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Bahgat Sammakia - Publications

Affiliations: 
Mechanical Engineering State University of New York at Binghamton, Vestal, NY, United States 
Area:
Mechanical Engineering
Website:
https://www.binghamton.edu/mechanical-engineering/people/profile.html?id=bahgat
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73 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Khalili S, Rangarajan S, Gektin V, Alissa H, Sammakia B. An Experimental Investigation on the Fluid Distribution in a Two-Phase Cooled Rack Under Steady and Transient Information Technology Loads Journal of Electronic Packaging. 142. DOI: 10.1115/1.4048180  0.43
2020 Hadad Y, Fallahtafti N, Choobineh L, Hoang CH, Radmard V, Chiarot PR, Sammakia B. Performance Analysis and Shape Optimization of an Impingement Microchannel Cold Plate Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 1304-1319. DOI: 10.1109/Tcpmt.2020.3005824  0.427
2020 Hadad Y, Rangararajan S, Nemati K, Ramakrishnann B, Pejman R, Chiarot PR, Sammakia B. Performance analysis and shape optimization of a water-cooled impingement micro-channel heat sink including manifolds International Journal of Thermal Sciences. 148: 106145. DOI: 10.1016/J.Ijthermalsci.2019.106145  0.489
2019 Ramakrishnan B, Hadad Y, Alkharabsheh S, Chiarot PR, Sammakia B. Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers Journal of Electronic Packaging. 141: 41005. DOI: 10.1115/1.4044130  0.391
2019 Khalili S, Alissa H, Nemati K, Seymour M, Curtis R, Moss D, Sammakia B. Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design Journal of Electronic Packaging. 141: 31004. DOI: 10.1115/1.4042983  0.357
2019 Hadad Y, Ramakrishnan B, Pejman R, Rangarajan S, Chiarot PR, Pattamatta A, Sammakia B. Three-objective shape optimization and parametric study of a micro-channel heat sink with discrete non-uniform heat flux boundary conditions Applied Thermal Engineering. 150: 720-737. DOI: 10.1016/J.Applthermaleng.2018.12.128  0.45
2018 Khalili S, Tradat MI, Nemati K, Seymour M, Sammakia B. Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles Journal of Electronic Packaging. 140: 10907. DOI: 10.1115/1.4039028  0.375
2017 Nemati K, Alissa HA, Murray BT, Schneebeli K, Sammakia B. Experimental Failure Analysis of a Rear Door Heat Exchanger With Localized Containment Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 882-892. DOI: 10.1109/Tcpmt.2017.2682863  0.45
2016 Chen C, Geer J, Sammakia B. A Finite Difference Lattice Boltzmann Method to Simulate Multidimensional Subcontinuum Heat Conduction Journal of Electronic Packaging. 138: 41008. DOI: 10.1115/1.4034856  0.377
2016 Al-Momani ES, Khasawneh MT, Sammakia B. An Approach for Assessing the Long-Term Reliability of Lead-Free Electronics Under In-Field Conditions Ieee Transactions On Device and Materials Reliability. 16: 532-540. DOI: 10.1109/Tdmr.2016.2606884  0.738
2015 Alkharabsheh S, Fernandes J, Gebrehiwot B, Agonafer D, Ghose K, Ortega A, Joshi Y, Sammakia B. A brief overview of recent developments in thermal management in data centers Journal of Electronic Packaging, Transactions of the Asme. 137. DOI: 10.1115/1.4031326  0.329
2015 Gao T, Geer J, Sammakia B. Review and Analysis of Cross Flow Heat Exchanger Transient Modeling for Flow Rate and Temperature Variations Journal of Thermal Science and Engineering Applications. 7: 41017. DOI: 10.1115/1.4031222  0.459
2015 Gao T, Sammakia B, Samadiani E, Schmidt R. Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers Journal of Electronic Packaging. 137: 21007. DOI: 10.1115/1.4029163  0.427
2015 Gao T, Geer J, Sammakia B. Development and verification of compact transient heat exchanger models using transient effectiveness methodologies International Journal of Heat and Mass Transfer. 87: 265-278. DOI: 10.1016/J.Ijheatmasstransfer.2015.03.091  0.465
2015 Gao T, Sammakia B, Geer J. Dynamic response and control analysis of cross flow heat exchangers under variable temperature and flow rate conditions International Journal of Heat and Mass Transfer. 81: 542-553. DOI: 10.1016/J.Ijheatmasstransfer.2014.10.046  0.47
2015 Gao T, David M, Geer J, Schmidt R, Sammakia B. Experimental and numerical dynamic investigation of an energy efficient liquid cooled chiller-less data center test facility Energy and Buildings. 91: 83-96. DOI: 10.1016/J.Enbuild.2015.01.028  0.411
2015 Gao T, Murray B, Sammakia B. Analysis of transient and hysteresis behavior of cross-flow heat exchangers under variable fluid mass flow rate for data center cooling applications Applied Thermal Engineering. 84: 15-26. DOI: 10.1016/J.Applthermaleng.2015.03.044  0.48
2014 Gao T, Sammakia BG, F. Geer J, Ortega A, Schmidt R. Dynamic Analysis of Cross Flow Heat Exchangers in Data Centers Using Transient Effectiveness Method Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1925-1935. DOI: 10.1109/Tcpmt.2014.2369256  0.357
2014 Gao T, Sammakia BG, Murray BT, Ortega A, Schmidt R. Cross Flow Heat Exchanger Modeling of Transient Temperature Input Conditions Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 1796-1807. DOI: 10.1109/Tcpmt.2014.2356202  0.386
2014 Gao T, Geer J, Sammakia B. Nonuniform temperature boundary condition effects on data center cross flow heat exchanger dynamic performance International Journal of Heat and Mass Transfer. 79: 1048-1058. DOI: 10.1016/J.Ijheatmasstransfer.2014.09.011  0.491
2014 Chen C, Geer J, Sammakia B. Sub-continuum thermal transport modeling using diffusion in the Lattice Boltzmann Transport Equation International Journal of Heat and Mass Transfer. 79: 666-675. DOI: 10.1016/J.Ijheatmasstransfer.2014.08.052  0.416
2014 Song Z, Murray BT, Sammakia B. Long-term transient thermal analysis using compact models for data center applications International Journal of Heat and Mass Transfer. 71: 69-78. DOI: 10.1016/J.Ijheatmasstransfer.2013.12.007  0.454
2014 Song Z, Murray BT, Sammakia B. Numerical investigation of inter-zonal boundary conditions for data center thermal analysis International Journal of Heat and Mass Transfer. 68: 649-658. DOI: 10.1016/J.Ijheatmasstransfer.2013.09.073  0.44
2014 Song Z, Murray BT, Sammakia B. A dynamic compact thermal model for data center analysis and control using the zonal method and artificial neural networks Applied Thermal Engineering. 62: 48-57. DOI: 10.1016/J.Applthermaleng.2013.09.006  0.398
2013 Alzoubi K, Choi G, Hamasha MM, Alkhazali AS, Defranco J, Lu S, Sammakia B, Westgate C. Comparisons of the mechanical behaviors of poly(3,4-ethylenedioxythiophene) (PEDOT) and ITO on flexible substrates Materials Research Society Symposium Proceedings. 1493: 127-132. DOI: 10.1557/Opl.2013.228  0.543
2013 Chauhan A, Sammakia B, Afram FF, Ghose K, Refai-Ahmed G, Agonafer D. Solving thermal issues in a three-dimensional-stacked-quad-core processor by microprocessor floor planning, microchannel cooling, and insertion of through-silicon-vias Journal of Electronic Packaging, Transactions of the Asme. 135. DOI: 10.1115/1.4025531  0.548
2013 Song Z, Murray BT, Sammakia B. A Compact Thermal Model for Data Center Analysis using the Zonal Method Numerical Heat Transfer Part a-Applications. 64: 361-377. DOI: 10.1080/10407782.2013.784138  0.412
2013 Song Z, Murray BT, Sammakia B. Airflow and temperature distribution optimization in data centers using artificial neural networks International Journal of Heat and Mass Transfer. 64: 80-90. DOI: 10.1016/J.Ijheatmasstransfer.2013.04.017  0.351
2013 Pisipati S, Chen C, Geer J, Sammakia B, Murray BT. Multiscale thermal device modeling using diffusion in the Boltzmann Transport Equation International Journal of Heat and Mass Transfer. 64: 286-303. DOI: 10.1016/J.Ijheatmasstransfer.2013.04.011  0.742
2012 Zheng LY, Farnam DS, Homentcovschi D, Sammakia BG. A porous elastic model for bacterial biofilms: application to the simulation of deformation of bacterial biofilms under microfluidic jet impingement. Journal of Biomechanical Engineering. 134: 051003. PMID 22757491 DOI: 10.1115/1.4006683  0.738
2012 Tambat A, Lin HY, Subbarayan G, Jung DY, Sammakia B. Simulations of damage, crack initiation, and propagation in interlayer dielectric structures: Understanding assembly-induced fracture in dies Ieee Transactions On Device and Materials Reliability. 12: 241-254. DOI: 10.1109/Tdmr.2012.2195006  0.308
2012 Ibrahim M, Bhopte S, Sammakia B, Murray B, Iyengar M, Schmidt R. Effect of transient boundary conditions and detailed thermal modeling of data center rooms Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 300-310. DOI: 10.1109/Tcpmt.2011.2175926  0.803
2012 Alzoubi K, Hamasha MM, Wang L, Zhang H, Yin J, Luo J, Lu S, Sammakia B, Poliks M, Zhong CJ. Stability of interdigitated microelectrodes of flexible chemiresistor sensors Ieee/Osa Journal of Display Technology. 8: 377-384. DOI: 10.1109/Jdt.2012.2186953  0.553
2011 Alzoubi K, Hamasha MM, Schadt M, Lu S, Sammakia B, Poliks M. Effect of lamination on the bending fatigue life of copper coated PET substrate Proceedings of Spie - the International Society For Optical Engineering. 7956. DOI: 10.1117/12.874226  0.522
2011 Venkatadri V, Sammakia B, Srihari K, Santos D. A review of recent advances in thermal management in three dimensional chip stacks in electronic systems Journal of Electronic Packaging, Transactions of the Asme. 133. DOI: 10.1115/1.4005298  0.333
2011 Bhopte S, Sammakia B, Iyengar M, Schmidt R. Numerical and experimental study of the effect of underfloor blockages on data center performance Journal of Electronic Packaging, Transactions of the Asme. 133. DOI: 10.1115/1.4003603  0.753
2011 Alzoubi K, Lu S, Sammakia B, Poliks M. Experimental and analytical studies on the high cycle fatigue of thin film metal on PET substrate for flexible electronics applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 43-51. DOI: 10.1109/Tcpmt.2010.2100911  0.539
2011 Alzoubi K, Hamasha MM, Lu S, Sammakia B. Bending fatigue study of sputtered ITO on flexible substrate Ieee/Osa Journal of Display Technology. 7: 593-600. DOI: 10.1109/Jdt.2011.2151830  0.556
2011 Alzoubi K, Lu S, Sammakia B, Poliks M. Factor effect study for the high cyclic bending fatigue of thin films on PET substrate for flexible displays applications Ieee/Osa Journal of Display Technology. 7: 348-355. DOI: 10.1109/Jdt.2010.2076772  0.576
2011 Pisipati S, Geer J, Sammakia B, Murray BT. A novel alternate approach for multiscale thermal transport using diffusion in the Boltzmann Transport Equation International Journal of Heat and Mass Transfer. 54: 3406-3419. DOI: 10.1016/J.Ijheatmasstransfer.2011.03.046  0.724
2010 Farnam D, Sammakia B, Ghose K. Thermal design criteria for extraordinary performance of devices cooled by microchannel heat sink Journal of Thermal Science and Engineering Applications. 2. DOI: 10.1115/1.4002841  0.778
2010 Karajgikar S, Agonafer D, Ghose K, Sammakia B, Amon C, Refai-Ahmed G. Multi-objective optimization to improve both thermal and device performance of a nonuniformly powered micro-architecture Journal of Electronic Packaging, Transactions of the Asme. 132: 0210081-0210088. DOI: 10.1115/1.4001852  0.35
2010 Zhou F, Arunasalam P, Murray BT, Sammakia B. Modeling Heat Transport in Thermal Interface Materials Enhanced With MEMS-Based Microinterconnects Ieee Transactions On Components and Packaging Technologies. 33: 16-24. DOI: 10.1109/Tcapt.2009.2018834  0.487
2010 Gondipalli S, Ibrahim M, Bhopte S, Sammakia B, Murray B, Ghose K, Iyengar MK, Schmidt R. Numerical modeling of data center with transient boundary conditions 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501420  0.694
2010 Ibrahim M, Gondipalli S, Bhopte S, Sammakia B, Murray B, Ghose K, Iyengar MK, Schmidt R. Numerical modeling approach to dynamic data center cooling 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501335  0.699
2010 Bhopte S, Sammakia B, Murray B. Numerical study of a novel passive micromixer design 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501318  0.685
2010 Gondipalli S, Bhopte S, Sammakia B, Calmidi V. Numerical and experimental study of the effect of thermocouple wire attachment on thermal characterization of a high performance flip-chip package 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501260  0.757
2009 Kanuparthi S, Subbarayan G, Siegmund T, Sammakia B. The effect of polydispersivity on the thermal conductivity of particulate thermal interface materials Ieee Transactions On Components and Packaging Technologies. 32: 424-434. DOI: 10.1109/Tcapt.2008.2010502  0.327
2009 Farnam D, Sammakia B, Ackler H, Ghose K. Comparative analysis of microchannel heat sink configurations subject to a pressure constraint Heat Transfer Engineering. 30: 43-53. DOI: 10.1080/01457630802293324  0.781
2009 Kanuparthi S, Rayasam M, Subbarayan G, Sammakia B, Gowda A, Tonapi S. Hierarchical field compositions for simulations of near-percolation thermal transport in particulate materials Computer Methods in Applied Mechanics and Engineering. 198: 657-668. DOI: 10.1016/J.Cma.2008.10.001  0.332
2008 Bhopte S, Sammakia B, Murray B. Application of Split Flow Design Technique to Simple Microchannel Geometries for Enhanced Mixing Ieee Transactions On Biomedical Engineering. 19-20. DOI: 10.1115/Biomed2008-38096  0.719
2008 Kanuparthi S, Subbarayan G, Siegmund T, Sammakia B. An efficient network model for determining the effective thermal conductivity of particulate thermal interface materials Ieee Transactions On Components and Packaging Technologies. 31: 611-621. DOI: 10.1109/Tcapt.2008.2001839  0.367
2008 Garimella SV, Fleischer AS, Murthy JY, Keshavarzi A, Prasher R, Patel C, Bhavnani SH, Venkatasubramanian R, Mahajan R, Joshi Y, Sammakia B, Myers BA, Chorosinski L, Baelmans M, Sathyamurthy P, et al. Thermal challenges in next-generation electronic systems Ieee Transactions On Components and Packaging Technologies. 31: 801-815. DOI: 10.1109/Tcapt.2008.2001197  0.379
2008 Bhopte S, Sammakia B, Calmidi V. A study of the thermal characterization of a high - Performance flip chip package 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 302-309. DOI: 10.1109/ITHERM.2008.4544284  0.746
2007 Geer J, Desai A, Sammakia B. Heat Conduction in Multilayered Rectangular Domains Journal of Electronic Packaging. 129: 440-451. DOI: 10.1115/1.2804094  0.724
2007 Lin T, Menezes AS, Andros F, McBride DG, Lu S, Sammakia B. Assembly of Copper Column Interconnect Flip Chip Ieee Transactions On Electronics Packaging Manufacturing. 30: 206-212. DOI: 10.1109/Tepm.2007.899149  0.323
2007 Park S, Lee HC, Sammakia B, Raghunathan K. Predictive Model for Optimized Design Parameters in Flip-Chip Packages and Assemblies Ieee Transactions On Components and Packaging Technologies. 30: 294-301. DOI: 10.1109/Tcapt.2007.898363  0.392
2006 Bhopte S, Agonafer D, Schmidt R, Sammakia B. Optimization of data center room layout to minimize rack inlet air temperature Journal of Electronic Packaging, Transactions of the Asme. 128: 380-387. DOI: 10.1115/1.2356866  0.738
2006 Desai A, Mahajan S, Subbarayan G, Jones W, Geer J, Sammakia B. A numerical study of transport in a thermal interface material enhanced with carbon nanotubes Journal of Electronic Packaging, Transactions of the Asme. 128: 92-97. DOI: 10.1115/1.2161231  0.716
2006 Desai A, Geer J, Sammakia B. Models of Steady Heat Conduction in Multiple Cylindrical Domains Journal of Electronic Packaging. 128: 10-17. DOI: 10.1115/1.2159003  0.718
2002 Garimella SV, Joshi YK, Bar-Cohen A, Mahajan R, Toh KC, Carey VP, Baelmans M, Lohan J, Sammakia B, Andros F. Thermal challenges in next generation electronic systems- Summary of panel presentations and discussions Ieee Transactions On Components and Packaging Technologies. 25: 569-575. DOI: 10.1109/Tcapt.2003.809113  0.599
1998 Sathe S, Sammakia B. A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages Journal of Heat Transfer-Transactions of the Asme. 120: 830-839. DOI: 10.1115/1.2825902  0.443
1990 Khalillolahi A, Sammakia B. The Thermal Capacity Effect Upon Transient Natural Convection in a Rectangular Cavity Journal of Electronic Packaging. 112: 357-366. DOI: 10.1115/1.2904390  0.458
1988 Khalilollahi A, Sammakia B. Transient natural convection near a uniform flux surface with appreciable heat capacity International Communications in Heat and Mass Transfer. 15: 303-313. DOI: 10.1016/0735-1933(88)90031-0  0.423
1986 Khalilollahi A, Sammakia B. Unsteady Natural Convection Generated By A Heated Surface Within An Enclosure Numerical Heat Transfer Part a-Applications. 9: 715-730. DOI: 10.1080/10407798608552176  0.436
1985 Sammakia B, Carey VP, Gebhart B. Measurements and calculations of transient mixed convection in air International Journal of Heat and Mass Transfer. 28: 1837-1846. DOI: 10.1016/0017-9310(85)90206-6  0.739
1984 Sammakia B, Gebhart B. Transport adjacent to ice surfaces melting in saline water: visualization experiments International Communications in Heat and Mass Transfer. 11: 25-34. DOI: 10.1016/0735-1933(84)90027-7  0.621
1983 Gebhart B, Sammakia B, Audunson T. Melting characteristics of horizontal ice surfaces in cold saline water Journal of Geophysical Research. 88: 2935-2942. DOI: 10.1029/Jc088Ic05P02935  0.31
1983 Sammakia B, Gebhart B. Transport near a vertical ice surface melting in water of various salinity levels International Journal of Heat and Mass Transfer. 26: 1439-1452. DOI: 10.1016/S0017-9310(83)80045-3  0.633
1982 Sammakia B, Gebhart B, Qureshi ZH. Measurements and Calculations of Transient Natural Convection in Water Journal of Heat Transfer-Transactions of the Asme. 104: 644-648. DOI: 10.1115/1.3245180  0.68
1982 Sammakia B, Gebhart B, Carey VP. Transient mixed convection adjacent to a vertical flat surface International Journal of Heat and Mass Transfer. 25: 835-845. DOI: 10.1016/0017-9310(82)90096-5  0.753
1981 Sammakia B, Gebhart B. Transient Natural Convection Adjacent To A Vertical Flat Surface: The Thermal Capacity Effect Numerical Heat Transfer Part a-Applications. 4: 331-344. DOI: 10.1080/01495728108961796  0.696
1978 Sammakia B, Gebhart B. Transient And Steady-State Numerical Solutions In Natural Convection Numerical Heat Transfer Part a-Applications. 1: 529-542. DOI: 10.1080/10407797809412184  0.676
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