| Year |
Citation |
Score |
| 2018 |
Wen R, Xu S, Lee Y, Yang R. Capillary-driven liquid film boiling heat transfer on hybrid mesh wicking structures Nano Energy. 51: 373-382. DOI: 10.1016/J.Nanoen.2018.06.063 |
0.304 |
|
| 2016 |
Liew L, Lin C, Lewis R, Song S, Li Q, Yang R, Lee YC. Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology Journal of Electronic Packaging. 139. DOI: 10.1115/1.4035241 |
0.334 |
|
| 2015 |
Lewis R, Liew L, Xu S, Lee Y, Yang R. Microfabricated ultra-thin all-polymer thermal ground planes Science Bulletin. 60: 701-706. DOI: 10.1007/S11434-015-0760-9 |
0.309 |
|
| 2014 |
Wang Y, Lewis R, Radebaugh R, Lin MM, Bright VM, Lee Y. A Monolithic Polyimide Micro Cryogenic Cooler: Design, Fabrication, and Test Journal of Microelectromechanical Systems. 23: 934-943. DOI: 10.1109/Jmems.2014.2301631 |
0.309 |
|
| 2013 |
Oshman C, Li Q, Liew LA, Yang R, Bright VM, Lee YC. Flat flexible polymer heat pipes Journal of Micromechanics and Microengineering. 23. DOI: 10.1088/0960-1317/23/1/015001 |
0.314 |
|
| 2012 |
Kong M, Jeon S, Hwang C, Lee YC. Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly Journal of Electronic Packaging. 134: 21002. DOI: 10.1115/1.4006513 |
0.399 |
|
| 2012 |
Oshman C, Li Q, Liew LA, Yang R, Lee YC, Bright VM, Sharar DJ, Jankowski NR, Morgan BC. Thermal performance of a flat polymer heat pipe heat spreader under high acceleration Journal of Micromechanics and Microengineering. 22. DOI: 10.1088/0960-1317/22/4/045018 |
0.3 |
|
| 2011 |
Kong M, Jeon S, Au H, Hwang C, Lee Y. Development and Experimental Validation of a 3-D Solder Self-Alignment Model for Alignment Accuracy Prediction of Flip-Chip Assembly Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1523-1532. DOI: 10.1109/Tcpmt.2011.2162837 |
0.42 |
|
| 2011 |
Oshman C, Shi B, Li C, Yang R, Lee YC, Peterson GP, Bright VM. The development of polymer-based flat heat pipes Journal of Microelectromechanical Systems. 20: 410-417. DOI: 10.1109/Jmems.2011.2107885 |
0.306 |
|
| 2009 |
Chiou JA, Lee YC, Kurabayashi K, Candler RN. Foreword special section on packaging for micro/nano-scale systems Ieee Transactions On Advanced Packaging. 32: 399-401. DOI: 10.1109/Tadvp.2009.2021387 |
0.303 |
|
| 2004 |
Tien AC, Lin MH, Su LJ, Hong YR, Cheng TS, Lee YC, Lin WJ, Still IH, Huang CY. Identification of the substrates and interaction proteins of aurora kinases from a protein-protein interaction model. Molecular & Cellular Proteomics : McP. 3: 93-104. PMID 14602875 DOI: 10.1074/mcp.M300072-MCP200 |
0.376 |
|
| 2003 |
Faheem FF, Gupta KC, Lee YC. Flip-chip assembly and liquid crystal polymer encapsulation for variable MEMS capacitors Ieee Transactions On Microwave Theory and Techniques. 51: 2562-2567. DOI: 10.1109/Tmtt.2003.819778 |
0.314 |
|
| 2003 |
Lee YC, Parviz BA, Chiou JA, Chen S. Packaging for Microelectromechanical and Nanoelectromechanical Systems Ieee Transactions On Advanced Packaging. 26: 217-226. DOI: 10.1109/Tadvp.2003.817973 |
0.301 |
|
| 2003 |
Ma Z, Bradley E, Peacock T, Hertzberg JR, Lee YC. Solder-Assembled Large MEMS Flaps for Fluid Mixing Ieee Transactions On Advanced Packaging. 26: 268-276. DOI: 10.1109/Tadvp.2003.817966 |
0.312 |
|
| 2003 |
Lee Y, Chiou J, Chen S, Jung E. Foreword Special issue on mems/nems packaging Ieee Transactions On Advanced Packaging. 26: 215-216. DOI: 10.1109/Tadvp.2003.817823 |
0.309 |
|
| 2000 |
Harsh KF, Su B, Zhang W, Bright VM, Lee YC. Realization and design considerations of a flip-chip integrated MEMS tunable capacitor Sensors and Actuators, a: Physical. 80: 108-118. DOI: 10.1016/S0924-4247(99)00255-1 |
0.316 |
|
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