Ming Kong, Ph.D. - Publications
Affiliations: | 2012 | Mechanical Engineering | University of Colorado, Boulder, Boulder, CO, United States |
Area:
Mechanical EngineeringYear | Citation | Score | |||
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2011 | Kong M, Jeon S, Au H, Hwang C, Lee Y. Development and Experimental Validation of a 3-D Solder Self-Alignment Model for Alignment Accuracy Prediction of Flip-Chip Assembly Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1523-1532. DOI: 10.1109/Tcpmt.2011.2162837 | 0.301 | |||
2007 | Kong M, Dai J, Lao J, Li G. Crystallization of amorphous SiC and superhardness effect in TiN/SiC nanomultilayers Applied Surface Science. 253: 4734-4739. DOI: 10.1016/J.Apsusc.2006.10.050 | 0.301 | |||
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