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Shidong Li, Ph.D. - Publications

Affiliations: 
2009 Civil, Structural and Environmental Engineering State University of New York, Buffalo, Buffalo, NY, United States 
Area:
Packaging Engineering, Mechanical Engineering
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8 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2009 Li S, Sellers MS, Basaran C, Schultz AJ, Kofke DA. Lattice strain due to an atomic vacancy. International Journal of Molecular Sciences. 10: 2798-808. PMID 19582230 DOI: 10.3390/Ijms10062798  0.602
2009 Li S, Abdulhamid MF, Basaran C. Damage Mechanics of Low Temperature Electromigration and Thermomigration Ieee Transactions On Advanced Packaging. 32: 478-485. DOI: 10.1109/Tadvp.2008.2005840  0.548
2009 Basaran C, Li S, Hopkins DC, Veychard D. Electromigration time to failure of SnAgCuNi solder joints Journal of Applied Physics. 106. DOI: 10.1063/1.3159012  0.517
2009 Li S, Basaran C. A computational damage mechanics model for thermomigration Mechanics of Materials. 41: 271-278. DOI: 10.1016/J.Mechmat.2008.10.013  0.56
2009 Li S, Basaran C. Effective diffusivity of lead free solder alloys Computational Materials Science. 47: 71-78. DOI: 10.1016/J.Commatsci.2009.06.015  0.515
2008 Abdulhamid MF, Li S, Basaran C. Thermomigration in lead-free solder joints International Journal of Materials and Structural Integrity. 2: 11-34. DOI: 10.1504/Ijmsi.2008.018898  0.535
2008 Basaran C, Li S, Abdulhamid MF. Thermomigration induced degradation in solder alloys Journal of Applied Physics. 103. DOI: 10.1063/1.2943261  0.55
2006 Li S, Abdulhamid MF, Lin M, Basaran C. Thermomigration induced strain field simulation for microelectronic lead free solder joints American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. DOI: 10.1115/Imece2006-13046  0.623
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