Dynamic states of population activity in prefrontal cortical networks of freely-moving macaque. Nature Communications. 11: 1948. PMID 32327660 DOI: 10.1038/s41467-020-15803-x  0.353
2019 Koren V, Andrei AR, Hu M, Dragoi V, Obermayer K. Reading-out task variables as a low-dimensional reconstruction of neural spike trains in single trials. Plos One. 14: e0222649. PMID 31622346 DOI: 10.1371/journal.pone.0222649  0.588
2019 Andrei AR, Pojoga S, Janz R, Dragoi V. Integration of cortical population signals for visual perception. Nature Communications. 10: 3832. PMID 31444323 DOI: 10.1038/s41467-019-11736-2  0.481
2019 Nigam S, Pojoga S, Dragoi V. Synergistic Coding of Visual Information in Columnar Networks. Neuron. PMID 31399280 DOI: 10.1016/j.neuron.2019.07.006  0.483
2019 Shahidi N, Andrei AR, Hu M, Dragoi V. High-order coordination of cortical spiking activity modulates perceptual accuracy. Nature Neuroscience. PMID 31110324 DOI: 10.1038/s41593-019-0406-3  0.653
2017 Gutnisky DA, Beaman C, Lew SE, Dragoi V. Cortical response states for enhanced sensory discrimination. Elife. 6. PMID 29274146 DOI: 10.7554/Elife.29226  0.8
2017 Beaman CB, Eagleman SL, Dragoi V. Sensory coding accuracy and perceptual performance are improved during the desynchronized cortical state. Nature Communications. 8: 1308. PMID 29101393 DOI: 10.1038/s41467-017-01030-4  0.708
2017 Fernandez-Leon JA, Hansen BJ, Dragoi V. Representation of Rapid Image Sequences in V4 Networks. Cerebral Cortex (New York, N.Y. : 1991). 1-10. PMID 28637171 DOI: 10.1093/cercor/bhx146  0.783
2017 Slater JD, Chelaru MI, Hansen BJ, Beaman C, Kalamangalam G, Tandon N, Dragoi V. Focal Changes to Human Electrocorticography With Drowsiness: A Novel Measure of Local Sleep. The Journal of Neuropsychiatry and Clinical Neurosciences. appineuropsych160601. PMID 28121257 DOI: 10.1176/Appi.Neuropsych.16060120  0.729
2017 Gutnisky DA, Beaman C, Lew SE, Dragoi V. Author response: Cortical response states for enhanced sensory discrimination Elife. DOI: 10.7554/Elife.29226.021  0.771
2017 Newton AJH, Seidenstein AH, McDougal RA, Pérez-Cervera A, Huguet G, M-Seara T, Haimerl C, Angulo-Garcia D, Torcini A, Cossart R, Malvache A, Skiker K, Maouene M, Ragognetti G, Lorusso L, ... ... Dragoi V, et al. 26th Annual Computational Neuroscience Meeting (CNS*2017): Part 3 Bmc Neuroscience. 18. DOI: 10.1186/S12868-017-0372-1  0.574
2016 Chelaru ML, Hansen BJ, Tandon N, Conner CR, Szukalski S, Slater JD, Kalamangalam G, Dragoi V. Reactivation of visual-evoked activity in human cortical networks. Journal of Neurophysiology. jn.00724.2015. PMID 26984423 DOI: 10.1152/Jn.00724.2015  0.694
2016 Gutnisky DA, Beaman CB, Lew SE, Dragoi V. Spontaneous Fluctuations in Visual Cortical Responses Influence Population Coding Accuracy. Cerebral Cortex (New York, N.Y. : 1991). PMID 26744543 DOI: 10.1093/cercor/bhv312  0.813
2015 Wang Y, Dragoi V. Rapid learning in visual cortical networks. Elife. 4. PMID 26308578 DOI: 10.7554/eLife.08417  0.43
2015 Fernandez-Leon JA, Parajuli A, Franklin R, Sorenson M, Felleman DJ, Hansen BJ, Hu M, Dragoi V. A wireless transmission neural interface system for unconstrained non-human primates. Journal of Neural Engineering. 12: 056005. PMID 26269496 DOI: 10.1088/1741-2560/12/5/056005  0.731
2015 Wang Y, Dragoi V. Author response: Rapid learning in visual cortical networks Elife. DOI: 10.7554/Elife.08417.012  0.42
2015 Hansen BJ, Dragoi V. Adaptive coding in visual cortical circuits Recent Advances On Themodular Organization of the Cortex. 297-312. DOI: 10.1007/978-94-017-9900-3_16  0.639
2014 Chelaru MI, Dragoi V. Negative Correlations in Visual Cortical Networks. Cerebral Cortex (New York, N.Y. : 1991). PMID 25217468 DOI: 10.1093/cercor/bhu207  0.417
2012 Hansen BJ, Chelaru MI, Dragoi V. Correlated variability in laminar cortical circuits. Neuron. 76: 590-602. PMID 23141070 DOI: 10.1016/j.neuron.2012.08.029  0.681
2012 Eagleman SL, Dragoi V. Image sequence reactivation in awake V4 networks. Proceedings of the National Academy of Sciences of the United States of America. 109: 19450-5. PMID 23129638 DOI: 10.1073/pnas.1212059109  0.499
2012 Onken A, Dragoi V, Obermayer K. A maximum entropy test for evaluating higher-order correlations in spike counts. Plos Computational Biology. 8: e1002539. PMID 22685392 DOI: 10.1371/Journal.Pcbi.1002539  0.308
2011 Hansen BJ, Eagleman S, Dragoi V. Examining local network processing using multi-contact laminar electrode recording. Journal of Visualized Experiments : Jove. PMID 21931290 DOI: 10.3791/2806  0.671
2011 Wang Y, Iliescu BF, Ma J, Josić K, Dragoi V. Adaptive changes in neuronal synchronization in macaque V4. The Journal of Neuroscience : the Official Journal of the Society For Neuroscience. 31: 13204-13. PMID 21917803 DOI: 10.1523/JNEUROSCI.6227-10.2011  0.501
2011 Hansen BJ, Dragoi V. Adaptation-induced synchronization in laminar cortical circuits. Proceedings of the National Academy of Sciences of the United States of America. 108: 10720-5. PMID 21659632 DOI: 10.1073/pnas.1102017108  0.72
2011 Hansen BJ, Gutnisky D, Dragoi V. Adaptive population coding in visual cortical networks 2011 E-Health and Bioengineering Conference, Ehb 2011.  0.788
2009 Gutnisky DA, Hansen BJ, Iliescu BF, Dragoi V. Attention alters visual plasticity during exposure-based learning. Current Biology : Cb. 19: 555-60. PMID 19268592 DOI: 10.1016/j.cub.2009.01.063  0.776
2008 Chelaru MI, Dragoi V. Efficient coding in heterogeneous neuronal populations. Proceedings of the National Academy of Sciences of the United States of America. 105: 16344-9. PMID 18854413 DOI: 10.1073/pnas.0807744105  0.465
2008 Gutnisky DA, Dragoi V. Adaptive coding of visual information in neural populations. Nature. 452: 220-4. PMID 18337822 DOI: 10.1038/nature06563  0.781
2008 Chelaru MI, Dragoi V. Asymmetric synaptic depression in cortical networks. Cerebral Cortex (New York, N.Y. : 1991). 18: 771-88. PMID 17693394 DOI: 10.1093/cercor/bhm119  0.374
2006 Dragoi V, Sur M. Image structure at the center of gaze during free viewing. Journal of Cognitive Neuroscience. 18: 737-48. PMID 16768374 DOI: 10.1162/jocn.2006.18.5.737  0.645
2005 Jin DZ, Dragoi V, Sur M, Seung HS. Tilt aftereffect and adaptation-induced changes in orientation tuning in visual cortex. Journal of Neurophysiology. 94: 4038-50. PMID 16135549 DOI: 10.1152/jn.00571.2004  0.721
2003 Sharma J, Dragoi V, Tenenbaum JB, Miller EK, Sur M. V1 neurons signal acquisition of an internal representation of stimulus location. Science (New York, N.Y.). 300: 1758-63. PMID 12805552 DOI: 10.1126/science.1081721  0.725
2003 Dragoi V, Staddon JE, Palmer RG, Buhusi CV. Interval timing as an emergent learning property. Psychological Review. 110: 126-44. PMID 12529059 DOI: 10.1037/0033-295X.110.1.126  0.604
2003 Dragoi V, Sharma J, Sur M. Response plasticity in primary visual cortex and its role in vision and visuomotor behavior: Bottom-up and top-down influences Iete Journal of Research. 49: 77-85. DOI: 10.1080/03772063.2003.11416327  0.717
2002 Dragoi V, Sharma J, Miller EK, Sur M. Dynamics of neuronal sensitivity in visual cortex and local feature discrimination. Nature Neuroscience. 5: 883-91. PMID 12161755 DOI: 10.1038/nn900  0.706
2002 Dragoi V. A feedforward model of suppressive and facilitatory habituation effects. Biological Cybernetics. 86: 419-26. PMID 12111271 DOI: 10.1007/s00422-001-0306-x  0.378
2002 Sur M, Schummers J, Dragoi V. Cortical plasticity: time for a change. Current Biology : Cb. 12: R168-70. PMID 11882305 DOI: 10.1016/S0960-9822(02)00733-9  0.611
2002 Sharma J, Dragoi V, Miller EK, Sur M. Modulation of responses in mokey V1 by an eye position task Journal of Vision. 2: 161a. DOI: 10.1167/2.7.161  0.605
2002 Dragoi V, Sharma J, Miller EK, Sur M. Dynamics of neuronal sensitivity in primate VI underlying local feature discrimination Journal of Vision. 2: 126a. DOI: 10.1167/2.7.126  0.613
2001 Dragoi V, Turcu CM, Sur M. Stability of cortical responses and the statistics of natural scenes. Neuron. 32: 1181-92. PMID 11754846 DOI: 10.1016/S0896-6273(01)00540-2  0.711
2001 Dragoi V, Rivadulla C, Sur M. Foci of orientation plasticity in visual cortex. Nature. 411: 80-6. PMID 11333981 DOI: 10.1038/35075070  0.695
2000 Dragoi V, Sharma J, Sur M. Adaptation-induced plasticity of orientation tuning in adult visual cortex. Neuron. 28: 287-98. PMID 11087001 DOI: 10.1016/S0896-6273(00)00103-3  0.715
2000 Dragoi V, Sur M. Dynamic properties of recurrent inhibition in primary visual cortex: contrast and orientation dependence of contextual effects. Journal of Neurophysiology. 83: 1019-30. PMID 10669513 DOI: 10.1152/Jn.2000.83.2.1019  0.715
1999 Dragoi V, Lockhead G. Context-dependent changes in visual sensitivity induced by Müller-Lyer stimuli. Vision Research. 39: 1657-70. PMID 10343858 DOI: 10.1016/S0042-6989(98)00198-9  0.318
1999 Dragoi V, Staddon JE. The dynamics of operant conditioning. Psychological Review. 106: 20-61. PMID 10197362 DOI: 10.1037/0033-295X.106.1.20  0.595
1997 Dragoi V. A Dynamic Theory of Acquisition and Extinction in Operant Learning. Neural Networks : the Official Journal of the International Neural Network Society. 10: 201-229. PMID 12662521 DOI: 10.1016/S0893-6080(96)00067-6  0.315
1997 Dragoi V, Somers DC. Mary visual cortex Investigative Ophthalmology and Visual Science. 38: S380.  0.62
Low-probability matches (unlikely to be authored by this person)
2024 Franch M, Yellapantula S, Parajuli A, Kharas N, Wright A, Aazhang B, Dragoi V. Visuo-frontal interactions during social learning in freely moving macaques. Nature. 627: 174-181. PMID 38355804 DOI: 10.1038/s41586-024-07084-x  0.286
1998 Dragoi V, Grosu I. Synchronization of Locally Coupled Neural Oscillators Neural Processing Letters. 7: 199-210. DOI: 10.1023/A:1009618318908  0.276
2024 Shahidi N, Franch M, Parajuli A, Schrater P, Wright A, Pitkow X, Dragoi V. Population coding of strategic variables during foraging in freely moving macaques. Nature Neuroscience. PMID 38443701 DOI: 10.1038/s41593-024-01575-w  0.243
2016 Sharpee TO, Destexhe A, Kawato M, Sekulić V, Skinner FK, Wójcik DK, Chintaluri C, Cserpán D, Somogyvári Z, Kim JK, Kilpatrick ZP, Bennett MR, Josić K, Elices I, Arroyo D, ... ... Dragoi V, et al. 25th Annual Computational Neuroscience Meeting: CNS-2016 Bmc Neuroscience. 17: 54. PMID 27534393 DOI: 10.1186/S12868-016-0283-6  0.205
2020 Young J, Dragoi V, Aazhang B. Precise measurement of correlations between frequency coupling and visual task performance. Scientific Reports. 10: 17372. PMID 33060626 DOI: 10.1038/s41598-020-74057-1  0.147
2016 Bardet M, Chaulet J, Dragoi V, Otmani A, Tillich JP. Cryptanalysis of the McEliece public key cryptosystem based on polar codes Lecture Notes in Computer Science (Including Subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics). 9606: 118-143. DOI: 10.1007/978-3-319-29360-8_9  0.114
2013 Dragoi V, Cayrel PL, Colombier B, Richmond T. Polynomial structures in code-based cryptography Lecture Notes in Computer Science (Including Subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics). 8250: 286-296. DOI: 10.1007/978-3-319-03515-4-19  0.102
1997 Lockhead G, Dragoi V, Wolbarsht ML. The micfogenesis of geometrical illusions: contextdependent changes in visiual sensitivity and the muller-lyer effect Investigative Ophthalmology and Visual Science. 38: S643.  0.091
2024 Franch M, Yellapantula S, Parajuli A, Kharas N, Wright A, Aazhang B, Dragoi V. Publisher Correction: Visuo-frontal interactions during social learning in freely moving macaques. Nature. PMID 38519583 DOI: 10.1038/s41586-024-07301-7  0.081
2002 Cengher D, Hatzopoulos Z, Gallis S, Deligeorgis G, Aperathitis E, Alexe M, Dragoi V, Kyriakis-Bitzaros ED, Halkias G, Georgakilas A. Fabrication of GaAs laser diodes on Si using low temperature bonding of MBE grown GaAs wafers with Si wafers Mbe 2002 - 2002 12th International Conference On Molecular Beam Epitaxy. 81-82. DOI: 10.1109/MBE.2002.1037769  0.066
2016 Bardet M, Dragoi V, Luque JG, Otmani A. Weak keys for the quasi-cyclic MDPC public key encryption scheme Lecture Notes in Computer Science (Including Subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics). 9646: 346-367. DOI: 10.1007/978-3-319-31517-1_18  0.06
2010 Kim B, Matthias T, Kreindl G, Dragoi V, Wimplinger M, Lindner P. Advances in wafer level processing and integration for CIS module manufacturing 43rd International Symposium On Microelectronics 2010, Imaps 2010. 378-384.  0.054
2007 Dragoi V, Mittendorfer G, Thanner C, Lindner P, Alexe M, Pintilie L, Hamacher M, Heidrich H. III/V wafer bonding technology for wafer-level fabrication of GaInAsP/InP microring resonators Proceedings of the International Semiconductor Conference, Cas. 1: 129-132. DOI: 10.1109/SMICND.2006.283949  0.053
1999 Dragoi V, Alexe M, Reiche M, Goesele U. Low temperature direct wafer bonding of silicon using a glass intermediate layer Proceedings of the International Semiconductor Conference, Cas. 2: 443-446.  0.051
2016 Eibelhuber M, Razek N, Dragoi V, Flotgen C, Wimplinger M, Uhrmann T. Heterogeneous integration through direct wafer bonding Proceedings of the Electronic Packaging Technology Conference, Eptc. 2016. DOI: 10.1109/EPTC.2015.7412399  0.049
2002 Georgakilas A, Deligeorgis G, Aperathitis E, Cengher D, Hatzopoulos Z, Alexe M, Dragoi V, Gösele U, Kyriakis-Bitzaros ED, Minoglou K, Halkias G. Wafer-scale integration of GaAs optoelectronic devices with standard Si integrated circuits using a low-temperature bonding procedure Applied Physics Letters. 81: 5099-5101. DOI: 10.1063/1.1531221  0.044
1997 Pintilie I, Pintilie L, Dragoi V, Petre D, Botila T. Indirect enhancement of Pbs photoconductivity by ferroelectric field effect in a PbS/PbTiO3/Si heterostructure Applied Physics Letters. 71: 1104-1106.  0.043
2012 Plach T, Hingerl K, Dragoi V, Wimplinger M. Low temperature plasma activated direct wafer bonding Proceedings of 2012 3rd Ieee International Workshop On Low Temperature Bonding For 3d Integration, Ltb-3d 2012. 145. DOI: 10.1109/LTB-3D.2012.6238072  0.043
2012 Dussault D, Fournel F, Dragoi V. High efficiency single wafer cleaning for wafer bonding-based 3D integration applications Solid State Phenomena. 187: 269-272. DOI: 10.4028/www.scientific.net/SSP.187.269  0.042
2012 Dussault D, Fournel F, Dragoi V. Advanced process control in megasonic-enhanced pre-bonding cleaning Ecs Transactions. 50: 41-47. DOI: 10.1149/05007.0041ecst  0.041
2010 Pabo EF, Matthias T, Lindner P, Dragoi V, Kettner P. Processes for the integration of MEMS and CMOS 2010 12th Electronics Packaging Technology Conference, Eptc 2010. 576-579. DOI: 10.1109/EPTC.2010.5702704  0.041
2010 Dragoi V, Pabo E. Wafer bonding process selection Ecs Transactions. 33: 509-517. DOI: 10.1149/1.3483542  0.04
2003 Cengher D, Hatzopoulos Z, Gallis S, Deligeorgis G, Aperathitis E, Androulidaki M, Alexe M, Dragoi V, Kyriakis-Bitzaros ED, Halkias G, Georgakilas A. Fabrication of GaAs laser diodes on Si using low-temperature bonding of MBE-grown GaAs wafers with Si wafers Journal of Crystal Growth. 251: 754-759. DOI: 10.1016/S0022-0248(02)02218-2  0.039
2015 Dragoi V, Burggraf J, Kurz F, Rebhan B. 3D integration by wafer-level aligned wafer bonding Proceedings of the International Semiconductor Conference, Cas. 2015: 185-188. DOI: 10.1109/SMICND.2015.7355203  0.038
2012 Plach T, Hingerl K, Stifter D, Dragoi V, Wimplinger M. Investigations on bond strength development of plasma activated direct wafer bonding with annealing Ecs Transactions. 50: 277-285. DOI: 10.1149/05007.0277ecst  0.038
2012 Lindner P, Glinsner T, Uhrmann T, Dragoi V, Plach T, Matthias T, Pabo E, Wimplinger M. Key enabling processes for more-than-moore technologies Proceedings - Ieee International Soi Conference. DOI: 10.1109/SOI.2012.6404360  0.038
2013 Uhrmann T, Matthias T, Glinsner T, Dragoi V, Plach T, Pabo E, Wimplinger M, Lindner P. Heterogeneous integration schemes of compound semiconductors for advanced CMOS and more-than-moore applications 2013 International Conference On Compound Semiconductor Manufacturing Technology, Cs Mantech 2013. 403-406.  0.037
2006 Dragoi V, Lindner P. Plasma activated wafer bonding of silicon: In situ and ex situ processes Ecs Transactions. 3: 147-154. DOI: 10.1149/1.2357064  0.037
2014 Dussault D, Dragoi V. Unique applications of megasonic energy to MEMS single substrate wet processes Ecs Transactions. 64: 213-220. DOI: 10.1149/06401.0213ecst  0.037
2014 Burggraf J, Bravin J, Wiesbauer H, Dragoi V. Monolithic thin wafer stacking using low temperture direct bonding Ecs Transactions. 64: 95-101. DOI: 10.1149/06405.0095ecst  0.037
2011 Dussault D, Dragoi V. Megasonic -Enhanced development for photolithography yield improvement Proceedings of the International Semiconductor Conference, Cas. 1: 145-148. DOI: 10.1109/SMICND.2011.6095740  0.036
2013 Plach T, Hingerl K, Tollabimazraehno S, Hesser G, Dragoi V, Wimplinger M. Mechanisms for room temperature direct wafer bonding Journal of Applied Physics. 113. DOI: 10.1063/1.4794319  0.036
2005 Dragoi V, Farrens S, Lindner P. Low temperature MEMS manufacturing processes: Plasma activated wafer bonding Materials Research Society Symposium Proceedings. 872: 85-90.  0.035
2010 Dragoi V, Bartel J, Dussault D. Novel photolithography yield-enhancement technique: Megasonic-enhanced development Ecs Transactions. 33: 175-183. DOI: 10.1149/1.3484121  0.035
2002 Deligeorgis G, Gallis S, Androulidaki M, Cengher D, Hatzopoulos Z, Alexe M, Dragoi V, Kyriakis-Bitzaros ED, Halkias G, Peiro F, Georgakilas A. Properties of GaAs/Si heterostructure material fabricated by low temperature wafer bonding using a spin-on-glass intermediate layer Ieee Semiconducting and Semi-Insulating Materials Conference, Simc. 125-128.  0.035
2003 Dragoi V, Lindner P, Glinsner T, Wimplinger M, Farrens S. Advanced anodic bonding processes for MEMS applications Materials Research Society Symposium - Proceedings. 782: 337-342.  0.034
2006 Matthias T, Mittendorfer G, Thanner C, Lindner P, Glinsner T, Dragoi V. Adhesive wafer bonding with SU-8 intermediate layers for micro-fluidic applications Ecs Transactions. 3: 369-375. DOI: 10.1149/1.2357088  0.034
2009 Sridharan S, Henry J, Maloney J, Gardner B, Mason K, Dragoi V, Burggraf J, Pabo E, Cakmak E. Effect of process variables on glass frit wafer bonding in MEMS wafer level packaging Materials Research Society Symposium Proceedings. 1139: 133-139.  0.034
2006 Dragoi V, Matthias T, Mittendorfer G, Lindner P. Plasma activated wafer bonding as an alternative to standard wafer bonding processes Ecs Transactions. 3: 189. DOI: 10.1149/1.2357069  0.034
2005 Mizuno J, Farrens S, Ishida H, Dragoi V, Shinohara H, Suzuki T, Ishizuka M, Glinsner T, Shoji S. Cyclo-olefin polymer direct bonding using low temperature plasma activation bonding Proceedings - 2005 International Conference On Mems, Nano and Smart Systems, Icmens 2005. 346-349. DOI: 10.1109/ICMENS.2005.37  0.032
2008 Hamacher M, Heidrich H, Troppenz U, Syvridis D, Alexandropoulos D, Mikroulis S, Kapsalis A, Tee CW, Williams K, Dragoi V, Alexe M, Cristea D, Kusko M. Waferbonded active/passive vertically coupled microring lasers Proceedings of Spie - the International Society For Optical Engineering. 6896. DOI: 10.1117/12.762507  0.032
2012 Pabo E, Dragoi V, Tang T, Matthias T. Reduced temperature metal based bonding processes for wafer level packaging and 3D integration Imaps International Conference and Exhibition On Device Packaging, Dpc 2012 - in Conjunction With the Global Business Council, Gbc 2012 Spring Conference. 403-405+2509-2542.  0.031
2011 Matthias T, Kreindl G, Dragoi V, Wimplinger M, Lindner P. CMOS image sensor wafer-level packaging Icept-Hdp 2011 Proceedings - 2011 International Conference On Electronic Packaging Technology and High Density Packaging. 1-6. DOI: 10.1109/ICEPT.2011.6067039  0.03
2010 Foumel F, Bally L, Dussault D, Dragoi V. Innovative megasonic cleaning technology evaluated through direct wafer bonding Ecs Transactions. 33: 495-500. DOI: 10.1149/1.3483540  0.03
2005 Pelzer R, Dragoi V, Swinnen B, Soussan P, Matthias T. Wafer-scale BCB resist-processing technologies for high density integration and electronic packaging Proceedings - Emap 2005: 2005 International Symposium On Electronics Materials and Packaging. 2005: 187-191. DOI: 10.1109/EMAP.2005.1598259  0.03
2009 Dragoi V, Cakmak E, Pabo E. Wafer bonding with metal layers for MEMS applications Proceedings of the International Semiconductor Conference, Cas. 1: 215-218. DOI: 10.1109/SMICND.2009.5336567  0.029
2012 Flötgen C, Corn K, Pawlak M, Van De Wiel H, Hayes GR, Dragoi V. Cu-Sn transient liquid phase wafer bonding: Process parameters influence on bonded interface quality Ecs Transactions. 50: 177-188. DOI: 10.1149/05007.0177ecst  0.029
2014 Flötgen C, Pawlak M, Pabo E, Van De Wiel HJ, Hayes GR, Dragoi V. Wafer bonding using Cu-Sn intermetallic bonding layers Microsystem Technologies. 20: 653-662. DOI: 10.1007/s00542-013-2002-x  0.029
2008 Plach T, Dragoi V, Murauer F, Hingerl K. Plasma activation for low temperature Wafer bonding Ecs Transactions. 16: 549-559. DOI: 10.1149/1.2982910  0.029
2010 Dragoi V, Filbert A, Zhu S, Mittendorfer G. CMOS wafer bonding for back-side illuminated image sensors fabrication Proceedings - 2010 11th International Conference On Electronic Packaging Technology and High Density Packaging, Icept-Hdp 2010. 27-30. DOI: 10.1109/ICEPT.2010.5582379  0.028
2010 Dragoi V, Mittendorfer G, Filbert A, Wimplinger M. Wafer bonding for backside illuminated CMOS image sensors fabrication Materials Research Society Symposium Proceedings. 1249: 265-270.  0.028
2014 Dussault D, Liebscher E, Fournel F, Payen N, Dragoi V. Pre-bond megasonic cleaning with improved process control Microsystem Technologies. 20: 545-550. DOI: 10.1007/s00542-013-1976-8  0.028
2012 Matthias T, Uhrmann T, Dragoi V, Wagenleitner T, Lindner P. Wafer bonding for backside illuminated image sensors Ecs Transactions. 44: 1269-1274. DOI: 10.1149/1.3694458  0.027
2008 Dragoi V, Mittendorfer G, Thanner C, Lindner P. Wafer-level plasma activated bonding: New technology for MEMS fabrication Microsystem Technologies. 14: 509-515. DOI: 10.1007/s00542-007-0437-7  0.026
2014 Uhrmann T, Burggraf J, Bravin J, Dragoi V, Wimplinger M, Matthias T, Lindner P. Versatile thin wafer stacking technology for monolithic integration of temporary bonded thin wafers Proceedings - Electronic Components and Technology Conference. 888-893. DOI: 10.1109/ECTC.2014.6897392  0.026
2009 Dragoi V, Cakmak E, Capsuto E, McEwen C, Pabo E. Adhesive wafer bonding using photosensitive polymer layers Proceedings of Spie - the International Society For Optical Engineering. 7362. DOI: 10.1117/12.821725  0.025
1997 Ciurea ML, Lazar M, Lazanu S, Pentia E, Dragoi V. Electrical properties of porous silicon stabilized by storage in ambient Proceedings of the International Semiconductor Conference, Cas. 1: 177-180.  0.025
2004 Lindner P, Farrens S, Dragoi V. Plasma activated wafer bonding for tHlN silicon-on-insulator substrate fabrication Proceedings - Electrochemical Society. 4: 97-102.  0.025
2005 Dragoi V, Farrens S, Lindner P. Plasma activated wafer bonding for MEMS Proceedings of Spie - the International Society For Optical Engineering. 5836: 179-187. DOI: 10.1117/12.608788  0.025
2000 Alexe M, Dragoi V, Reiche M, Gösele U. Low temperature GaAs/Si direct wafer bonding Electronics Letters. 36: 677-678. DOI: 10.1049/el:20000507  0.024
2008 Plach T, Dragoi V, Mittendorfer G, Wimplinger M, Hingerl K. Wafer bonding of plasma activated surfaces Ecs Transactions. 13: 39-45. DOI: 10.1149/1.3007997  0.024
2006 Dragoi V. From magic to technology: Materials integration by wafer bonding Proceedings of Spie - the International Society For Optical Engineering. 6123. DOI: 10.1117/12.646450  0.024
2004 Pelzer R, Dragoi V, Kettner P, Lee D. Advanced low temperature bonding technologies Proceedings Icse 2004 - 2004 Ieee International Conference On Semiconductor Electronics. 34-38.  0.022
2015 Rebhan B, Tollabimazraehno S, Hesser G, Dragoi V. Analytical methods used for low temperature Cu–Cu wafer bonding process evaluation Microsystem Technologies. DOI: 10.1007/s00542-015-2446-2  0.022
2010 Pabo E, Lindner P, Oakes G, Miller R, Kreindl G, Matthias T, Dragoi V, Wimplinger M. IMAPS 3D packaging EXTENDED ABSTRACT enabling wafer level processes for CIS manufacturing International Conference and Exhibition On Device Packaging 2010, Held in Conjunction With the Global Business Council, Gbc 2010 Spring Conference. 3: 2394-2420.  0.021
2003 Dragoi V, Glinsner T, Hangweier P, Lindner P. Triple-stack anodic bonding for mems applications Proceedings - Electrochemical Society. 19: 329-336.  0.021
2012 Dragoi V, Kurz F, Wagenleitner T, Flotgen C, Mittendorfer G. Wafer bonding for CMOS integration and packaging Icept-Hdp 2012 Proceedings - 2012 13th International Conference On Electronic Packaging Technology and High Density Packaging. 166-170. DOI: 10.1109/ICEPT-HDP.2012.6474592  0.021
2015 Uhrmann T, Kurz F, Plach T, Wagenleitner T, Dragoi V, Wimplinger M, Lindner P. Influencing factors in high precision fusion wafer bonding for monolithic integration Proceedings - Electronic Components and Technology Conference. 2015: 906-909. DOI: 10.1109/ECTC.2015.7159701  0.021
2008 Dragoi V, Matthias T, Mittendorfer G, Lindner P. Aligned low temperature wafer bonding for MEMS manufacturing: Challenges and promises Materials Research Society Symposium Proceedings. 1052: 111-116.  0.021
2001 Dragoi V, Alexe M, Reiche M, Radu I, Thallner E, Schaefer C, Lindner P. Si/GaAs heterostructures fabricated by direct wafer bonding Materials Research Society Symposium Proceedings. 681: 73-78.  0.021
2014 Rebhan B, Plach T, Tollabimazraehno S, Dragoi V, Kawano M. Cu-Cu wafer bonding: An enabling technology for three-dimensional integration 2014 International Conference On Electronics Packaging, Icep 2014. 475-479. DOI: 10.1109/ICEP.2014.6826724  0.021
2006 Farrens S, Weixlberger J, Lindner P, Dragoi V, Mittendorfer G. Limited by technology? Try low temperature wafer bonding Proceedings of the 6th International Conference European Society For Precision Engineering and Nanotechnology, Euspen 2006. 2: 284-287.  0.02
2005 Pelzer R, Dragoi V, Lee D, Kettner P. Temperature reduced direct bonding by plasma assisted wafer surface pre-treatment Proceedings of 7th Electronics Packaging Technology Conference, Eptc 2005. 1: 221-224.  0.02
2002 Dragoi V, Lindner P, Tischler M, Schaefer C. New challenges for 300 mm Si technology: 3D interconnects at wafer scale by aligned wafer bonding Materials Science in Semiconductor Processing. 5: 425-428. DOI: 10.1016/S1369-8001(02)00133-6  0.02
2011 Dragoi VA, Dobre C. A model for traffic control in urban environments Iwcmc 2011 - 7th International Wireless Communications and Mobile Computing Conference. 2139-2144. DOI: 10.1109/IWCMC.2011.5982865  0.02
2004 Pelzer R, Teomim D, Perlberg G, Dragoi V. Technologies for microdevice packaging: Packaging requirements for MEMS and MOEMS Advanced Packaging. 13: 31-38.  0.02
2007 Dragoi V, Mittendorfer G, Thanner C, Lindner P. Plasma activated wafer bonding: The new low temperature tool for MEMS fabrication Proceedings of Spie - the International Society For Optical Engineering. 6589. DOI: 10.1117/12.721937  0.02
2008 Dragoi V, Pabo E, Matthias T, Cakmak E, Capsuto E, McEwen C. Polymer-based wafer bonding technology for MEMS applications International Conference and Exhibition On Device Packaging 2009. 3: 1518-1539.  0.02
2014 Dragoi V, Rebhan B, Burggraf J, Razek N. Low temperature wafer bonding for wafer-level 3D integration Proceedings of 2014 4th Ieee International Workshop On Low Temperature Bonding For 3d Integration, Ltb-3d 2014. 9. DOI: 10.1109/LTB-3D.2014.6886148  0.02
2013 Dussault D, Liebscher E, Fournel F, Dragoi V. Control of cavitation density through gas and acoustic uniformity in a proximity megasonic pre-bond cleaning system Proceedings of Spie - the International Society For Optical Engineering. 8763. DOI: 10.1117/12.2018006  0.02
2015 Dragoi V, Pabo E. Wafer bonding technology for new generation vacuum MEMS: Challenges and promises Proceedings of Spie - the International Society For Optical Engineering. 9517. DOI: 10.1117/12.2178920  0.02
2012 Dragoi V, Pabo E, Burggraf J, Mittendorfer G. CMOS: Compatible wafer bonding for MEMS and wafer-level 3D integration Microsystem Technologies. 18: 1065-1075. DOI: 10.1007/s00542-012-1439-7  0.02
2004 Dragoi V, Schaefer C, Lindner P, Wimplinger M, Farrens S. Temporary bonding technology improves thin wafer handling Solid State Technology. 47: 61-62.  0.019
2012 Dragoi V, Czurratis P, Brand S, Beyersdorfer J, Patzig C, Krugers JP, Schrank F, Siegert J, Petzold M. Low temperature fusion wafer bonding quality investigation for failure mode analysis Ecs Transactions. 50: 227-239. DOI: 10.1149/05007.0227ecst  0.019
2011 Dragoi V, Pabo E, Burggraf J, Mittendorfer G. Wafer bonding for MEMS and CMOS integration Proceedings of Spie - the International Society For Optical Engineering. 8066. DOI: 10.1117/12.886699  0.019
1984 Petrescu R, Sternberg I, Drâgoi V, Ion-Nedelcu N. Aspects of the dysentery evolution in the territory surveilled by the Sanitary-Antiepidemic Center of B Municipality--Laboratory No 2 (Administrative District 2 and 3) after the introduction of the dysentery vaccination. Archives Roumaines De Pathologie Expã©Rimentales Et De Microbiologie. 43: 341-9. PMID 6400309  0.017
2005 Matthias T, Dragoi V, Farrens S, Lindner P. Aligned fusion wafer bonding for wafer-level packaging and 3D integration Proceedings - 2005 International Symposium On Microelectronics, Imaps 2005. 715-725.  0.017
2014 Flötgen C, Razek N, Dragoi V, Wimplinger M. Novel surface preparation methods for covalent and conductive bonded interfaces fabrication Ecs Transactions. 64: 103-110. DOI: 10.1149/06405.0103ecst  0.017
2004 Dragoi V, Farrens S, Lindner P, Weixlberger J. Low temperature wafer bonding for microsystems applications Proceedings of the International Semiconductor Conference, Cas. 1: 199-202.  0.016
2002 Lindner P, Dragoi V, Glinsner T, Schaefer C, Islam R. 3D Interconnect through aligned wafer level bonding Proceedings - Electronic Components and Technology Conference. 1439-1443. DOI: 10.1109/ECTC.2002.1008295  0.016
2013 Flötgen C, Pawlak M, Pabo E, Van De Wiel HJ, Hayes GR, Dragoi V. Cu-Sn transient liquid phase wafer bonding for MEMS applications Proceedings of Spie - the International Society For Optical Engineering. 8763. DOI: 10.1117/12.2017350  0.016
2010 Cakmak E, Dragoi V, Pabo E, Matthias T, Alford T. Aluminum thermo-compression bonding characterization Materials Research Society Symposium Proceedings. 1222: 167-172.  0.015
2012 Uhrmann T, Dragoi V, Pabo EF, Matthias T, Lindner P. Wafer bonding technology for HB-LED manufacturing 2012 International Conference On Compound Semiconductor Manufacturing Technology, Cs Mantech 2012.  0.015
2005 Farrens S, Dragoi V, Pelzer R, Wimplinger M, Lindner P. Plasma bonding replacement methods for traditional bond technologies Proceedings - Electrochemical Society. 58-63.  0.015
2013 Burggraf J, Bravin J, Wiesbauer H, Dragoi V. Low temperature wafer bonding for 3D applications Ecs Transactions. 58: 67-73. DOI: 10.1149/05817.0067ecst  0.015
2012 Rebhan B, Tollabimazraehno S, Plach T, Hesser G, Burggraf J, Mittendorfer G, Dragoi V, Wimplinger M, Hingerl K. Copper-oxide reduction for low-temperature wafer bonding Proceedings of 2012 3rd Ieee International Workshop On Low Temperature Bonding For 3d Integration, Ltb-3d 2012. 53. DOI: 10.1109/LTB-3D.2012.6238047  0.014
2011 Dragoi V, Mittendorfer G, Flotgen C, Dussault D, Wagenleitner T. CMOS-compatible aligned fusion wafer bonding Proceedings of the International Semiconductor Conference, Cas. 1: 141-144. DOI: 10.1109/SMICND.2011.6095739  0.014
2010 Dragoi V, Mittendorfer G, Burggraf J, Wimplinger M. Metal thermocompression wafer bonding for 3D integration and MEMS applications Ecs Transactions. 33: 27-35. DOI: 10.1149/1.3483491  0.014
2006 Farrens S, Lindner P, Dragoi V, Mittendor-fer G. Integrating MEMS devices using low-temperature wafer bonding Solid State Technology. 49: 34-36.  0.013
2012 Dragoi V, Matthias T, Rebhan B, Huysmans F. Low temperature wafer bonding of CMOS wafers Proceedings of the 2012 Ieee 14th Electronics Packaging Technology Conference, Eptc 2012. 197-201. DOI: 10.1109/EPTC.2012.6507077  0.013
1995 Alexe M, Popescu EM, Dragoi V, Tanasoiu C. Electrical properties of sol-gel deposited PbTiO3 films on silicon substrates Proceedings of the International Semiconductor Conference, Cas. 301-304.  0.013
2012 Rebhan B, Hesser G, Duchoslav J, Dragoi V, Wimplinger M, Hingerl K. Low-temperature Cu-Cu wafer bonding Ecs Transactions. 50: 139-149. DOI: 10.1149/05007.0139ecst  0.012
2004 Lindner P, Dragoi V, Farrens S, Glinsner T, Hangweier P. Advanced techniques for 3D devices in wafer-bonding processes Solid State Technology. 47: 55-58.  0.012
2010 Cakmak E, Dragoi V, Kim B. Characterization of wafer level metal thermo-compression bonding International Conference and Exhibition On Device Packaging 2010, Held in Conjunction With the Global Business Council, Gbc 2010 Spring Conference. 3: 2320-2360.  0.012
2007 Hamacher M, Troppenz U, Heidrich H, Dragoi V. Vertically coupled microring laser devices based on InP using BCB waferbonding Conference On Lasers and Electro-Optics Europe - Technical Digest. DOI: 10.1109/CLEOE-IQEC.2007.4385912  0.012
2001 Bagdahn J, Katzer D, Petzold M, Wiemer M, Alexe M, Dragoi V, Goesele U. Transfer and handling of thin semiconductor materials by a combination of wafer bonding and controlled crack propagation Materials Research Society Symposium Proceedings. 681: 183-188.  0.012
2008 Matthias T, Dragoi V, Kim B, Pargfrieder S, Lindner P. New developments in wafer bonding for 3D integration 2008 Proceedings - 25th International Vlsi Multilevel Interconnection Conference, Vmic 2008. 349-354.  0.011
2014 Dragoi V, Pabo E. Wafer bonding for MEMS vacuum packaging Ecs Transactions. 64: 221-229. DOI: 10.1149/06401.0221ecst  0.01
2013 Dragoi V, Pawlak M, Flotgen C, Mittendorfer G, Pabo E. Wafer bonding for vacuum encapsulated MEMS Proceedings of the International Semiconductor Conference, Cas. 1: 17-20. DOI: 10.1109/SMICND.2013.6688075  0.01
2013 Matthias T, Uhrmann T, Dragoi V, Lindner P. Opportunities in 3D substrate bonding 2013 Ieee Soi-3d-Subthreshold Microelectronics Technology Unified Conference, S3s 2013. DOI: 10.1109/S3S.2013.6716528  0.01
2013 Navolan D, Ciohat I, Dragoi V, Constantinescu S, Badiu D, Timar R, Onofriescu M, Denk R, Vladareanu R. Establishment of a Romanian database and biological sample collection for antenatal research Gineco.Eu. 9: 80-82.  0.01
2012 Dussault D, Dragoi V. Acoustic energy: A new tool for MEMS manufacturing Materials Research Society Symposium Proceedings. 1415: 17-22. DOI: 10.1557/opl.2012.49  0.01
2012 Bauer C, Heuser T, Dragoi V, Mittendorfer G. Adhesive wafer bonding applied for fabrication of true-chip-size packages for SAW devices Ecs Transactions. 50: 363-370. DOI: 10.1149/05007.0363ecst  0.01
2012 Dragoi V, Pabo E, Wagenleitner T, Flotgen C, Rebhan B, Corn K. Metal wafer bonding for 3D interconnects and advanced packaging Icept-Hdp 2012 Proceedings - 2012 13th International Conference On Electronic Packaging Technology and High Density Packaging. 114-120. DOI: 10.1109/ICEPT-HDP.2012.6474582  0.01
2012 Dragoi V. Wafer Bonding Using Spin-On Glass as Bonding Material Handbook of Wafer Bonding. 19-32. DOI: 10.1002/9783527644223.ch2  0.01
2011 Kim B, Matthias T, Dragoi V, Wimplinger M, Lindner P. Wafer bonding techniques 3d Integration For Vlsi Systems. 43-70. DOI: 10.4032/9789814303828  0.01
2011 Matthias T, Miller R, Thanner C, Burgstaller D, Kreindl G, Dragoi V, Kettner P, Lindner P. Low temperature packaging of BioMEMS and Lab-on-chip devices 2011 Ieee 13th Electronics Packaging Technology Conference, Eptc 2011. 562-566. DOI: 10.1109/EPTC.2011.6184484  0.01
2011 Matthias T, Pabo E, Dragoi V, Burggraf J, Lindner P. Integration and 3D-ICs driving developments in wafer bonding Solid State Technology. 54: 11-13+23.  0.01
2010 Dragoi V, Lindner P. Wafer-Bonding Equipment Handbook of Silicon Based Mems Materials and Technologies. 555-568. DOI: 10.1016/B978-0-8155-1594-4.00037-1  0.01
2010 Cakmak E, Dragoi V, Capsuto E, McEwen C, Pabo E. Adhesive wafer bonding with photosensitive polymers for MEMS fabrication Microsystem Technologies. 16: 799-808. DOI: 10.1007/s00542-009-0977-0  0.01
2010 Dragoi V, Cakmak E, Pabo E. Metal wafer bonding for mems devices Romanian Journal of Information Science and Technology. 13: 65-72.  0.01
2009 Dragoi V, Mittendorfer G, Murauer F, Cakmak E, Pabo E. Metal wafer bonding for MEMS applications Materials Research Society Symposium Proceedings. 1139: 127-132.  0.01
2008 Dragoi V, Alexe M, Hamacher M, Heidrich H. Microring resonators fabrication by BCB adhesive wafer bonding Ecs Transactions. 16: 105-115. DOI: 10.1149/1.2982859  0.01
2007 Heidrich H, Hamacher M, Troppenz U, Syvridis D, Alexandropoulos D, Mikroulis S, Tee CW, Williams K, Dragoi V, Alexe M, Cristea D, Kusko C, Kusko M. Vertically coupled GalnAsP/lnP microring lasers fabricated by using full wafer bonding 2007 33rd European Conference and Exhibition of Optical Communication, Ecoc 2007.  0.01
2005 Dragoi V, Farrens S, Lindner P. Tried and tested bonding for MEMS European Semiconductor. 27: M16-M18.  0.01
2003 Dragoi V, Glinsner T, Mittendorfer G, Wieder B, Lindner P. Adhesive wafer bonding for MEMS applications Proceedings of Spie - the International Society For Optical Engineering. 5116: 160-167. DOI: 10.1117/12.499077  0.01
2003 Dragoi V, Lindner P, Farrens S, Schaefer C. Bonding 300 mm SOI substrates European Semiconductor. 25: 31-35.  0.01
2001 Reiche M, Dragoi V, Alexe M, Gösele U, Thallner E, Schäfer C, Lindner FP. Heterogeneous substrates for high-temperature and optical applications Proceedings of Spie - the International Society For Optical Engineering. 4407: 395-403. DOI: 10.1117/12.425327  0.01
1998 Dragoi V, Pintilie L, Pintilie I, Petre D, Boerasu I, Alexe M. Electrical and optical characterization of PbTiO3/Si heterostructures for applications in optoelectronics Proceedings of Spie - the International Society For Optical Engineering. 3405: 846-851. DOI: 10.1117/12.312674  0.01
1998 Dragoi V, Alexe M. Cobalt-manganese oxide thin films thermistors obtained by MOD Proceedings of the International Semiconductor Conference, Cas. 1: 297-300.  0.01
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