Duo Li, Ph.D. - Publications

Affiliations: 
2010 Electrical Engineering University of California, Riverside, Riverside, CA, United States 
Area:
Electronics and Electrical Engineering

7 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2013 Wang H, Tan SX, Li D, Gupta A, Yuan Y. Composable thermal modeling and simulation for architecture-level thermal designs of multicore microprocessors Acm Transactions On Design Automation of Electronic Systems. 18: 1-27. DOI: 10.1145/2442087.2442099  0.636
2012 Eguia TJ, Tan SX, Shen R, Li D, Pacheco EH, Tirumala M, Wang L. General Parameterized Thermal Modeling for High-Performance Microprocessor Design Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 20: 211-224. DOI: 10.1109/Tvlsi.2010.2098054  0.425
2010 Li D, Tan SX, Pacheco EH, Tirumala M. Parameterized architecture-level dynamic thermal models for multicore microprocessors Acm Transactions On Design Automation of Electronic Systems. 15: 1-22. DOI: 10.1145/1698759.1698766  0.636
2010 Li D, Tan SXD, Mi N, Cai Y. Efficient power grid integrity analysis using on-the-fly error check and reduction Proceedings of the Asia and South Pacific Design Automation Conference, Asp-Dac. 763-768. DOI: 10.1109/ASPDAC.2010.5419788  0.5
2010 Li D, Tan SX. Statistical analysis of large on-chip power grid networks by variational reduction scheme Integration. 43: 167-175. DOI: 10.1016/J.Vlsi.2010.01.004  0.314
2009 Li D, Tan SX-, Pacheco EH, Tirumala M. Architecture-Level Thermal Characterization for Multicore Microprocessors Ieee Transactions On Very Large Scale Integration Systems. 17: 1495-1507. DOI: 10.1109/Tvlsi.2008.2005193  0.415
2009 Li D, Tan SX, Wu L. Hierarchical Krylov subspace based reduction of large interconnects Integration. 42: 193-202. DOI: 10.1016/J.Vlsi.2008.06.004  0.342
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