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Huiyang Fei, Ph.D. - Publications

Affiliations: 
2011 Mechanical Engineering Arizona State University, Tempe, AZ, United States 
Area:
Mechanical Engineering, Materials Science Engineering, Electronics and Electrical Engineering
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7 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2014 Yazzie KE, Fei H, Jiang H, Chawla N. Corrigendum to “Rate-dependent behavior of Sn alloy–Cu couples: Effects of microstructure and composition on mechanical shock resistance” [Acta Mater. 60 (2012) 4336–4348] Acta Materialia. 72: 262. DOI: 10.1016/J.Actamat.2014.03.056  0.506
2012 Fei H, Abraham A, Chawla N, Jiang H. Evaluation of micro-pillar compression tests for accurate determination of elastic-plastic constitutive relations Journal of Applied Mechanics, Transactions Asme. 79. DOI: 10.1115/1.4006767  0.579
2012 Fei H, Yazzie K, Chawla N, Jiang H. Modeling fracture of sn-rich (Pb-Free) solder joints under mechanical shock conditions Journal of Electronic Materials. 41: 2089-2099. DOI: 10.1007/S11664-012-2079-5  0.684
2012 Fei H, Yazzie K, Chawla N, Jiang H. The effect of random voids in the modified Gurson model Journal of Electronic Materials. 41: 177-183. DOI: 10.1007/S11664-011-1816-5  0.687
2011 Fei H, Yazzie K, Williams J, Chawla N, Jiang H. Multiscale modeling of the interfacial fracture behavior in the Sn-Cu 6 Sn 5-Cu system Journal of Computational and Theoretical Nanoscience. 8: 873-880. DOI: 10.1166/Jctn.2011.1767  0.675
2009 Fei H, Jiang H, Khang DY. Nonsinusoidal buckling of thin gold films on elastomeric substrates Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 27. DOI: 10.1116/1.3089244  0.306
2009 Yazzie KE, Fei H, Williams JJ, Jiang H, Chawla N. Mechanical shock behavior of bulk pure Sn solder Journal of Electronic Materials. 38: 2746-2755. DOI: 10.1007/S11664-009-0889-X  0.688
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