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Hua Ye, Ph.D. - Publications

Affiliations: 
2004 State University of New York, Buffalo, Buffalo, NY, United States 
Area:
Civil Engineering, Mechanical Engineering, Electronics and Electrical Engineering
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6 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2006 Ye H, Basaran C, Hopkins DC. Experimental damage mechanics of micro/power electronics solder joints under electric current stresses International Journal of Damage Mechanics. 15: 41-67. DOI: 10.1177/1056789506054311  0.526
2004 Basaran C, Lin M, Ye H. A thermodynamic model for electrical current induced damage Proceedings - Electronic Components and Technology Conference. 2: 1738-1745. DOI: 10.1016/J.Ijsolstr.2003.08.018  0.586
2003 Ye H, Basaran C, Hopkins DC. Numerical Simulation of Stress Evolution during Electromigration in IC Interconnect Lines Ieee Transactions On Components and Packaging Technologies. 26: 673-681. DOI: 10.1109/Tcapt.2003.817877  0.508
2003 Ye H, Basaran C, Hopkins D. Thermomigration in Pb-Sn solder joints under joule heating during electric current stressing Applied Physics Letters. 82: 1045-1047. DOI: 10.1063/1.1554775  0.517
2003 Ye H, Hopkins DC, Basaran C. Measurement of high electrical current density effects in solder joints Microelectronics Reliability. 43: 2021-2029. DOI: 10.1016/S0026-2714(03)00131-8  0.494
2001 Ye H, Lin M, Basaran C. Failure modes and FEM analysis of power electronic packaging Advances in Electronic Packaging. 1: 417-428. DOI: 10.1016/S0168-874X(01)00094-4  0.569
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