Minghui Lin, Ph.D. - Publications
Affiliations: | 2006 | State University of New York, Buffalo, Buffalo, NY, United States |
Area:
Civil Engineering, Electronics and Electrical Engineering, Mechanical EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2007 | Basaran C, Lin M. Damage mechanics of electromigration in microelectronics copper interconnects International Journal of Materials and Structural Integrity. 1: 16-39. DOI: 10.1504/Ijmsi.2007.013864 | 0.539 | |||
2007 | Basaran C, Gomez J, Lin M, Li S. Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging Summer Computer Simulation Conference 2007, Scsc'07, Part of the 2007 Summer Simulation Multiconference, Summersim'07. 1: 269-275. DOI: 10.1163/157361106777641387 | 0.578 | |||
2006 | Li S, Abdulhamid MF, Lin M, Basaran C. Thermomigration induced strain field simulation for microelectronic lead free solder joints American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. DOI: 10.1115/Imece2006-13046 | 0.575 | |||
2004 | Basaran C, Lin M, Ye H. A thermodynamic model for electrical current induced damage Proceedings - Electronic Components and Technology Conference. 2: 1738-1745. DOI: 10.1016/J.Ijsolstr.2003.08.018 | 0.562 | |||
2001 | Ye H, Lin M, Basaran C. Failure modes and FEM analysis of power electronic packaging Advances in Electronic Packaging. 1: 417-428. DOI: 10.1016/S0168-874X(01)00094-4 | 0.525 | |||
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